Abstract: Apparatus for the bonding of electrical precious metal contacts to the conductor terminations of printed wiring circuit boards. Featured is a rotatable wheel mechanism which, while it is loaded with a contact stock segment at one point on its periphery, at the same time deposits and bonds a previously loaded contact segment to a printed wiring board at an opposite point on its periphery. The wheel incorporates an internally mounted, radially aligned plunger having a magnet at each of its outer ends. With the plunger aligned vertically, the wheel is loaded at the top from a reel-fed supply of contact stock, a segment of which is sheared off by a downward movement of a punch blade which also deposits the severed contact segment on the upper magnet where it is retained by magnetic flux acting on a nickel layer of the segment. The punch continues its downward travel to deposit a previously loaded segment retained by the lower magnet to its ultimate location on the wiring board.

Abstract: Apparatus for determining the presence, quantity, size, and location of corrosion causing pores and insulating films on metallic platings is described herein. With the plating acting as an anode, a coordinate array of electrochemical cells is formed by placing an electrolytic film on the plating and sequentially energizing a coordinate array of cathode conductors in the film. A digital voltmeter is connected to the plating anode and registers varying potentials as the cathode conductors are energized depending upon the presence, etc., of pores in and films on the plating. Information derived from the voltmeter output controls a printer, in one embodiment, to record the sequential output information. Correlation of the recorded information with the sequence in which the cathode conductors are energized indicates the location of the undesirable plating surface conditions.