Patents by Inventor Thomas Heaton
Thomas Heaton has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240105476Abstract: The present disclosure is directed to a coating module including: a coating stage and a plurality of vertical guides configured to perpendicularly extend from the coating stage; a vertical movement mechanism configured to lower a framed panel along the plurality of vertical guides onto the coating stage; an optical alignment tool configured to provide feedback on a lateral alignment between an edge of the coating stage and the framed panel; and a dispensing unit configured to coat a surface of the panel.Type: ApplicationFiled: September 23, 2022Publication date: March 28, 2024Inventors: Whitney BRYKS, Thomas HEATON, Joshua STACEY, Dilan SENEVIRATNE, Cansu ERGENE
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Publication number: 20240096561Abstract: An apparatus, system, and method for in-situ three-dimensional (3D) thin-film capacitor (TFC) are provided. A 3D TFC can include a glass core, a through glass via (TGV) in the glass core including first conductive material, the first conductive material forming a first electrode of the 3D MIM capacitor, a second conductive material acting as a second electrode of the 3D MIM capacitor, and a dielectric material in contact with the first and second conductive materials, the dielectric material extending vertically and horizontally and physically separating the first and second conductive materials.Type: ApplicationFiled: September 20, 2022Publication date: March 21, 2024Inventors: Mahdi Mohammadighaleni, Benjamin Duong, Shayan Kaviani, Joshua Stacey, Miranda Ngan, Dilan Seneviratne, Thomas Heaton, Srinivas Venkata Ramanuja Pietambaram, Whitney Bryks, Jieying Kong
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Patent number: 11935857Abstract: Embodiments described herein include electronic packages and methods of forming such packages. An electronic package includes a package substrate, first conductive pads formed over the package substrate, where the first conductive pads have a first surface area, and second conductive pads over the package substrate, where the second conductive pads have a second surface area greater than the first surface area. The electronic package also includes a solder resist layer over the first and second conductive pads, and a plurality of solder resist openings that expose one of the first or second conductive pads. The solder resist openings of the electronic package may include conductive material that is substantially coplanar with a top surface of the solder resist layer. The electronic package further includes solder bumps over the conductive material in the solder resist openings, where the solder bumps have a low bump thickness variation (BTV).Type: GrantFiled: September 23, 2022Date of Patent: March 19, 2024Assignee: Intel CorporationInventors: Kristof Darmawaikarta, Robert May, Sashi Kandanur, Sri Ranga Sai Boyapati, Srinivas Pietambaram, Steve Cho, Jung Kyu Han, Thomas Heaton, Ali Lehaf, Ravindranadh Eluri, Hiroki Tanaka, Aleksandar Aleksov, Dilan Seneviratne
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Publication number: 20230343723Abstract: Embodiments disclosed herein include electronic packages with thermal solutions. In an embodiment, an electronic package comprises a package substrate, a first die electrically coupled to the package substrate, and an integrated heat spreader (IHS) that is thermally coupled to a surface of the first die. In an embodiment, the IHS comprises a main body having an outer perimeter, and one or more legs attached to the outer perimeter of the main body, wherein the one or more legs are supported by the package substrate. In an embodiment, the electronic package further comprises a thermal block between the package substrate and the main body of the IHS, wherein the thermal block is within the outer perimeter of the main body.Type: ApplicationFiled: June 29, 2023Publication date: October 26, 2023Inventors: Nicholas NEAL, Nicholas S. HAEHN, Sergio CHAN ARGUEDAS, Edvin CETEGEN, Jacob VEHONSKY, Steve S. CHO, Rahul JAIN, Antariksh Rao Pratap SINGH, Tarek A. IBRAHIM, Thomas HEATON
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Patent number: 11776864Abstract: Embodiments disclosed herein include electronic packages and methods of forming such packages. In an embodiment an electronic package comprises a package substrate, and a first level interconnect (FLI) bump region on the package substrate. In an embodiment, the FLI bump region comprises a plurality of pads, and a plurality of bumps, where each bump is over a different one of the plurality of pads. In an embodiment, the electronic package further comprises a guard feature adjacent to the FLI bump region. In an embodiment, the guard feature comprises, a guard pad, and a guard bump over the guard pad, wherein the guard feature is electrically isolated from circuitry of the electronic package.Type: GrantFiled: July 15, 2019Date of Patent: October 3, 2023Assignee: Intel CorporationInventors: Jacob Vehonsky, Nicholas S. Haehn, Thomas Heaton, Steve S. Cho, Rahul Jain, Tarek Ibrahim, Antariksh Rao Pratap Singh, Edvin Cetegen, Nicholas Neal, Sergio Chan Arguedas
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Patent number: 11699648Abstract: A package assembly includes a substrate and at least a first die having a first contact array and a second contact array. First and second via assemblies are respectively coupled with the first and second contact arrays. Each of the first and second via assemblies includes a base pad, a cap assembly, and a via therebetween. One or more of the cap assembly or the via includes an electromigration resistant material to isolate each of the base pad and the cap assembly. Each first cap assembly and via of the first via assemblies has a first assembly profile less than a second assembly profile of each second cap assembly and via of the second via assemblies. The first and second cap assemblies have a common applied thickness in an application configuration. The first and second cap assemblies have a thickness variation of ten microns or less in a reflowed configuration.Type: GrantFiled: March 9, 2022Date of Patent: July 11, 2023Assignee: Tahoe Research, Ltd.Inventors: Srinivas V. Pietambaram, Jung Kyu Han, Ali Lehaf, Steve Cho, Thomas Heaton, Hiroki Tanaka, Kristof Darmawikarta, Robert Alan May, Sri Ranga Sai Boyapati
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Publication number: 20230015619Abstract: Embodiments described herein include electronic packages and methods of forming such packages. An electronic package includes a package substrate, first conductive pads formed over the package substrate, where the first conductive pads have a first surface area, and second conductive pads over the package substrate, where the second conductive pads have a second surface area greater than the first surface area. The electronic package also includes a solder resist layer over the first and second conductive pads, and a plurality of solder resist openings that expose one of the first or second conductive pads. The solder resist openings of the electronic package may include conductive material that is substantially coplanar with a top surface of the solder resist layer. The electronic package further includes solder bumps over the conductive material in the solder resist openings, where the solder bumps have a low bump thickness variation (BTV).Type: ApplicationFiled: September 23, 2022Publication date: January 19, 2023Inventors: Kristof DARMAWAIKARTA, Robert MAY, Sashi KANDANUR, Sri Ranga Sai BOYAPATI, Srinivas PIETAMBARAM, Steve CHO, Jung Kyu HAN, Thomas HEATON, Ali LEHAF, Ravindranadh ELURI, Hiroki TANAKA, Aleksandar ALEKSOV, Dilan SENEVIRATNE
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Patent number: 11488918Abstract: Embodiments described herein include electronic packages and methods of forming such packages. An electronic package includes a package substrate, first conductive pads formed over the package substrate, where the first conductive pads have a first surface area, and second conductive pads over the package substrate, where the second conductive pads have a second surface area greater than the first surface area. The electronic package also includes a solder resist layer over the first and second conductive pads, and a plurality of solder resist openings that expose one of the first or second conductive pads. The solder resist openings of the electronic package may include conductive material that is substantially coplanar with a top surface of the solder resist layer. The electronic package further includes solder bumps over the conductive material in the solder resist openings, where the solder bumps have a low bump thickness variation (BTV).Type: GrantFiled: October 31, 2018Date of Patent: November 1, 2022Assignee: Intel CorporationInventors: Kristof Darmawaikarta, Robert May, Sashi Kandanur, Sri Ranga Sai Boyapati, Srinivas Pietambaram, Steve Cho, Jung Kyu Han, Thomas Heaton, Ali Lehaf, Ravindranadh Eluri, Hiroki Tanaka, Aleksandar Aleksov, Dilan Seneviratne
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Publication number: 20220199515Abstract: A package assembly includes a substrate and at least a first die having a first contact array and a second contact array. First and second via assemblies are respectively coupled with the first and second contact arrays. Each of the first and second via assemblies includes a base pad, a cap assembly, and a via therebetween. One or more of the cap assembly or the via includes an electromigration resistant material to isolate each of the base pad and the cap assembly. Each first cap assembly and via of the first via assemblies has a first assembly profile less than a second assembly profile of each second cap assembly and via of the second via assemblies. The first and second cap assemblies have a common applied thickness in an application configuration. The first and second cap assemblies have a thickness variation of ten microns or less in a reflowed configuration.Type: ApplicationFiled: March 9, 2022Publication date: June 23, 2022Inventors: Srinivas V. PIETAMBARAM, Jung Kyu HAN, Ali LEHAF, Steve CHO, Thomas HEATON, Hiroki TANAKA, Kristof DARMAWIKARTA, Robert Alan MAY, Sri Ranga Sai BOYAPATI
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Patent number: 11309239Abstract: A package assembly includes a substrate and at least a first die having a first contact array and a second contact array. First and second via assemblies are respectively coupled with the first and second contact arrays. Each of the first and second via assemblies includes a base pad, a cap assembly, and a via therebetween. One or more of the cap assembly or the via includes an electromigration resistant material to isolate each of the base pad and the cap assembly. Each first cap assembly and via of the first via assemblies has a first assembly profile less than a second assembly profile of each second cap assembly and via of the second via assemblies. The first and second cap assemblies have a common applied thickness in an application configuration. The first and second cap assemblies have a thickness variation of ten microns or less in a reflowed configuration.Type: GrantFiled: October 20, 2020Date of Patent: April 19, 2022Assignee: Intel CorporationInventors: Srinivas Pietambaram, Jung Kyu Han, Ali Lehaf, Steve Cho, Thomas Heaton, Hiroki Tanaka, Kristof Darmawikarta, Robert Alan May, Sri Ranga Sai Boyapati
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Publication number: 20210082852Abstract: Embodiments of the present disclosure may generally relate to systems, apparatus, and/or processes directed to manufacturing a package having a substrate with a first side and a second side opposite the first side, where a copper layer is coupled with a first region of the first side of the substrate and includes a plurality of bumps coupled with the first region of the first side of the substrate where one or more second regions on the first side of the substrate not coupled with a copper layer, and where a layout of the one or more second regions on the first side of the substrate is to vary a growth, respectively, of each of the plurality of bumps during a plating process by modifying a local copper density of each of the plurality of bumps.Type: ApplicationFiled: September 16, 2019Publication date: March 18, 2021Inventors: Bradon C. MARIN, Jung Kyu HAN, Thomas HEATON, Ali LEHAF, Rahul MANEPALLI, Srinivas PIETAMBARAM, Jacob VEHONSKY
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Publication number: 20210066162Abstract: A device is disclosed. The device includes a substrate, a die on the substrate, a thermal interface material (TIM) on the die, and solder bumps on a periphery of a top surface of the substrate. An integrated heat spreader (IHS) is formed on the solder bumps. The IHS covers the TIM.Type: ApplicationFiled: August 30, 2019Publication date: March 4, 2021Inventors: Sergio A. CHAN ARGUEDAS, Nicholas S. HAEHN, Edvin CETEGEN, Nicholas NEAL, Jacob VEHONSKY, Steve S. CHO, Rahul JAIN, Antariksh Rao Pratap SINGH, Tarek A. IBRAHIM, Thomas HEATON, Vipul MEHTA
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Publication number: 20210035901Abstract: A package assembly includes a substrate and at least a first die having a first contact array and a second contact array. First and second via assemblies are respectively coupled with the first and second contact arrays. Each of the first and second via assemblies includes a base pad, a cap assembly, and a via therebetween. One or more of the cap assembly or the via includes an electromigration resistant material to isolate each of the base pad and the cap assembly. Each first cap assembly and via of the first via assemblies has a first assembly profile less than a second assembly profile of each second cap assembly and via of the second via assemblies. The first and second cap assemblies have a common applied thickness in an application configuration. The first and second cap assemblies have a thickness variation of ten microns or less in a reflowed configuration.Type: ApplicationFiled: October 20, 2020Publication date: February 4, 2021Inventors: Srinivas V. PIETAMBARAM, Jung Kyu HAN, Ali LEHAF, Steve CHO, Thomas HEATON, Hiroki TANAKA, Kristof DARMAWIKARTA, Robert Alan MAY, Sri Ranga Sai BOYAPATI
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Publication number: 20210035921Abstract: Embodiments disclosed herein include electronic packages with thermal solutions. In an embodiment, an electronic package comprises a package substrate, a first die electrically coupled to the package substrate, and an integrated heat spreader (IHS) that is thermally coupled to a surface of the first die. In an embodiment, the IHS comprises a main body having an outer perimeter, and one or more legs attached to the outer perimeter of the main body, wherein the one or more legs are supported by the package substrate. In an embodiment, the electronic package further comprises a thermal block between the package substrate and the main body of the IHS, wherein the thermal block is within the outer perimeter of the main body.Type: ApplicationFiled: July 30, 2019Publication date: February 4, 2021Inventors: Nicholas NEAL, Nicholas S. HAEHN, Sergio CHAN ARGUEDAS, Edvin CETEGEN, Jacob VEHONSKY, Steve S. CHO, Rahul JAIN, Antariksh Rao Pratap SINGH, Tarek A. IBRAHIM, Thomas HEATON
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Publication number: 20210020532Abstract: Embodiments disclosed herein include electronic packages and methods of forming such packages. In an embodiment an electronic package comprises a package substrate, and a first level interconnect (FLI) bump region on the package substrate. In an embodiment, the FLI bump region comprises a plurality of pads, and a plurality of bumps, where each bump is over a different one of the plurality of pads. In an embodiment, the electronic package further comprises a guard feature adjacent to the FLI bump region. In an embodiment, the guard feature comprises, a guard pad, and a guard bump over the guard pad, wherein the guard feature is electrically isolated from circuitry of the electronic package.Type: ApplicationFiled: July 15, 2019Publication date: January 21, 2021Inventors: Jacob VEHONSKY, Nicholas S. HAEHN, Thomas HEATON, Steve S. CHO, Rahul JAIN, Tarek IBRAHIM, Antariksh Rao Pratap SINGH, Edvin CETEGEN, Nicholas NEAL, Sergio CHAN ARGUEDAS
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Publication number: 20210020531Abstract: Embodiments disclosed herein include electronic packages with underfill flow control features. In an embodiment, an electronic package comprises a package substrate and a plurality of interconnects on the package substrate. In an embodiment, a die is coupled to the package substrate by the plurality of interconnects and a flow control feature is adjacent on the package substrate. In an embodiment, the flow control feature is electrically isolated from circuitry of the electronic package. In an embodiment, the electronic package further comprises an underfill surrounding the plurality of interconnects and in contact with the flow control feature.Type: ApplicationFiled: July 15, 2019Publication date: January 21, 2021Inventors: Edvin CETEGEN, Jacob VEHONSKY, Nicholas S. HAEHN, Thomas HEATON, Steve S. CHO, Rahul JAIN, Tarek IBRAHIM, Antariksh Rao Pratap SINGH, Nicholas NEAL, Sergio CHAN ARGUEDAS, Vipul MEHTA
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Patent number: 10854541Abstract: A package assembly includes a substrate and at least a first die having a first contact array and a second contact array. First and second via assemblies are respectively coupled with the first and second contact arrays. Each of the first and second via assemblies includes a base pad, a cap assembly, and a via therebetween. One or more of the cap assembly or the via includes an electromigration resistant material to isolate each of the base pad and the cap assembly. Each first cap assembly and via of the first via assemblies has a first assembly profile less than a second assembly profile of each second cap assembly and via of the second via assemblies. The first and second cap assemblies have a common applied thickness in an application configuration. The first and second cap assemblies have a thickness variation of ten microns or less in a reflowed configuration.Type: GrantFiled: August 28, 2019Date of Patent: December 1, 2020Assignee: Intel CorporationInventors: Srinivas Pietambaram, Jung Kyu Han, Ali Lehaf, Steve Cho, Thomas Heaton, Hiroki Tanaka, Kristof Darmawikarta, Robert Alan May, Sri Ranga Sai Boyapati
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Publication number: 20200135679Abstract: Embodiments described herein include electronic packages and methods of forming such packages. An electronic package includes a package substrate, first conductive pads formed over the package substrate, where the first conductive pads have a first surface area, and second conductive pads over the package substrate, where the second conductive pads have a second surface area greater than the first surface area. The electronic package also includes a solder resist layer over the first and second conductive pads, and a plurality of solder resist openings that expose one of the first or second conductive pads. The solder resist openings of the electronic package may include conductive material that is substantially coplanar with a top surface of the solder resist layer. The electronic package further includes solder bumps over the conductive material in the solder resist openings, where the solder bumps have a low bump thickness variation (BTV).Type: ApplicationFiled: October 31, 2018Publication date: April 30, 2020Inventors: Kristof DARMAWAIKARTA, Robert MAY, Sashi KANDANUR, Sri Ranga Sai BOYAPATI, Srinivas PIETAMBARAM, Steve CHO, Jung Kyu HAN, Thomas HEATON, Ali LEHAF, Ravindranadh ELURI, Hiroki TANAKA, Aleksandar ALEKSOV, Dilan SENEVIRATNE
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Publication number: 20200006273Abstract: A microelectronic device is formed including two or more structures physically and electrically engaged with one another through coupling of conductive features on the two structures. The conductive features may be configured to be tolerant of bump thickness variation in either of the structures. Such bump thickness variation tolerance can result from a contact structure on a first structure including a protrusion configured to extend in the direction of the second structure and to engage a deformable material on that second structure.Type: ApplicationFiled: June 28, 2018Publication date: January 2, 2020Inventors: Manish Dubey, Kousik Ganesan, Suddhasattwa Nad, Thomas Heaton, Sri Chaitra Jyotsna Chavali, Amruthavalli Pallavi Alur
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Publication number: 20190393145Abstract: A package assembly includes a substrate and at least a first die having a first contact array and a second contact array. First and second via assemblies are respectively coupled with the first and second contact arrays. Each of the first and second via assemblies includes a base pad, a cap assembly, and a via therebetween. One or more of the cap assembly or the via includes an electromigration resistant material to isolate each of the base pad and the cap assembly. Each first cap assembly and via of the first via assemblies has a first assembly profile less than a second assembly profile of each second cap assembly and via of the second via assemblies. The first and second cap assemblies have a common applied thickness in an application configuration. The first and second cap assemblies have a thickness variation of ten microns or less in a reflowed configuration.Type: ApplicationFiled: August 28, 2019Publication date: December 26, 2019Inventors: Srinivas V. Pietambaram, Jung Kyu Han, Ali Lehaf, Steve Cho, Thomas Heaton, Hiroki Tanaka, Kristof Darmawikarta, Robert Alan May, Sri Ranga Sai Boyapati