Abstract: A power module includes a power semiconductor module having a semiconductor chip arranged on a substrate. A lead frame is arranged in electrical contact with the semiconductor chip. Abase plate includes cooling structures and micro channels that are connected to an inlet port and an outlet port. A bond layer connects the power semiconductor module and the base plate. A mold compound is arranged on the power semiconductor module, the bond layer and the base plate. The bond layer is encapsulated completely by the power semiconductor module, the base plate and the mold compound and the lead frame is arranged at least partially within the mold compound.

Abstract: A coil for a transformer core comprises a longitudinal axis, at least one multi-stranded conductor, at least one first conductor turn wound around the longitudinal axis, at least one second conductor turn wound around the longitudinal axis, the at least one first conductor turn being adjacent the at least one second conductor turn. Each of the at least one first and second conductor turns is provided with an electrically insulating member which extends about part but not an entire cross-sectional perimeter of the respective conductor turn, such that the at least one first and second conductor turns are insulated against each other. The electrically insulating member does not extend the entire cross-sectional perimeter of the respective conductor turn.

Abstract: A semiconductor component, including a support frame and at least one semiconductor module attached to the support frame, wherein the support frame includes a respective passage (on the edge of which a base plate of the semiconductor module rests, wherein the base plate is soldered to the support frame.

Abstract: A subsea power module including: a tank having a tank wall provided with an outwardly protruding corrugation, a power device arranged in the tank, a dielectric liquid which fills the tank, for cooling the power device, a pump configured to circulate the dielectric liquid in the tank, wherein the pump has a pump inlet and a pump outlet, a duct arranged in the corrugation such that a chamber is formed between a tip of the corrugation and the duct, wherein the duct has a duct inlet connected to the pump outlet, and wherein the duct is provided with at least one duct outlet opening into the chamber, and a distancing structure configured to space apart an outer surface of the duct facing the tank wall and the tank wall in the corrugation, whereby gaps are formed between the duct and the tank wall in the corrugation, enabling dielectric liquid that has been discharged through the at least one duct outlet into the chamber to be squeezed out from the chamber and the corrugation, and flow towards the pump inlet.

Abstract: A subsea power module including: a tank having a tank wall provided with an outwardly protruding corrugation, a power device arranged in the tank, a dielectric liquid which fills the tank, for cooling the power device, a pump configured to circulate the dielectric liquid in the tank, wherein the pump has a pump inlet and a pump outlet, a duct arranged in the corrugation such that a chamber is formed between a tip of the corrugation and the duct, wherein the duct has a duct inlet connected to the pump outlet, and wherein the duct is provided with at least one duct outlet opening into the chamber, and a distancing structure configured to space apart an outer surface of the duct facing the tank wall and the tank wall in the corrugation, whereby gaps are formed between the duct and the tank wall in the corrugation, enabling dielectric liquid that has been discharged through the at least one duct outlet into the chamber to be squeezed out from the chamber and the corrugation, and flow towards the pump inlet.

Abstract: One embodiment provides a method of providing a power semiconductor module with a cooler. A power semiconductor module includes a substrate having a first substrate side for carrying at least one electric circuit and having a second substrate side being located opposite to the first substrate side. The second substrate side is connected to a first baseplate side and the baseplate also includes a second baseplate side being located opposite to its first baseplate side and being adapted for coming in contact with the cooler. The cooler includes a first casing component and a second casing component. The baseplate side is equipped with a cooling area that is surrounded by a connecting area.

Abstract: A transformer is provided, which includes a tank having an enclosed volume with an insulating material, the tank including at least one channel extending through the tank, wherein the interior of the at least one channel is separated from the enclosed volume of the tank by a channel wall. A transformer core is provided outside of the enclosed volume, including at least one core leg extending through the tank via the at least one channel. At least one coil is located inside the enclosed volume, the coil being wound about the at least one channel, the tank has an inner wall or outer wall including a weakly-conductive layer, which includes fibers embedded in an impregnating material.

Abstract: A method for producing a coil for a transformer, in particular for a medium frequency transformer for a resonant DC/DC converter or a dual active bridge DC/DC converter, is disclosed which: providing a plurality of M>1 conductive foil strips, each having a first ending and a second ending; stacking the plurality of conductive foil strips to obtain a foil strip stack having a first ending and a second ending, wherein an electrically insulating layer is provided between any two adjacent foil strips; electrically interconnecting the first endings of all conductive foil strips to a first terminal; for each of the conductive foil strips providing a connector at the second ending of the foil strip; and coiling up the foil strip stack from the first end.

Abstract: Transformer assembly including a first transformer stage having a plurality of first-stage transformer cells; and a second transformer stage. An input of the second transformer stage is connected to an output of the first transformer stage. A lightning impulse breakdown voltage of a transformer cell of the second stage is at least double of a lightning impulse breakdown voltage of transformer cells of the first stage.

Abstract: A heat exchanging arrangement for a subsea electronic system, the heat exchanging arrangement including a wall section; a corrugation formed in the wall section, the corrugation having two generally opposing internal corrugation surfaces; and at least one heat exchanging element forced against at least one of the internal corrugation surfaces. A subsea electronic system including a heat exchanging arrangement is also provided.

Abstract: A dual active bridge DC/DC converter in accordance with the invention comprises a first DC link, preferably comprising a first DC link capacitor; a converter bridge connected to the first DC link; a transformer, preferably a medium frequency transformer, having a primary side and a secondary side; the primary side of the transformer comprising a plurality of M>1 primary windings, each of the plurality of primary windings having a first and a second terminal; wherein the dual active bridge DC/DC converter further comprises a first plurality of M energy transfer inductors; and wherein for each of the M primary windings, a different one from the first plurality of energy transfer inductors is connected between said primary winding bridge and the converter bridge.

Abstract: An apparatus includes a baseplate and a cooler providing a cooling channel adapted for providing a coolant flow. An electronic circuit includes a power semiconductor device disposed at the first side of baseplate. A footprint of the power semiconductor device defines a device area on the first side. A cooling area at the second side of the baseplate opposite the device area is adapted for dissipating heat from the baseplate by bringing the cooling area into thermal contact with the coolant flow in the cooling channel. An auxiliary area is located on the second side of the baseplate adjacent to the cooling area. The auxiliary area includes a flow guide for reducing a flow rate of the coolant flow in the auxiliary area and the cooling channel is adapted to receive the cooling area and the flow guide.

Abstract: A heat exchanging arrangement for a subsea electronic system, the heat exchanging arrangement including: at least one pipe having an external surface; and at least one heat exchanging element arranged inside the at least one pipe and defining at least one internal passage for conducting a dielectric fluid through the at least one pipe; wherein the at least one heat exchanging element is arranged to press laterally outwards against an internal surface of the at least one pipe to establish a heat transfer bond between the at least one heat exchanging element and the at least one pipe. A subsea electronic system including the heat exchanging arrangement is also provided.

Abstract: In one embodiment a power semiconductor module includes a substrate having a first substrate side for carrying an electric circuit and having a second substrate side being located opposite to the first substrate side. The second substrate side has a flat surface and is adapted for coming in contact with a cooler. A cooling area that is surrounded by a connecting area is located at the second substrate side. A first casing component of the cooler is connected to the second substrate side at the connecting area and a second casing component is connected to the first casing component such that a cooling channel for providing the cooling area with cooling fluid is provided between the first casing component and the second casing component. A cooling structure can be welded to the cooling area at the second substrate side.

Abstract: One embodiment provides a method of providing a power semiconductor module with a cooler. A power semiconductor module includes a substrate having a first substrate side for carrying at least one electric circuit and having a second substrate side being located opposite to the first substrate side. The second substrate side is connected to a first baseplate side and the baseplate also includes a second baseplate side being located opposite to its first baseplate side and being adapted for coming in contact with the cooler. The cooler includes a first casing component and a second casing component. The baseplate side is equipped with a cooling area that is surrounded by a connecting area.

Abstract: A power converter including a semiconductor module having a base plate and a cooling housing. The cooling housing includes a receptacle plate and a cover. The receptacle plate has an opening. The receptacle plate is connected to the base plate of the semiconductor module around the opening. The cover is connected to the receptacle plate along a closure path around the opening, and either the receptacle plate or the cover is formed as a stamped or deep-drawn plate.

Abstract: An electric power converter device includes a first power semiconductor module and a frame for a closed cooler. The first power semiconductor module includes a first base plate having a first main side, a second main side opposite the first main side and a lateral side surface extending along a circumferential edge of the first base plate and connecting the first and the second main side. The frame is attached to the second main side of the first base plate. The first base plate has a first step on the second main side along the circumferential edge of the first base plate to form a first recess along the circumferential edge of the first base plate, in which first recess a first portion of the frame is received.

Abstract: A converter including a semiconductor module and a cooling housing. The semiconductor module includes a semiconductor chip, a substrate having a first side and a second side, a base plate having a first side and a second side, and a molding compound. The semiconductor chip connects to the first side of the substrate. The second side of the substrate connects to the first side of the base plate, the second side of the base plate has a first region and a second region. The first region has a surface expansion, and the first region having the surface expansion contacts with a coolant liquid in an operating state. The second region forms a closed path around the first region, the cooling housing has a plate including at least one hole, and the plate is connected around the hole to the second region of the base plate by welding.

Abstract: A transformer includes a first winding arranged around an axis, and a second winding arranged around the axis. The second winding includes a litz wire having an end portion located at an axial end position of the second winding and a middle portion located at an axial middle position of the second winding. The litz wire has a first cross section at the end portion and a second cross section at the middle portion, the cross sections each including in a quadrant between the axial outward direction and the direction pointing towards the first winding a curvature extending between the axial outward direction and the direction pointing towards the first winding. The curvature of the first cross section is smaller than the curvature of the second cross section thereby reducing the peak magnitude of the electrical field between the end portion of the second winding and the first winding.

Abstract: A transformer includes a transformer core having a first core leg having a first longitudinal axis and second core leg having a second longitudinal axis; a first low voltage (LV) winding arranged around the first core leg, a first high voltage (HV) winding arranged around the first LV winding; a second low voltage (LV) winding arranged around the second core leg; and a second high voltage winding arranged around the second LV winding, wherein the first HV winding is provided with a first HV connector and a second HV connector each extending substantially perpendicular away from the first longitudinal axis, and wherein the second HV winding is provided with a third HV connector and a fourth HV connector each extending substantially perpendicular away from the second longitudinal axis.