Abstract: The present invention provides porous composite materials and methods of making and using the same. In one embodiment, a porous composite material comprises a porous substrate comprising a first polymeric material and at least one particle or fiber of a second polymeric material and a third polymeric material disposed on at least one surface of the porous substrate and having at least one point of attachment the to the at least one particle or fiber of the second polymeric material.

Abstract: Methods of making porous composite materials are provided. These methods involve providing a sintered porous first polymeric material, providing a solution containing a second polymeric material dissolved in a solvent, and, depositing the solution onto the sintered porous first polymeric material to form a precipitated porous second polymeric material wherein a portion of the second polymeric material is fused to the sintered, porous first polymeric material by at least one direct physical bond, and the second polymeric material is in at least some of the pores of the first polymeric material. In some methods, the first polymeric material and the second polymeric material are soluble in the same solvent.

Abstract: The invention provides composite porous materials in which a second material is fused to and/or is in the pores and/or is fused directly to some of the pore walls of a porous first material. The invention also provides methods of filtering a fluid using these composite porous materials and methods of manufacturing the composite porous materials.

Abstract: The invention provides composite porous materials in which a second material is fused to and/or is in the pores and/or is fused directly to some of the pore walls of a porous first material. The invention also provides methods of filtering a fluid using these composite porous materials and methods of manufacturing the composite porous materials.

Abstract: The invention provides composite porous materials in which a second material is fused to and/or is in the pores and/or is fused directly to some of the pore walls of a porous first material. The invention also provides methods of filtering a fluid using these composite porous materials and methods of manufacturing the composite porous materials.

Abstract: The invention provides composite porous materials in which a second material is fused to and/or is in the pores and/or is fused directly to some of the pore walls of a porous first material. The invention also provides methods of filtering a fluid using these composite porous materials and methods of manufacturing the composite porous materials.

Abstract: A liquid barrier is disclosed that comprises a porous hydrophobic material which allows the flow of gases (e.g., corrosive gases) but inhibits the flow of liquids, including aqueous liquids. A specific embodiment of the invention relates to a venturi which incorporates a liquid barrier that allows the flow of gases (e.g., ozone and air) but inhibits the flow of liquids. Another specific embodiment of the invention relates to an ozone generation system that includes an ozone generator and a liquid barrier made of a porous hydrophobic material, which allows the flow of ozone but inhibits the flow back of liquids to the ozone generator. The invention also encompasses methods of introducing a gas into an aqueous liquid, wherein the gas passes through a liquid barrier prior to being introduced into the aqueous liquid.

Abstract: A method for electrically connecting integrated circuit copper-gold ball bond that connect a bond wire (18) with a bond pad (14) forms a palladium layer (16) in the electrical connection between the bond wire (18) and the bond pad (14). The connection avoids excessive stresses that arise from intermetallic formations between the bond wire (18) and the bond pad (14).

Abstract: An (10) and method is provided for bonding wire (12) to the bond sites (28) of integrated circuits (14). In preferred embodiments gold wire (12) is bonded to aluminum bond pad (28). Apparatus (10) includes a high frequency ultrasonic energy source (20) designed to provide ultrasonic energy at frequencies above about 125 kHz. The ultrasonic energy is imparted to the bonding interface (32) via transducer (18) and capillary (16). The transducer is modified in length and tool clamp point (40) is sited on transducer (18) so that the wavelength of the high frequency ultrasonic energy is at the antinodal point in its application to interface (32) and thus is optimized. In the preferred embodiments of the process the ultrasonic energy is applied at about 350 kHz at ambient temperature. In this fashion, the bond formed between bond end (30) and bond pad (28) is optimized in terms of shear strength, bonding time and processing temperatures.

Abstract: An apparatus (10) and method is provided for bonding wire (12) to the bond sites (28) of integrated circuits (14). In preferred embodiments a bond end (30) on gold wire (12) is bonded to aluminum bond pad (28). Apparatus (10) includes a high frequency ultrasonic energy source (20) designed to provide ultrasonic energy at frequencies from about 100 kHz to about 125 kHz. The ultrasonic energy is imparted to the bonding interface (32) via transducer (18) and capillary (16). The transducer (18) is modified in length and tool clamp point (40) is sited on transducer (18) so that the high frequency ultrasonic energy is at the antinodal point in its application to interface (32) and thus is optimized. In preferred embodiments of the process, the ultrasonic energy is applied at about 114 kHz. In this fashion, the bond formed between bond end (30) and bond pad (28) is optimized in terms of shear strength, bonding time and processing temperatures.

Abstract: The disclosure relates to an electrical connection between a bonding pad on a semiconductor chip and a wire wherein the bonding pad is formed of copper doped aluminum and the wire is formed of copper doped gold. The wire has from about 100 to about 10,000 parts per million copper and the pad has from about 5000 to about 50,000 parts per million copper.

Abstract: The disclosure relates to the use of metastable state of mixed gases which, when appropriately mixed, provide better control of current and voltage conditions and subsequent arc formation properties in making balls of aluminum, copper and gold with an electronic flame-off method. The specific mixtures involve inert argon mixed with small amounts of hydrogen and neon. Exceptionally well controlled balls of uniform size result.