Patents by Inventor Thomas Höfer
Thomas Höfer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230227580Abstract: The invention also relates to antigen binding proteins and related fragments thereof for binding Von Willebrand factor (VWF) and uses thereof. In one aspect, the present invention provides an antigen binding protein comprising an antigen binding domain that binds to or specifically binds to Von Willebrand factor (VWF) under shear gradient conditions. Preferably, the antigen binding protein comprises an antigen binding domain that does not bind to VWF under constant shear conditions.Type: ApplicationFiled: June 25, 2021Publication date: July 20, 2023Applicants: MONASH UNIVERSITY, BAKER HEART AND DIABETES INSTITUTEInventors: Christoph HAGEMEYER, Erik WESTEIN, Thomas HOEFER, Robert ANDREWS, Elizabeth GARDINER
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Patent number: 10333032Abstract: An embodiment optoelectronic semiconductor device includes a housing having a leadframe with a first and second connection conductor. The housing further has a housing body surrounding the leadframe in one or more regions. The housing body extends in a vertical direction between a mounting side of the housing body and a front side of the housing body opposite the mounting side. The first connection conductor has a recess. A semiconductor chip configured to generate radiation is arranged within the housing, and the semiconductor chip is disposed in the recess and is affixed to the first connection conductor within the recess. A side face of the recess forms a reflector for reflecting the generated radiation. The first connection conductor protrudes from the housing body at the mounting side. The semiconductor chip is, in at least some regions, free of an encapsulation material adjoining the semiconductor chip.Type: GrantFiled: August 8, 2014Date of Patent: June 25, 2019Assignee: OSRAM OPTO SEMICONDUCTORS GMBHInventors: Frank Möllmer, Markus Arzberger, Michael Schwind, Thomas Höfer, Martin Haushalter, Mario Wiengarten, Tilman Eckert
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Publication number: 20160218248Abstract: An embodiment optoelectronic semiconductor device includes a housing having a leadframe with a first and second connection conductor. The housing further has a housing body surrounding the leadframe in one or more regions. The housing body extends in a vertical direction between a mounting side of the housing body and a front side of the housing body opposite the mounting side. The first connection conductor has a recess. A semiconductor chip configured to generate radiation is arranged within the housing, and the semiconductor chip is disposed in the recess and is affixed to the first connection conductor within the recess. A side face of the recess forms a reflector for reflecting the generated radiation. The first connection conductor protrudes from the housing body at the mounting side. The semiconductor chip is, in at least some regions, free of an encapsulation material adjoining the semiconductor chip.Type: ApplicationFiled: August 8, 2014Publication date: July 28, 2016Applicant: OSRAM Opto Semiconductors GmbHInventors: Frank Möllmer, Markus Arzberger, Michael Schwind, Thomas Höfer, Martin Haushalter, Mario Wiengarten, Tilmann Eckert
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Patent number: 9070853Abstract: A package for an optoelectronic semiconductor component is disclosed. The package includes a package body, a first connecting lead and a second connecting lead. The first connecting lead and the second connecting lead each extend in a vertical direction through the package body. A semiconductor component with such a package and a semiconductor chip are also disclosed.Type: GrantFiled: September 13, 2011Date of Patent: June 30, 2015Assignee: OSRAM OPTO SEMICONDUCTORS GMBHInventors: Frank Moellmer, Markus Arzberger, Michael Schwind, Thomas Hoefer
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Patent number: 8897327Abstract: A laser diode device including a housing having a mounting area in a cavity of the housing, at least one laser diode chip that emits electromagnetic radiation through a radiation exit area during operation, at least one covering element which is transmissive, at least in places, to the electromagnetic radiation generated by the laser diode chip during operation, and a deflection element, that directs at least part of the electromagnetic radiation generated by the laser diode chip during operation in a direction of the covering element, wherein the radiation exit area of the laser diode chip runs substantially transversely or substantially perpendicularly with respect to the mounting area and/or with respect to the covering element, the covering element connects to the housing, and the covering element tightly closes the housing.Type: GrantFiled: April 15, 2013Date of Patent: November 25, 2014Assignee: OSRAM Opto Semiconductors GmbHInventors: Karsten Auen, Uwe Strauss, Thomas Höfer
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Patent number: 8735930Abstract: An optoelectronic component (1) is proposed that comprises a housing body (2) and at least one semiconductor chip (8) disposed thereon, said housing body having a base part (13) comprising a connector body (16), on which a connecting conductor material (6, 7) is disposed, and said housing body having a reflector part (14) comprising a reflector body (23), on which a reflector material (9) is disposed, wherein said connector body and said reflector body are preformed separately from each other and said reflector body is disposed on said connector body in the form of a reflector top.Type: GrantFiled: March 9, 2005Date of Patent: May 27, 2014Assignee: Osram Opto Semiconductors GmbHInventors: Herbert Brunner, Matthias Winter, Markus Zeiler, Georg Bogner, Thomas Höfer
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Patent number: 8642902Abstract: A surface-mountable device (100) is specified, having a mounting side (101), a top side (102) lying opposite the mounting side (101), an electrically insulating carrier plate (1), an electrical component (2) and a housing (3). The carrier plate (1) terminates the device (100) toward the mounting side (101). Furthermore, the carrier plate (1) has a fixing side (103) lying opposite the mounting side (101). For the purpose of making electrical contact with the component (2), the carrier plate (1) has conductor tracks (4) arranged on the fixing side (103), contact areas (5) arranged on the mounting side (101), and openings (6), wherein in each case a contact area (5) is electrically conductively connected to a conductor track (4) by an opening (6). The component (2) is enclosed by the housing (3), wherein at least one opening (6) is arranged below the component (2). The housing (3) and the carrier plate (1) are arranged flush with one another in a plan view of the carrier plate (1).Type: GrantFiled: October 15, 2009Date of Patent: February 4, 2014Assignee: OSRAM Opto Semiconductors GmbHInventors: Michael Schumann, Thomas Hoefer, Werner Kuhlmann
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Publication number: 20130272329Abstract: A laser diode device including a housing having a mounting area in a cavity of the housing, at least one laser diode chip that emits electromagnetic radiation through a radiation exit area during operation, at least one covering element which is transmissive, at least in places, to the electromagnetic radiation generated by the laser diode chip during operation, and a deflection element, that directs at least part of the electromagnetic radiation generated by the laser diode chip during operation in a direction of the covering element, wherein the radiation exit area of the laser diode chip runs substantially transversely or substantially perpendicularly with respect to the mounting area and/or with respect to the covering element, the covering element connects to the housing, and the covering element tightly closes the housing.Type: ApplicationFiled: April 15, 2013Publication date: October 17, 2013Applicant: OSRAM Opto Semiconductors GmbHInventors: Karsten Auen, Uwe Strauss, Thomas Höfer
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Publication number: 20130256736Abstract: A package for an optoelectronic semiconductor component is disclosed. The package includes a package body, a first connecting lead and a second connecting lead. The first connecting lead and the second connecting lead each extend in a vertical direction through the package body. A semiconductor component with such a package and a semiconductor chip are also disclosed.Type: ApplicationFiled: September 13, 2011Publication date: October 3, 2013Applicant: OSRAM Opto Semiconductors GmbHInventors: Frank Moellmer, Markus Arzberger, Michael Schwind, Thomas Hoefer
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Publication number: 20110299232Abstract: A surface-mountable device (100) is specified, comprising a mounting side (101), a top side (102) lying opposite the mounting side (101), an electrically insulating carrier plate (1), an electrical component (2) and a housing (3). The carrier plate (1) terminates the device (100) toward the mounting side (101). Furthermore, the carrier plate (1) has a fixing side (103) lying opposite the mounting side (101). For the purpose of making electrical contact with the component (2), the carrier plate (1) has conductor tracks (4) arranged on the fixing side (103), contact areas (5) arranged on the mounting side (101), and openings (6), wherein in each case a contact area (5) is electrically conductively connected to a conductor track (4) by means of an opening (6). The component (2) is enclosed by the housing (3), wherein at least one opening (6) is arranged below the component (2). The housing (3) and the carrier plate (1) are arranged flush with one another in a plan view of the carrier plate (1).Type: ApplicationFiled: October 15, 2009Publication date: December 8, 2011Applicant: Osram Opto Semiconductors GmbHInventors: Michael Schumann, Thomas Hoefer, Werner Kuhlmann
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Patent number: 7975394Abstract: The invention is directed to a tilt sensor comprising at least one body movable along a predefined path and an optoelectronic unit for determining the position of said body, said tilt sensor being surface-mountable. The invention is further directed to a tilt sensor assembly.Type: GrantFiled: April 10, 2007Date of Patent: July 12, 2011Assignee: Osram Opto Semiconductors GmbHInventors: Frank Möllmer, Frank Singer, Michael Schumann, Martin Haushalter, Thomas Hoefer, Christine Rüth, Stefan Strüwing
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Patent number: 7851812Abstract: An electronic device according to the invention includes a housing, a recess containing an optoelectronic component, and a film including a polyimide, which is over the recess covering the optoelectronic component.Type: GrantFiled: February 23, 2007Date of Patent: December 14, 2010Assignee: Osram Opto Semiconductors GmbHInventors: Martin Rudolf Behringer, Harald Feltges, Thomas Hoefer, Frank Moellmer
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Patent number: 7718451Abstract: A method for patterned metallization of a plastic-containing body, which comprises the steps of producing the body via a two-component injection-molding process with at least two plastics, one of which is non-metallizable, and metallizing the body in such a way that a metallized region and a non-metallized region are formed, wherein the non-metallized region is determined by the non-metallizable plastic. A method for the patterned metallization of a plastic-containing body in particular a package body for an optoelectronic device is also provided.Type: GrantFiled: July 23, 2007Date of Patent: May 18, 2010Assignee: Osram Opto Semiconductor GmbHInventors: Thomas Höfer, Herbert Brunner, Frank Möllmer, Günter Waitl, Rainer Sewald, Markus Zeiler
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Publication number: 20100000104Abstract: The invention is directed to a tilt sensor comprising at least one body movable along a predefined path and an optoelectronic unit for determining the position of said body, said tilt sensor being surface-mountable. The invention is further directed to a tilt sensor assembly.Type: ApplicationFiled: April 10, 2007Publication date: January 7, 2010Inventors: Frank Möllmer, Frank Singer, Michael Schumann, Martin Haushalter, Thomas Hoefer, Christine Rüth, Stefan Strüwing
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Publication number: 20090212316Abstract: A surface-mounted component, comprising an optoelectronic semiconductor chip, a molded body integrally molded onto the semiconductor chip, a mounting area formed at least in places by a surface of the molded body, at least one connection location and side areas of the component which are produced by means of singulation.Type: ApplicationFiled: August 24, 2006Publication date: August 27, 2009Applicant: Osram Opto Semiconductors GmbHInventors: Bert Braune, Herbert Brunner, Thomas Höfer, Harald Jäger, Raimund Schwarz
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Publication number: 20070200130Abstract: An electronic device according to the invention includes a housing, a recess containing an optoelectronic component, and a film including a polyimide, which is over the recess covering the optoelectronic component.Type: ApplicationFiled: February 23, 2007Publication date: August 30, 2007Inventors: Martin Behringer, Harald Feltges, Thomas Hoefer, Frank Moellmer
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Patent number: 7247940Abstract: An optoelectronic device, comprising a package body (57) and at least one semiconductor chip (50) arranged on the package body (57). The surface of the package body (57) has a metallized subregion (15) and a non-metallized subregion (20). The package body (57) includes at least two different plastics (53, 54), one of the plastics being non-metallizable (54) and this plastic determining the non-metallized subregion (20). A method for producing such components and a method for the patterned metallization of a plastic-containing body are also provided.Type: GrantFiled: March 1, 2004Date of Patent: July 24, 2007Assignee: Osram Opto Semiconductor GmbHInventors: Thomas Höfer, Herbert Brunner, Frank Möllmer, Günter Waitl, Rainer Sewald, Markus Zeiler