Abstract: In a method for checking semiconductor wafers and apparatuses for carrying out the method, a lacquer layer applied on a semiconductor wafer is checked. Initially, regions which are to be excluded from the check and surfaces which are to be checked, are ascertained. The checking is effected by direct illumination in such a way that the lacquer layer reflects light. The resulting values of the reflectance are determined and buffer-stored. A determination is performed for each surface as to whether or not it is to be accepted or rejected, in accordance with a predetermined evaluation criterion.

Abstract: One embodiment of an apparatus for checking semiconductor wafers includes a receiver for a semiconductor wafer to be checked. A light illuminates the wafer. A hemispherical hood has a surface and a hemispherical region defining an interior inside the hemispherical region. A further hood is disposed in the vicinity of the light. A camera is disposed at the hemispherical hood and has a lens looking into the interior inside the hemispherical hood. A evaluator is connected to the camera for controlling the camera and receiving, buffer-storing, processing and outputing data transmitted by the camera. Another embodiment includes a first light directly illuminates the wafer with light of a first color and a second light indirectly illuminates the wafer with light of a second color being complementary to the first color. A surface of the hood is of the second color.