Abstract: A transmission circuit for use with an ultrasonic probe including an ultrasonic transducer is provided. The transmission circuit includes a high voltage current DAC configured to output a drive current of an ultrasonic transducer to transmit and receive ultrasound, and a waveform generator configured to output a control signal from the high voltage current DAC to the high voltage current DAC with a predetermined timing. The control signal configured to output the drive current with a desired magnitude.

Abstract: A transmission circuit for use with an ultrasonic probe including an ultrasonic transducer is provided. The transmission circuit includes a high voltage current DAC configured to output a drive current of an ultrasonic transducer to transmit and receive ultrasound, and a waveform generator configured to output a control signal from the high voltage current DAC to the high voltage current DAC with a predetermined timing. The control signal configured to output the drive current with a desired magnitude.

Abstract: A transmission circuit for use with an ultrasonic probe including an ultrasonic transducer is provided. The transmission circuit includes a high voltage current DAC configured to output a drive current of an ultrasonic transducer to transmit and receive ultrasound, and a waveform generator configured to output a control signal from the high voltage current DAC to the high voltage current DAC with a predetermined timing. The control signal configured to output the drive current with a desired magnitude.

Abstract: An ultrasound imaging system (100). An exemplary system (100) includes a plurality of transducer elements (136) formed in subarrays (140) and a plurality of subarray circuit units (160?), with each circuit unit (160?) connected to a subarray (140) of the transducer elements (136). The circuitry in each unit (160?) comprises a plurality of integrated circuits (330, 340, 350), with at least a first (340) of the integrated circuits formed over a second (330) of the integrated circuits in a stacked configuration. In an example illustration the first integrated circuit (340) includes a first plurality of first bond pads (345) along a surface (342) thereof and the second integrated circuit (330) includes a second plurality of second bond pads (335) along a surface (331) thereof, with bond wires (344) extending between pairs of first and second bond pads to provide input/output signal connections therebetween.

Abstract: An ultrasound imaging system (100). An exemplary system (100) includes a plurality of transducer elements (136) formed in subarrays (140) and a plurality of subarray circuit units (160?), with each circuit unit (160?) connected to a subarray (140) of the transducer elements (136). The circuitry in each unit (160?) comprises a plurality of integrated circuits (330, 340, 350), with at least a first (340) of the integrated circuits formed over a second (330) of the integrated circuits in a stacked configuration. In an example illustration the first integrated circuit (340) includes a first plurality of first bond pads (345) along a surface (342) thereof and the second integrated circuit (330) includes a second plurality of second bond pads (335) along a surface (331) thereof, with bond wires (344) extending between pairs of first and second bond pads to provide input/output signal connections therebetween.

Abstract: An ultrasound imaging system (100). An exemplary system (100) includes a plurality of transducer elements (136) formed in subarrays (140) and a plurality of subarray circuit units (160?), with each circuit unit (160?) connected to a subarray (140) of the transducer elements (136). The circuitry in each unit (160?) comprises a plurality of integrated circuits (330, 340, 350), with at least a first (340) of the integrated circuits formed over a second (330) of the integrated circuits in a stacked configuration. In an example illustration the first integrated circuit (340) includes a first plurality of first bond pads (345) along a surface (342) thereof and the second integrated circuit (330) includes a second plurality of second bond pads (335) along a surface (331) thereof, with bond wires (344) extending between pairs of first and second bond pads to provide input/output signal connections therebetween.

Abstract: Systems and methods for adjusting gain are described. The systems includes a probe. The probe includes a housing, a transducer element configured to receive a signal, and an adjustable gain amplifier located inside the housing and configured to adjust a gain provided to the signal based on a function having a slope other than zero.

Abstract: An ultrasound imaging system (100). An exemplary system (100) includes a plurality of transducer elements (136) formed in subarrays (140) and a plurality of subarray circuit units (160?), with each circuit unit (160?) connected to a subarray (140) of the transducer elements (136). The circuitry in each unit (160?) comprises a plurality of integrated circuits (330, 340, 350), with at least a first (340) of the integrated circuits formed over a second (330) of the integrated circuits in a stacked configuration. In an example illustration the first integrated circuit (340) includes a first plurality of first bond pads (345) along a surface (342) thereof and the second integrated circuit (330) includes a second plurality of second bond pads (335) along a surface (331) thereof, with bond wires (344) extending between pairs of first and second bond pads to provide input/output signal connections therebetween.

Abstract: Systems and methods for adjusting gain are described. The systems includes a probe. The probe includes a housing, a transducer element configured to receive a signal, and an adjustable gain amplifier located inside the housing and configured to adjust a gain provided to the signal based on a function having a slope other than zero.