Abstract: A mechanically compliant probe for electrically connecting to contact pads on microelectronic devices. The probe is used for burn-in of integrated circuits at the wafer level. Additional applications include probe cards for testing integrated circuits and sockets for flip-chips. One embodiment of the probe includes a probe tip (81) which is held on an extension arm (82) projecting laterally from an elongated flat spring (83). The spring is supported above a substrate (89) by posts (85) such that the probe tip moves vertically in response to a contact force on the probe tip. Deflection of the probe tip is compliantly limited by bending and torsional flexure of the sheet spring. Mechanical compliance of the tip allows arrays of the probe to contact pads on integrated circuits where the pads are not precisely planar.

Abstract: A mechanically compliant probe for electrically connecting to contact pads on microelectronic devices. The probe is used for burn-in of integrated circuits at the wafer level. Additional applications include probe cards for testing integrated circuits and sockets for flip-chips. One embodiment of the probe includes a probe tip (81) which is held on an extension arm (82) projecting laterally from an elongated flat spring (83). The spring is supported above a substrate (89) by posts (85) such that the probe tip moves vertically in response to a contact force on the probe tip. Deflection of the probe tip is compliantly limited by bending and torsional flexure of the sheet spring. Mechanical compliance of the tip allows arrays of the probe to contact pads on integrated circuits where the pads are not precisely planar.

Abstract: A method of making a multiple part compliant interface for a microelectronic package including the steps of providing a first microelectronic element having electrically conductive parts, providing an array of curable elastomer support pads in contact with the first microelectronic element, curing the curable elastomer support pads while the support pads remain in contact with the first microelectronic element and providing an array of adhesive pads in contact with the support pads, whereby each adhesive pad is disposed over and in substantial alignment with one of the support pads. A second microelectronic element having electrically conductive parts is then assembled in contact with the array of adhesive pads by abutting the second microelectronic element against the array of adhesive pads and compressing the adhesive pads and support pads between the first and second microelectronic elements.

Abstract: An optical floppy disk system is described in which the optical disk is enclosed in a flexible housing which is optically transparent. Both the optical disk and its protective housing can be made at very low cost from inexpensive materials. The disk is enclosed within the protective housing and the housing and disk rotate as a unit during operation. The protective housing does not adversely affect the optics of the system.

Abstract: This optical sensor has cylindrical symmetry and is comprised of a semiconductor light source/light detector combination and an optical element comprising a single lens, where the sensor is particularly suitable for uses in accurate position detection in data recording systems. In a preferred embodiment, the light source is a forward-biased p-n junction, while the light detector is a reverse-biased p-n junction located below the light source and coaxial therewith. Light from the source is directed to a point on a data recording medium and the light reflected therefrom passes through the light source to the light detecting junction. The ac signal corresponding to the reflected light is an indication of the position of the recording head with respect to the data storage medium.

Abstract: The tester and method for nondestructively detecting nonlinearity faults in conductors includes the application of a composite AC and DC drive signal to the device under test in such manner that nonlinearities in the device under test produce fault signals including second harmonics, due to local changes of resistance caused by ohmic heating. Electronic filters are used to select out and amplify the second harmonic only, eliminating the direct current and fundamental frequency components of the initial test pulse, plus third and subsequent harmonics. The filtered second harmonic signals from the device under test are then phase-compared to a phase-shifted second harmonic signal produced by a frequency doubler from the test signal generator oscillator to cancel out the second harmonic signals from the good conductor; the remaining phase anomaly signals control a threshold detector remaining to provide fault indication.