Patents by Inventor Thomas Hülsmann
Thomas Hülsmann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220286010Abstract: A drive unit for motor vehicle applications, in particular to a locking system drive unit. The latter has an enclosure consisting substantially of a housing and cover. In addition, an electric motor is realized inside the enclosure. The electric motor is receiving with its two motor bearings in associated cutouts in the housing and is fixed by joining together the housing and the cover. According to the invention, the housing and/or the cover have/has fixing anchors in a central region that are arranged on both sides of the cutouts.Type: ApplicationFiled: August 17, 2020Publication date: September 8, 2022Inventors: Stephan MEUTERS, Thomas HÜLSMANN, Carsten FUCHS
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Patent number: 10619251Abstract: An etching solution for copper and copper alloy surfaces comprising at least one acid, at least one oxidising agent suitable to oxidise copper, at least one source of halide ions and further at least one polyamide containing at least one polymeric moiety according to formula (I) wherein each a is independently from each other selected from 1, 2 and 3; each b is an integer independently from each other ranging from 5 to 10000; each R1 is a monovalent residue independently from each other selected from the group consisting of substituted or unsubstituted C1-C8-alkyl groups and a method for its use are provided. Such etching solution is particularly useful for retaining the shape of treated copper and copper alloy lines.Type: GrantFiled: December 14, 2016Date of Patent: April 14, 2020Assignee: Atotech Deutschland GmbHInventors: Fabian Michalik, Norbert Lützow, Josef Gaida, Thomas Hülsmann, Gabriela Schmidt
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Patent number: 10219391Abstract: A method for pretreating a copper surface for the subsequent formation of a firmly adhesive bond between the copper surface and a plastic material substrate. The method comprises bringing a copper surface into contact with: a) hydrogen peroxide; b) an acid; c) a nitrogen-containing, five-membered, heterocyclic compound; and d) a lactam, amide, or polyamide, connected at one or more of its nitrogen atoms with at least one residue of formula (I), wherein: n is an integer from 1 to 100; R1 is hydrogen or a hydrocarbon residue with 1 to 6 carbon atoms; R2 is hydrogen or a hydrocarbon residue with 1 to 6 carbon atoms; and each R1 and R2 in a —(CHR1—CHR2—O)— moiety is selected independently of each R1 and R2 in another —(CHR1—CHR2—O)— moiety.Type: GrantFiled: October 5, 2016Date of Patent: February 26, 2019Assignee: Atotech Deutschland GmbHInventors: Christian Sparing, Thomas Huelsmann, Arno Clicque, Patrick Brooks, Adrian Zee, Heiko Brunner
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Publication number: 20190003061Abstract: An etching solution for copper and copper alloy surfaces comprising at least one acid, at least one oxidising agent suitable to oxidise copper, at least one source of halide ions and further at least one polyamide containing at least one polymeric moiety according to formula (I) wherein each a is independently from each other selected from 1, 2 and 3; each b is an integer independently from each other ranging from 5 to 10000; each R1 is a monovalent residue independently from each other selected from the group consisting of substituted or unsubstituted C1-C8-alkyl groups and a method for its use are provided. Such etching solution is particularly useful for retaining the shape of treated copper and copper alloy lines.Type: ApplicationFiled: December 14, 2016Publication date: January 3, 2019Applicant: Atotech Deutschland GmbHInventors: Fabian MICHALIK, Norbert LÜTZOW, Gabriela SCHMIDT, Josef GAIDA, Thomas HÜLSMANN
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Publication number: 20180312978Abstract: A surface treatment solution for copper and copper alloy surfaces comprising an acid and an oxidising agent selected from the group consisting of hydrogen peroxide, metal peroxides, metal superoxides and mixtures thereof, at least one source of chloride ions and at least one source of bromide ions. The surface treatment solution is particularly useful in the manufacturing of printed circuit boards, IC substrates and other electronic appliances.Type: ApplicationFiled: October 20, 2016Publication date: November 1, 2018Inventors: Tatjana CUKIC, Neal WOOD, Thomas HÜLSMANN
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Patent number: 9824909Abstract: A chuck for aligning a first planar substrate in parallel to a second planar substrate includes a top plate having a top surface for arrangement of the first planar substrate. A bottom plate is at least one distance measuring sensor configured to measure a distance between the top surface of the top plate and a surface of the second planar substrate, and at least three linear actuators in contact with the top plate and the bottom plate. The method for setting a gap between the first and second planar substrate includes measuring the thickness of the first planar substrate and measuring between a surface of the second planar substrate and the top surface of the top plate. The tilt adjusts between a top surface of the first planar substrate or the chuck and the surface of the second planar substrate by using at least three linear actuators of the chuck.Type: GrantFiled: December 4, 2013Date of Patent: November 21, 2017Assignee: SUSS MICROTEC LITHOGRAPHY GMBHInventors: Sven Hansen, Thomas Huelsmann, Katrin Schindler
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Publication number: 20170086305Abstract: A method for pretreating a copper surface for the subsequent formation of a firmly adhesive bond between the copper surface and a plastic material substrate. The method comprises bringing a copper surface into contact with: a) hydrogen peroxide; b) an acid; c) a nitrogen-containing, five-membered, heterocyclic compound; and d) a lactam, amide, or polyamide, connected at one or more of its nitrogen atoms with at least one residue of formula (I), wherein: n is an integer from 1 to 100; R1 is hydrogen or a hydrocarbon residue with 1 to 6 carbon atoms; R2 is hydrogen or a hydrocarbon residue with 1 to 6 carbon atoms; and each R1 and R2 in a —(CHR1—CHR2—O)— moiety is selected independently of each R1 and R2 in another —(CHR1—CHR2—O)— moiety.Type: ApplicationFiled: October 5, 2016Publication date: March 23, 2017Inventors: Christian SPARING, Thomas HUELSMANN, Arno CLICQUE, Patrick BROOKS, Adrian ZEE, Heiko BRUNNER
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Patent number: 9504161Abstract: The invention concerns a solution for pretreating copper surfaces, and a method for pre-treating copper surfaces allowing the formation of a tight bond to plastic substrates. The solution comprises: a) hydrogen peroxide, b) at least one acid, and c) at least one nitrogen-containing, five-membered, heterocyclic compound, and d) additionally at least one nitrogen containing, adhesion-promoting compound, said compound comprising, or consisting of, lactams, non-quaternary fatty amines, amides and polyamides, connected at one or more of its nitrogen atoms with at least one residue of formula (I).Type: GrantFiled: October 24, 2011Date of Patent: November 22, 2016Assignee: ATOTECH DEUTSCHLAND GMBHInventors: Christian Sparing, Thomas Huelsmann, Arno Clicque, Patrick Brooks, Adrian Zee, Heiko Brunner
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Publication number: 20150294890Abstract: The chuck for aligning a first planar substrate, e.g., a wafer, in parallel to a second planar substrate, e.g. a mask, comprises: a top plate having a top surface for arrangement of the first planar substrate, a bottom plate, at least one distance measuring sensor configured to measure a distance between the top surface of the top plate and a surface of the second planar substrate, and at least three linear actuators in contact with the top plate and the bottom plate. The method for setting a gap between a first planar substrate, e.g. a wafer, on a top plate of a chuck, and a second planar substrate, e.g.Type: ApplicationFiled: December 4, 2013Publication date: October 15, 2015Inventors: Sven HANSEN, Thomas HUELSMANN, Katrin SCHINDLER
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Publication number: 20140141169Abstract: The present invention relates to a method for increasing the adhesion of organic resist materials on copper or copper alloy surfaces. The copper or copper alloy surface is contacted with an aqueous adhesion promoting solution comprising at least one organic acid, a peroxide compound and optionally one or more substances selected from the group consisting of urea, derivatives thereof and water-soluble polymers.Type: ApplicationFiled: June 29, 2012Publication date: May 22, 2014Applicant: ATOTECH DEUTSCHLAND GMBHInventors: Thomas Huelsmann, Arno Clicque, Dirk Tews, Mirko Kloppisch, Andry Liong
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Publication number: 20140076461Abstract: The invention concerns a solution for pretreating copper surfaces, and a method for pre-treating copper surfaces allowing the formation of a tight bond to plastic substrates. The solution comprises: a) hydrogen peroxide, b) at least one acid, and c) at least one nitrogen-containing, five-membered, heterocyclic compound, and d) additionally at least one nitrogen containing, adhesion-promoting compound, said compound comprising, or consisting of, lactams, non-quaternary fatty amines, amides and polyamides, connected at one or more of its nitrogen atoms with at least one residue of formula (I).Type: ApplicationFiled: October 24, 2011Publication date: March 20, 2014Applicant: ATOTECH DEUTSCHLAND GMBHInventors: Christian Sparing, Thomas Huelsmann, Arno Clicque, Patrick Brooks, Adrian Zee, Heiko Brunner
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Publication number: 20120037312Abstract: The present invention relates to a process for manufacture of multilayer printed circuit boards and articles formed thereby, especially IC substrates. The inventive process utilizes in individual process steps inorganic silicates and organosilane bonding mixtures to provide adhesion between layers of copper and dielectric materials. Said process leads to an enhanced adhesive strength, improved mechanical and thermal stress resistance as well as humidity resistance of multilayer printed circuit boards and IC substrates.Type: ApplicationFiled: April 15, 2010Publication date: February 16, 2012Inventors: Christian Sparing, Thomas Huelsmann, Patrick Brooks, Arno Clicque
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Publication number: 20070035731Abstract: The invention relates to a method for aligning two flat substrates with one another, wherein each substrate has at least one aligning mark for mutual alignment, particularly for aligning a mask with a wafer before exposure. After aligning the two substrates in a first aligning step by optically determining the position of the alignment mark of the first substrate, storing the position of the first substrate, and moving the second substrate parallel to the first substrate so that the alignment mark of the second substrate corresponds with the stored position of the alignment mark of the first substrate, in a second aligning step the alignment is verified and a fine adjustment is carried out if necessary. In this second step the alignment marks of both substrates are observed essentially simultaneously, and both substrates are aligned with one another by a relative movement parallel to the substrate plane.Type: ApplicationFiled: November 24, 2004Publication date: February 15, 2007Inventors: Thomas Hülsmann, Wolfgang Haenel, Philippe Stievenard
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Patent number: 6373272Abstract: The present invention provides an apparatus for the testing of semiconductor structures. The apparatus is provided with a chuck for holding a semiconductor wafer and with needle holders for contact needles, the chuck being provided with a fastening device for the semiconductor wafer and being movable for positioning, controlled using a positioning device, in relation to the contact needles. The object of the present invention is to detect faults, in good time and reliably, of non-serviceable or not fully serviceable chips before separation to avoid unnecessary work for separating and assembling defective chips. The object is attained in that the chuck has a receiving area exposing upwards a lower surface of the semiconductor wafer and a receiving plane therefor. The receiving plane is arranged above the needle carrier, and the contact needles point upwards in such a manner that they contact contact islands of the semiconductor chips on the downwardly directed upper surface of the semiconductor wafer.Type: GrantFiled: September 16, 1998Date of Patent: April 16, 2002Assignee: Karl Suss Dresden GmbHInventors: Reinhard Welsch, Claus Dietrich, Thomas Huelsmann, Dietmar Runge
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Patent number: 6190209Abstract: A motor-vehicle door latch housing has a dielectric plastic body, an electrical device secured to the body, a plurality of electrical conductors each at least partially imbedded in the body and each having an end forming a terminal adjacent the device, and a plurality of connectors on the device each is elastically deformable and bearing elastically on a respective one of the terminals. Each terminal fits in a predetermined direction with the respective connector. The connectors are deformed elastically transversely to the installation direction when fitted with the respective terminals. Thus as the device is fitted to the body, its connectors are automatically joined to the terminals.Type: GrantFiled: June 25, 1999Date of Patent: February 20, 2001Assignee: Kierkert AGInventors: Thomas Hülsmann, Ulrich Nass