Abstract: A coil for a transformer core comprises a longitudinal axis, at least one multi-stranded conductor, at least one first conductor turn wound around the longitudinal axis, at least one second conductor turn wound around the longitudinal axis, the at least one first conductor turn being adjacent the at least one second conductor turn. Each of the at least one first and second conductor turns is provided with an electrically insulating member which extends about part but not an entire cross-sectional perimeter of the respective conductor turn, such that the at least one first and second conductor turns are insulated against each other. The electrically insulating member does not extend the entire cross-sectional perimeter of the respective conductor turn.

Abstract: A method for producing a coil for a transformer, in particular for a medium frequency transformer for a resonant DC/DC converter or a dual active bridge DC/DC converter, is disclosed which: providing a plurality of M>1 conductive foil strips, each having a first ending and a second ending; stacking the plurality of conductive foil strips to obtain a foil strip stack having a first ending and a second ending, wherein an electrically insulating layer is provided between any two adjacent foil strips; electrically interconnecting the first endings of all conductive foil strips to a first terminal; for each of the conductive foil strips providing a connector at the second ending of the foil strip; and coiling up the foil strip stack from the first end.

Abstract: A dual active bridge DC/DC converter in accordance with the invention comprises a first DC link, preferably comprising a first DC link capacitor; a converter bridge connected to the first DC link; a transformer, preferably a medium frequency transformer, having a primary side and a secondary side; the primary side of the transformer comprising a plurality of M>1 primary windings, each of the plurality of primary windings having a first and a second terminal; wherein the dual active bridge DC/DC converter further comprises a first plurality of M energy transfer inductors; and wherein for each of the M primary windings, a different one from the first plurality of energy transfer inductors is connected between said primary winding bridge and the converter bridge.

Abstract: A power converter including a semiconductor module having a base plate and a cooling housing. The cooling housing includes a receptacle plate and a cover. The receptacle plate has an opening. The receptacle plate is connected to the base plate of the semiconductor module around the opening. The cover is connected to the receptacle plate along a closure path around the opening, and either the receptacle plate or the cover is formed as a stamped or deep-drawn plate.

Abstract: An electric power converter device includes a first power semiconductor module and a frame for a closed cooler. The first power semiconductor module includes a first base plate having a first main side, a second main side opposite the first main side and a lateral side surface extending along a circumferential edge of the first base plate and connecting the first and the second main side. The frame is attached to the second main side of the first base plate. The first base plate has a first step on the second main side along the circumferential edge of the first base plate to form a first recess along the circumferential edge of the first base plate, in which first recess a first portion of the frame is received.

Abstract: A converter including a semiconductor module and a cooling housing. The semiconductor module includes a semiconductor chip, a substrate having a first side and a second side, a base plate having a first side and a second side, and a molding compound. The semiconductor chip connects to the first side of the substrate. The second side of the substrate connects to the first side of the base plate, the second side of the base plate has a first region and a second region. The first region has a surface expansion, and the first region having the surface expansion contacts with a coolant liquid in an operating state. The second region forms a closed path around the first region, the cooling housing has a plate including at least one hole, and the plate is connected around the hole to the second region of the base plate by welding.

Abstract: A transformer includes a first winding arranged around an axis, and a second winding arranged around the axis. The second winding includes a litz wire having an end portion located at an axial end position of the second winding and a middle portion located at an axial middle position of the second winding. The litz wire has a first cross section at the end portion and a second cross section at the middle portion, the cross sections each including in a quadrant between the axial outward direction and the direction pointing towards the first winding a curvature extending between the axial outward direction and the direction pointing towards the first winding. The curvature of the first cross section is smaller than the curvature of the second cross section thereby reducing the peak magnitude of the electrical field between the end portion of the second winding and the first winding.

Abstract: A transformer includes a transformer core having a first core leg having a first longitudinal axis and second core leg having a second longitudinal axis; a first low voltage (LV) winding arranged around the first core leg, a first high voltage (HV) winding arranged around the first LV winding; a second low voltage (LV) winding arranged around the second core leg; and a second high voltage winding arranged around the second LV winding, wherein the first HV winding is provided with a first HV connector and a second HV connector each extending substantially perpendicular away from the first longitudinal axis, and wherein the second HV winding is provided with a third HV connector and a fourth HV connector each extending substantially perpendicular away from the second longitudinal axis.

Abstract: A semiconductor component, including a support frame and at least one semiconductor module attached to the support frame, wherein the support frame includes a respective passage (on the edge of which a base plate of the semiconductor module rests, wherein the base plate is soldered to the support frame.

Abstract: An arrangement for subsea cooling of a semiconductor module. The arrangement includes a tank. The tank is filled with a dielectric fluid. The arrangement includes at least one semiconductor module. The at least one semiconductor module is placed in the tank. Each at least one semiconductor module includes semiconductor submodules and is attached to a heat sink. The semiconductor submodules generate heat, thereby causing the dielectric fluid to circulate by natural convection. The heat sink includes a first part having a first thermal resistance from the semiconductor module to the dielectric fluid. The heat sink includes a second part having a second thermal resistance from the semiconductor module to the dielectric fluid. The second thermal resistance is higher than the first thermal resistance. The heat sink is oriented such that, when the arrangement is installed, the first part is configured to lie vertically higher than the second part.

Abstract: A cooling element includes a first surface for receiving an electric component, and a second surface which is provided with fins for forwarding a heat load received from the electric component via the first surface to surroundings. One or more of the fins are provided with a respective flow channel for passing a fluid within each respective fin, to provide efficient cooling.

Abstract: An exemplary power electronics module includes a first power electronics element that generates a first heat flow during operation of the power electronics module, a second power electronics element that generates a second heat flow during operation of the power electronics module. The first cooler is in thermal contact with the first power electronics element to receive at least part of the first heat flow. The second cooler is in thermal contact with the second power electronics element to receive at least part of the second heat flow. A heat exchanger is configured to transmit at least part of the first heat flow and the second heat flow to a primary cooling flow and transfer heat flow in a thermally efficient manner. A magnitude of the heat flow is less than a total magnitude that is formed from a maximum first heat flow and a maximum second heat flow.

Abstract: Exemplary embodiments are directed to a cooling apparatus for cooling a power electronic device, the apparatus including at least one panel that is adapted to be thermally connected to a heat source in order to receive heat from the heat source. The panel is also adapted to be thermally in contact with an air flow in order to transfer heat from the panel. The panel includes at least one hole between a first side of the panel and a second side of the panel. The hole is adapted to attenuate a vibrating air pressure generated by an acoustic noise source and carried by the air.