Patents by Inventor Thomas Grieshofer

Thomas Grieshofer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9275324
    Abstract: In various embodiments, a booster antenna structure for a chip card is provided, wherein the booster antenna structure may include a booster antenna; and an additional electrically conductive structure connected to the booster antenna.
    Type: Grant
    Filed: December 13, 2012
    Date of Patent: March 1, 2016
    Assignee: INFINEON TECHNOLOGIES AG
    Inventors: Thomas Grieshofer, Stephan Rampetzreiter, Andreas Woerle
  • Patent number: 8833668
    Abstract: In various embodiments, a chip card contact array arrangement is provided, having a carrier, a plurality of contact arrays which are arranged on a first side of the carrier, an electrically conductive structure which is arranged on a second side of the carrier, which is arranged opposite the first side of the carrier, a first plated-through hole and a second plated-through hole, wherein the first plated-through hole is coupled to the electrically conductive structure, a connecting structure which is arranged on the first side of the carrier, wherein the connecting structure connects the first plated-through hole to the second plated-through hole, the connecting structure having a longitudinal extent which runs parallel to a direction in which a contact-connection device on a reading device is moved relative to the plurality of contacts.
    Type: Grant
    Filed: December 12, 2012
    Date of Patent: September 16, 2014
    Assignee: Infineon Technologies AG
    Inventors: Thomas Grieshofer, Peter Raggam, Andreas Woerle
  • Patent number: 7926728
    Abstract: Embodiments provide an integrated circuit device including a contactless integrated circuit inlay. The device includes a substrate, an integrated circuit coupled to the substrate, and a coil electrically coupled to the integrated circuit and coupled to the substrate. The coil includes a first conductive line disposed in multiple turns on the substrate and a second conductive line disposed in multiple turns on the substrate.
    Type: Grant
    Filed: October 31, 2007
    Date of Patent: April 19, 2011
    Assignee: Infineon Technologies AG
    Inventors: Peter Raggam, Thomas Grieshofer
  • Publication number: 20090108974
    Abstract: Embodiments provide an integrated circuit device including a contactless integrated circuit inlay. The device includes a substrate, an integrated circuit coupled to the substrate, and a coil electrically coupled to the integrated circuit and coupled to the substrate. The coil includes a first conductive line disposed in multiple turns on the substrate and a second conductive line disposed in multiple turns on the substrate.
    Type: Application
    Filed: October 31, 2007
    Publication date: April 30, 2009
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Peter Raggam, Thomas Grieshofer