Patents by Inventor Thomas H. Dozier, II
Thomas H. Dozier, II has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8513969Abstract: An exemplary die carrier is disclosed. In some embodiments, the die carrier can hold a plurality of singulated dies while the dies are tested. The dies can be arranged on the carrier in a pattern that facilities testing the dies. The carrier can be configured to allow interchangeable interfaces to different testers to be attached to and detached from the carrier. The carrier can also be configured as a shipping container for the dies.Type: GrantFiled: June 8, 2010Date of Patent: August 20, 2013Assignee: FormFactor, Inc.Inventors: Thomas H. Dozier, II, Benjamin N. Eldridge, David H. Hsu, Igor Y. Khandros, Charles A. Miller
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Publication number: 20100244873Abstract: An exemplary die carrier is disclosed. In some embodiments, the die carrier can hold a plurality of singulated dies while the dies are tested. The dies can be arranged on the carrier in a pattern that facilities testing the dies. The carrier can be configured to allow interchangeable interfaces to different testers to be attached to and detached from the carrier. The carrier can also be configured as a shipping container for the dies.Type: ApplicationFiled: June 8, 2010Publication date: September 30, 2010Inventors: Thomas H. Dozier, II, Benjamin N. Eldridge, David S. Hsu, Igor Y. Khandros, Charles A. Miller
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Patent number: 7733106Abstract: An exemplary die carrier is disclosed. In some embodiments, the die carrier can hold a plurality of singulated dies while the dies are tested. The dies can be arranged on the carrier in a pattern that facilities testing the dies. The carrier can be configured to allow interchangeable interfaces to different testers to be attached to and detached from the carrier. The carrier can also be configured as a shipping container for the dies.Type: GrantFiled: September 15, 2006Date of Patent: June 8, 2010Assignee: FormFactor, Inc.Inventors: Thomas H. Dozier, II, Benjamin N. Eldridge, David S. Hsu, Igor Y. Khandros, Charles A. Miller
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Patent number: 7714598Abstract: An interconnection apparatus and a method of forming an interconnection apparatus. Contact structures are attached to or formed on a first substrate. The first substrate is attached to a second substrate, which is larger than the first substrate. Multiple such first substrates may be attached to the second substrate in order to create an array of contact structures. Each contact structure may be elongate and resilient and may comprise a core that is over coated with a material that imparts desired structural properties to the contact structure.Type: GrantFiled: March 24, 2008Date of Patent: May 11, 2010Assignee: FormFactor, Inc.Inventors: Benjamin N. Eldridge, Thomas H. Dozier, II, Igor Y. Khandros, Gaetan L. Mathieu, William D. Smith
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Patent number: 7347702Abstract: An interconnection apparatus and a method of forming an interconnection apparatus. Contact structures are attached to or formed on a first substrate. The first substrate is attached to a second substrate, which is larger than the first substrate. Multiple such first substrates may be attached to the second substrate in order to create an array of contact structures. Each contact structure may be elongate and resilient and may comprise a core that is over coated with a material that imparts desired structural properties to the contact structure.Type: GrantFiled: November 17, 2006Date of Patent: March 25, 2008Assignee: FormFactor, Inc.Inventors: Benjamin N. Eldridge, Thomas H. Dozier, II, Igor Y. Khandros, Gaetan L. Mathieu, William D. Smith
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Patent number: 7140883Abstract: An interconnection apparatus and a method of forming an interconnection apparatus. Contact structures are attached to or formed on a first substrate. The first substrate is attached to a second substrate, which is larger than the first substrate. Multiple such first substrates may be attached to the second substrate in order to create an array of contact structures. Each contact structure may be elongate and resilient and may comprise a core that is over coated with a material that imparts desired structural properties to the contact structure.Type: GrantFiled: October 23, 2003Date of Patent: November 28, 2006Assignee: FormFactor, Inc.Inventors: Igor Y. Khandros, Benjamin N. Eldridge, Gaetan L. Mathieu, Thomas H. Dozier, II, William D. Smith
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Patent number: 7059047Abstract: Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an interconnection substrate, or by horizontally urging terminals of an interconnection substrate against end portions of the spring contact elements. A variety of terminal configurations are disclosed.Type: GrantFiled: September 29, 2003Date of Patent: June 13, 2006Assignee: FormFactor, Inc.Inventors: Thomas H. Dozier, II, Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu, David V. Pedersen, Michael A. Stadt
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Patent number: 6913468Abstract: Surface-mount, solder-down sockets are described which permit electronic components such as semiconductor packages to be releasably mounted to a circuit board. Generally, the socket includes resilient contact structures extending from a top surface of a support substrate, and solder-ball (or other suitable) contact structures disposed on a bottom surface of the support substrate. Composite interconnection elements are described for use as the resilient contact structures disposed atop the support substrate. In use, the support substrate is soldered down onto the circuit board, the contact structures on the bottom surface of the support substrate contacting corresponding contact areas on the circuit board. In any suitable manner, selected ones of the resilient contact structures atop the support substrate are connected, via the support substrate, to corresponding ones of the contact structures on the bottom surface of the support substrate.Type: GrantFiled: October 10, 2003Date of Patent: July 5, 2005Assignee: FormFactor, Inc.Inventors: Thomas H. Dozier, II, Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu
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Patent number: 6669489Abstract: Surface-mount, solder-down sockets permit electronic components such as semiconductor packages to be releasably mounted to a circuit board or other electronic component. In an embodiment, resilient contact structures extend through a support substrate, and solder-ball (or other suitable) contact structures are disposed along the bottom of the support substrate in electrical contact with the ends of the resilient contact structures. Composite interconnection elements are used as the resilient contact structures disposed atop the support substrate. In an embodiment intended to receive an LGA-type semiconductor package, pressure contact is made between the resilient contact structures and external connection points of the semiconductor package with a contact force which is generally normal to the top surface of the support substrate.Type: GrantFiled: June 30, 1998Date of Patent: December 30, 2003Assignee: FormFactor, Inc.Inventors: Thomas H. Dozier, II, Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu
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Patent number: 6642625Abstract: Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an interconnection substrate, or by horizontally urging terminals of an interconnection substrate against end portions of the spring contact elements. A variety of terminal configurations are disclosed.Type: GrantFiled: November 19, 2002Date of Patent: November 4, 2003Assignee: FormFactor, Inc.Inventors: Thomas H. Dozier, II, Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu, David V. Pederson, Michael A. Stadt
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Patent number: 6534856Abstract: Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an interconnection substrate, or by horizontally urging terminals of an interconnection substrate against end portions of the spring contact elements. A variety of terminal configurations are disclosed.Type: GrantFiled: March 27, 2001Date of Patent: March 18, 2003Assignee: FormFactor, Inc.Inventors: Thomas H. Dozier, II, Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu, David V. Pedersen, Michael A. Stadt
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Patent number: 6232149Abstract: Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an interconnection substrate, or by horizontally urging terminals of an interconnection substrate against end portions of the spring contact elements. A variety of terminal configurations are disclosed.Type: GrantFiled: March 7, 2000Date of Patent: May 15, 2001Assignee: FormFactor, Inc.Inventors: Thomas H. Dozier, II, Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu, David V. Pedersen, Michael A. Stadt
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Patent number: 6033935Abstract: Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an interconnection substrate, or by horizontally urging terminals of an interconnection substrate against end portions of the spring contact elements. A variety of terminal configurations are disclosed.Type: GrantFiled: June 30, 1998Date of Patent: March 7, 2000Assignee: FormFactor, Inc.Inventors: Thomas H. Dozier, II, Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu, David V. Pedersen, Michael A. Stadt
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Patent number: 5820014Abstract: Method and apparatus for forming solder balls on electronic components and for forming solder joints between electronic components is described. A preform is fabricated having relatively large cross-section solder masses connected to one another by relatively small cross-section solder bridges. Upon reheating (reflow heating), the solder bridges melt first, and become subsumed into the solder masses. In instances where the preform is placed on a surface of an electronic component and reflowed, the solder masses become solder balls on pads of the electronic component. In instances where the preform is placed between two electronic components and reflowed, the solder masses become solder joints connecting the two electronic components. The preform may be prefabricated with a carrier, for later application to or between electronic components, and may be used to form solder balls on one or more unsingulated semiconductor dies on a semiconductor wafer.Type: GrantFiled: January 11, 1996Date of Patent: October 13, 1998Assignee: Form Factor, Inc.Inventors: Thomas H. Dozier, II, Igor Y. Khandros
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Patent number: 5772451Abstract: Surface-mount, solder-down sockets permit electronic components such as semiconductor packages to be releasably mounted to a circuit board. Resilient contact structures extend from a top surface of a support substrate, and solder-ball (or other suitable) contact structures are disposed on a bottom surface of the support substrate. Composite interconnection elements are used as the resilient contact structures disposed atop the support substrate. In any suitable manner, selected ones of the resilient contact structures atop the support substrate are connected, via the support substrate, to corresponding ones of the contact structures on the bottom surface of the support substrate. In an embodiment intended to receive a LGA-type semiconductor package, pressure contact is made between the resilient contact structures and external connection points of the semiconductor package with a contact force which is generally normal to the top surface of the support substrate.Type: GrantFiled: October 18, 1995Date of Patent: June 30, 1998Assignee: Form Factor, Inc.Inventors: Thomas H. Dozier, II, Benjamin N. Eldridge, Gary W. Grube, Igor Y. Khandros, Gaetan L. Mathieu
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Patent number: 5473510Abstract: An electrical assembly 100 is provided which includes a land grid array integrated circuit package 103, a socket 104, a printed circuit board 106 and a clamping lid 101. Socket 104 and clamping lid 101 have major surface dimensions no greater than the major surface dimensions of the LGA integrated circuit package 103 in order to limit board space requirements to the minimum required by the circuit package 103. Alignment means associated with integrated circuit package 103, socket 104 and printed circuit board 106 are provided to maintain alignment between contact pads 120 on circuit package 103 and first ends of compressible conductors 111 on socket 104 and between contact pads 122 on circuit board 106 and second ends of compressible conductors 111. In the completed assembly, clamping lid 101 applies pressure to an adjacent surface of integrated circuit package 103 thereby compressing compressible conductors 111 against contact pads 120 and contact pads 122.Type: GrantFiled: March 25, 1994Date of Patent: December 5, 1995Assignee: Convex Computer CorporationInventor: Thomas H. Dozier, II