Patents by Inventor THOMAS GERJEN HENDRIK KOUWEN

THOMAS GERJEN HENDRIK KOUWEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11898920
    Abstract: A connector for use with a sensor, such as a pressure sensor, has EMI absorbing capabilities. The connector includes a polymeric body configured for coupling to a sensor body and an EMI absorbing material. The EMI absorbing material may be entrained in the polymeric body, coated on the polymeric body, or otherwise integrated with the polymeric body. The EMI absorbing material may be carbon black or carbon nanotubes.
    Type: Grant
    Filed: May 10, 2022
    Date of Patent: February 13, 2024
    Assignee: Sensata Technologies, Inc.
    Inventors: Engbertus Berkel, Thomas Gerjen Hendrik Kouwen, Jonathan M. Rigelsford
  • Publication number: 20230366764
    Abstract: A connector for use with a sensor, such as a pressure sensor, has EMI absorbing capabilities. The connector includes a polymeric body configured for coupling to a sensor body and an EMI absorbing material. The EMI absorbing material may be entrained in the polymeric body, coated on the polymeric body, or otherwise integrated with the polymeric body. The EMI absorbing material may be carbon black or carbon nanotubes.
    Type: Application
    Filed: May 10, 2022
    Publication date: November 16, 2023
    Inventors: Engbertus Berkel, Thomas Gerjen Hendrik Kouwen, Jonathan M. Rigelsford
  • Publication number: 20230085965
    Abstract: In a particular embodiment, a force sensor apparatus is disclosed that includes a sensor housing and a sensing assembly. In this particular embodiment, the sensing assembly includes a force-compliant element having a center portion and an outer portion; one or more sensing elements coupled to the center portion of the force-compliant element; and a flexible spring element having an outer diameter and a center portion. According to at least one embodiment of the present disclosure, the flexible spring element curves from the outer diameter to the center portion of the flexible spring element and the center portion of the flexible spring element is aligned with the center portion of the force-compliant element. In this embodiment, the outer diameter is separated from a ledge of the outer portion of the force-compliant element by a space.
    Type: Application
    Filed: January 28, 2021
    Publication date: March 23, 2023
    Inventors: FRANK H. JACOBS, MAARTEN P. VAN NOORDEN, BART GOEDEGEBUURE, EDWARD H. BERNHARDI, THOMAS GERJEN HENDRIK KOUWEN
  • Patent number: 11454555
    Abstract: In a particular embodiment, a force sensor apparatus is disclosed that includes a force-compliant element that deforms in response to forces applied to the force sensor apparatus. The apparatus also includes a sensing element coupled to the force-compliant element and is configured to generate a signal indicating the degree that the force-compliant element deforms in response to the applications of forces to the force sensor apparatus. In this embodiment, the apparatus also includes a printed circuit board configured to receive the signal from the sensing element and a support structure having a surface on which the printed circuit board is coupled. The support structure has an outer rim that is attached to the force-compliant element. The apparatus also includes a sensor housing that covers the printed circuit board. The sensor housing has an outer rim attached to the force-compliant element.
    Type: Grant
    Filed: January 16, 2020
    Date of Patent: September 27, 2022
    Assignee: SENSATA TECHNOLOGIES, INC.
    Inventors: Laurens C. Fortgens, Jan-Willem Sloetjes, Edwin Vonk, Ruben Auer, Thomas Gerjen Hendrik Kouwen, Cristobal Ruiz Zwollo
  • Publication number: 20210223120
    Abstract: In a particular embodiment, a force sensor apparatus is disclosed that includes a force-compliant element that deforms in response to forces applied to the force sensor apparatus. The apparatus also includes a sensing element coupled to the force-compliant element and is configured to generate a signal indicating the degree that the force-compliant element deforms in response to the applications of forces to the force sensor apparatus. In this embodiment, the apparatus also includes a printed circuit board configured to receive the signal from the sensing element and a support structure having a surface on which the printed circuit board is coupled. The support structure has an outer rim that is attached to the force-compliant element. The apparatus also includes a sensor housing that covers the printed circuit board. The sensor housing has an outer rim attached to the force-compliant element.
    Type: Application
    Filed: January 16, 2020
    Publication date: July 22, 2021
    Inventors: LAURENS C. FORTGENS, JAN-WILLEM SLOETJES, EDWIN VONK, RUBEN AUER, THOMAS GERJEN HENDRIK KOUWEN, CRISTOBAL RUIZ ZWOLLO