Abstract: This disclosure describes, in part, techniques for provisioning components. For instance, a component may be initially provisioned by a first system. To initially provision the component, the component may receive first data representing a uniform device type, a device identifier, a serial number, and/or a first certificate chain. The component may then store the first data in memory. Additionally, the component may be provisioned using a second system. To provision the component, the component may receive second data representing a product device type, a code, and a second certification chain. The second data received during the second provisioning may be associated with one more capabilities of a device. The component may then store the second data in the memory.

Abstract: This disclosure describes, in part, techniques for provisioning components. For instance, a component may be initially provisioned by a first system. To initially provision the component, the component may receive first data representing a uniform device type, a device identifier, a serial number, and/or a first certificate chain. The component may then store the first data in memory. Additionally, the component may be provisioned using a second system. To provision the component, the component may receive second data representing a product device type, a code, and a second certification chain. The second data received during the second provisioning may be associated with one more capabilities of a device. The component may then store the second data in the memory.