Abstract: The invention relates to an electrical transmission arrangement comprising a first strip-line conductor which has its main extension in a first direction in a first plane in the transmission arrangement and comprises a conductor, an upper ground plane which is situated at an upper distance from the conductor and a lower ground plane which is situated at a lower distance from the conductor, and a second strip-line conductor which has its main extension in a second direction in a second plane in the transmission arrangement and comprises a conductor, an upper ground plane which is situated at an upper distance from the conductor and a lower ground plane which is situated at a lower distance from the conductor, where the ground planes are separated from their respective conductors and from one another by a dielectric material, in which transmission arrangement the lower ground plane of the first strip-line conductors coincides with the upper ground plane of the second strip-line conductors at at least one point.

Abstract: The invention relates to an electrical transmission arrangement comprising a first section of a conductor with a main extension in a first and a second plane, and a first section of a ground plane which extends essentially in parallel with the first conductor section on a first side thereof, at a certain first distance therefrom and has a main extension in the same two planes as the first conductor section, which first conductor section and first ground plane section together are included in a microstrip arrangement, and a second section of the same conductor, a second and a third ground plane section, where the second and third ground plane sections extend essentially in parallel with the second conductor section on a first and, respectively, second side thereof at a second and, respectively, third distance therefrom, where the second conductor section and the second and third ground plane sections are included in a strip-line arrangement, in which transmission arrangement the conductor sections are separate

Abstract: The invention relates to an electrical transmission arrangement comprising a first section of a conductor with a main extension in two planes, and a first section of a ground plane which extends essentially in parallel with the conductor section on the first side of the conductor section and has a main extension in the same two planes as the conductor section.

Abstract: The present invention relates to a multilayer printed circuit board arrangement which results in better matching between a stripline (9) and a microstrip (4) in a cavity (6). The solution comprises the use of an asymmetric stripline (9) where the electric field is tied primarily to the lower earth plane (10). This results in good matching at the transition to the microstrip (4), whose field is tied to the lower earth plane (10).

Abstract: The present invention relates to an arrangement in multilayer printed circuit boards, with the aim of improving matching in transitions between symmetric striplines (3) and asymmetric striplines (4). The requirement of a coverpad (6) for contact between the via (5) and the asymmetric stripline (4) for dimension reasons among other things, results in matching problems. In order to avoid this problem, the earth plane (7, 10) nearest the transition is moved away in the proximity of the via (5).

Abstract: The present invention relates to an arrangement concerned with multilayer printed circuit boards that enables cavities in said board to be utilized more effectively. A substrate (14) that includes a chip (16) which is connected to the microstrips (17) of the substrate (14) by means of bonding wires (18) is placed on a bonding shelf (13) with the chip (16) orientated towards the bottom of the cavity (6). The microstrips (17) on the substrate (14) therewith come into contact with the microstrips (12) on the bonding shelf (13). The earth plane (15) of the substrate (14) is connected to the upper earth plane (2) by means of bonding wires (19). The arrangement means that the cavity (16) is utilized effectively, at the same time as the substrate (14) protects the underlying chips (7, 16) against mechanical influences.