Abstract: A substrate container includes a shell defining an interior space and a purge flow distribution system. The shell includes a front opening, a bottom wall, and a rear wall. The purge flow distribution system receives a stream of purge gas and includes an inlet and a network of separate gas distributing devices configured to distribute the stream of purge gas into the interior space. A supply line is also included that is connected to the inlet and configured to divide the supply of purge gas to the network of separate gas distributing devices. A method of purging an open substrate container includes supplying a stream of purge gas to an inlet of a purge flow distribution system and dividing the purge gas to supply a network of separate gas distributing devices to distribute the stream of purge gas into the interior space.

Abstract: A substrate container includes a shell defining an interior space and a purge flow distribution system. The shell includes a front opening, a bottom wall, and a rear wall. The purge flow distribution system receives a stream of purge gas and includes an inlet and a network of separate gas distributing devices configured to distribute the stream of purge gas into the interior space. A supply line is also included that is connected to the inlet and configured to divide the supply of purge gas to the network of separate gas distributing devices. A method of purging an open substrate container includes supplying a stream of purge gas to an inlet of a purge flow distribution system and dividing the purge gas to supply a network of separate gas distributing devices to distribute the stream of purge gas into the interior space.

Abstract: Substrate containers include purge flow distribution systems. The purge flow distribution systems can divide one or more input flows of purge gas to a plurality of gas distribution surfaces of a network of gas distribution devices. Methods of controlling purge can include configuring the substrate containers to provide determined purge gas flow rates at each of the gas distribution surfaces. The configuration can be performed using flow controls of the purge flow distribution systems. The purge gas flow rates can be determined based on purge performance parameters. A controller can direct the operation of the purge flow distribution systems. The controller and the substrate container can be combined in a substrate container purging system.

Abstract: In a wafer container, diffusers are positioned such that they are closer to a center line of the wafer container. This improves the distribution of purge gas within the wafer container. The diffusers can be positioned such that their position corresponds to a recessed central panel of the back wall. The diffusers can be positioned such that an angle between the diffusers relative to a center of a wafer contained within the wafer container is 60 degrees or less. The diffusers can be joined to purge ports by offset connectors oriented such that the diffusers are closer to the center line of the wafer container than the purge ports. The distance from each of the diffusers to the center line of the wafer container can be less than one fourth of a diameter of the wafer that the wafer container is configured to accommodate.