Abstract: A bi-directional optoelectric transceiver module comprising a bi-directional element with a plate positioned on a side of the bi-directional element wherein the plate is coated with a reflection enhancing coating which reflects light at a first wavelength emitted by a light emitting device and which transmits light emitted by an optical fiber at a second wavelength wherein a light detecting device is positioned to detect at least one of the first and second wavelengths of light.

Abstract: An optoelectric module includes a cylindrical ferrule defining an optical axis and having a first end constructed to receive an optical fiber aligned along the optical axis. A TO-can is positioned within the ferrule and has a first end with an optical element therein for conducting light therethrough. A base is affixed to the second end of the TO-can and to the second end of the ferrule. A laser is mounted within the TO-can so that light generated by the laser is directed through the optical element along the optical axis. A laser driver is mounted on the base and electrically connected to the laser. External connections to the laser driver are completed by either electrical traces on a surface of the base, vias through the base, or flexible leads mounted on the base.

Abstract: An optoelectric module includes a cylindrical ferrule defining an optical axis and having a first end constructed to receive an optical fiber aligned along the optical axis. An optical element, including a lens, is engaged in the ferrule between the first and second ends and positioned to convey light along the optical axis. The second end of the ferrule is closed by a base. An optical component is mounted on the base so that light is directed through the lens from the optical component to the optical fiber or from the optical fiber to the optical component. Either a laser driver or an amplifier is mounted on the base and electrically connected to the optical component and external connections are made to the laser driver or the amplifier by electrical traces on a surface of the base, vias through the base, or flex leads mounted on the base.

Abstract: Optical alignment apparatus includes a first element mounting a first lens and a light source and a second element mounting a second lens and a light receiving structure. The first lens is placed a first distance from the light source and is constructed to collimate light received from the light source. The first and second elements are mounted relative to each other to position the second lens a third distance from the first lens and to receive the collimated light from the first lens. The second lens is positioned a second distance from the light receiving structure to focus the collimated light on the light receiving structure. The first and second lens are constructed so that the first and second distances are dependent upon each other and the third distance is independent of the first and second distances.

Abstract: The optoelectric alignment apparatus and lens system includes a glass ball positioned to receive light from a light source along an optical axis. A second lens is positioned to receive light from the glass ball and to supply the received light to a light receiving structure. The glass ball provides most of the optical power of the lens system so that the second lens provides only minor optical correction. The lens system is mounted by means of a molded plastic body that extends axially along the optical axis with the second lens molded into the body. The body includes a light inlet end and a light outlet in a surface lateral to the optical axis and defines a glass ball receiving cavity adjacent the light inlet end fixedly gripping the glass ball.

Abstract: An interconnect substrate is provided. The interconnect substrate has a first surface with a conductive path and an end surface. The first surface and the end surface join to form a nexus or a corner. A conductive contact is positioned at the nexus, thereby bridging the first surface and the end surface, as well as providing a conductive path from the first surface to the end surface. The conductive contact is operably coupled to the conductive path.

Abstract: An integrated optoelectronic substrate is provided. A molded optical substrate having a surface, a core region having a first optical surface, and a cladding region is formed with the core region being at least partially surrounded by the cladding region. An interconnect board having a first surface and a second surface is disposed on the molded optical substrate, thereby operably coupling the molded optical substrate to the interconnect board.

Abstract: A multi-piece body (102) having a first hollow body (103) with a surface (105) and a second hollow body (108) with a surface (110) is provided. The first hollow body (103) and the second hollow body (108) is hingeably affixed such that the surface (105) of the first hollow body (103) and the surface (110) of the second hollow body (108) are capable of being closed on each other. A computer including a processor (560) for manipulating data, memory for data storage, an input for entering data, and an output for removing data is located in the multi-piece body (102). A plurality of optical displays (116) are operably coupled to the electronics 130, thereby enabling data to be optically displayed with the plurality of page displays (116).

Abstract: A method for making an optical layer including, a first pattern projected onto a radiation sensitive surface having a first charge. Radiant energy is used to locally change the surface charge, thereby producing local areas having a second charge. The surface is exposed to an optical media having a charge that attracts the optical media to the surface. A substrate (123) with an associated charge is passed in proximity to the surface having the optical media attached. The optical media detaches from the surface and is deposited onto the substrate. The substrate (124) is heated, thereby fusing the optical media to make an optical layer (202).

Abstract: A method for making a modular optical waveguide (100) including a plurality of optical modules (102, 103, 104, 105) with each optical module having at least a core region (101) that is surrounded by a cladding region (111, 112). A first groove 114 and a second groove 116 are disposed into cladding region (111, 112), thereby separating the optical modules (102, 103, 104, 105).

Abstract: An optical device (112, 212, 312) with first (118) and second contacts (119, 219, 319), a molded waveguide (101,201) with first (115) and second metal tracks (117) and electrical couplings from contact (118) to the first metal track (115, 315) and from the second contact (119, 219) to the second metal track (117, 217, 317) by reflowing first and second bump balls (126) positioned between the first (118) and second (119) contacts and the first (115) and second (117) metal tracks, respectively.

Abstract: A method for interconnecting a waveguide (102), an optoelectronic component 101, and an electronic component (103). A first surface (108) is formed from a portion of cladding region(107) and a second surface (109) is formed from a portion of core region and a portion of the cladding region. A substrate (104) having electrical tracings (212', 213') is attached to the waveguide (102) so that an electronic component receiving area (111') and an optoelectronic component area (112') are attached to the first and second surface (108, 109) of the waveguide (102) respectively. An electronic component (103) and an optoelectronic component (101) are mounted to the electronic component receiving area (111') and the optoelectronic receiving area (112') respectively.