Patents by Inventor Thomas Gredig

Thomas Gredig has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8384409
    Abstract: An embodiment of the invention is an organic thin film transistor chemical sensor. The sensor includes a substrate. A gate electrode is isolated from drain and source electrodes by gate dielectric. An organic ultra-thin semiconductor thin film is arranged with respect to the gate, source and drain electrodes to act as a conduction channel in response to appropriate gate, source and drain potentials. The organic ultra-thin film is permeable to a chemical analyte of interest and consists of one or a few atomic or molecular monolayers of material. An example sensor array system includes a plurality of sensors of the invention. In a preferred embodiment, a sensor chip having a plurality of sensors is mounted in a socket, for example by wire bonding. The socket provides thermal and electrical interference isolation for the sensor chip from associated sensing circuitry that is mounted on a common substrate, such as a PCB (printed circuit board).
    Type: Grant
    Filed: May 5, 2008
    Date of Patent: February 26, 2013
    Assignee: The Regents of the University of California
    Inventors: Andrew C. Kummel, Dengliang Yang, William C. Trogler, Thomas Gredig
  • Publication number: 20100176837
    Abstract: An embodiment of the invention is an organic thin film transistor chemical sensor. The sensor includes a substrate. A gate electrode is isolated from drain and source electrodes by gate dielectric. An organic ultra-thin semiconductor thin film is arranged with respect to the gate, source and drain electrodes to act as a conduction channel in response to appropriate gate, source and drain potentials. The organic ultra-thin film is permeable to a chemical analyte of interest and consists of one or a few atomic or molecular monolayers of material. An example sensor array system includes a plurality of sensors of the invention. In a preferred embodiment, a sensor chip having a plurality of sensors is mounted in a socket, for example by wire bonding. The socket provides thermal and electrical interference isolation for the sensor chip from associated sensing circuitry that is mounted on a common substrate, such as a PCB (printed circuit board).
    Type: Application
    Filed: May 5, 2008
    Publication date: July 15, 2010
    Applicant: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
    Inventors: Andrew C. Kummel, Dengliang Yang, William C. Trogler, Thomas Gredig