Abstract: The invention also relates to antigen binding proteins and related fragments thereof for binding Von Willebrand factor (VWF) and uses thereof. In one aspect, the present invention provides an antigen binding protein comprising an antigen binding domain that binds to or specifically binds to Von Willebrand factor (VWF) under shear gradient conditions. Preferably, the antigen binding protein comprises an antigen binding domain that does not bind to VWF under constant shear conditions.

Abstract: A package for an optoelectronic semiconductor component is disclosed. The package includes a package body, a first connecting lead and a second connecting lead. The first connecting lead and the second connecting lead each extend in a vertical direction through the package body. A semiconductor component with such a package and a semiconductor chip are also disclosed.

Abstract: A surface-mountable device (100) is specified, having a mounting side (101), a top side (102) lying opposite the mounting side (101), an electrically insulating carrier plate (1), an electrical component (2) and a housing (3). The carrier plate (1) terminates the device (100) toward the mounting side (101). Furthermore, the carrier plate (1) has a fixing side (103) lying opposite the mounting side (101). For the purpose of making electrical contact with the component (2), the carrier plate (1) has conductor tracks (4) arranged on the fixing side (103), contact areas (5) arranged on the mounting side (101), and openings (6), wherein in each case a contact area (5) is electrically conductively connected to a conductor track (4) by an opening (6). The component (2) is enclosed by the housing (3), wherein at least one opening (6) is arranged below the component (2). The housing (3) and the carrier plate (1) are arranged flush with one another in a plan view of the carrier plate (1).

Abstract: A package for an optoelectronic semiconductor component is disclosed. The package includes a package body, a first connecting lead and a second connecting lead. The first connecting lead and the second connecting lead each extend in a vertical direction through the package body. A semiconductor component with such a package and a semiconductor chip are also disclosed.

Abstract: A surface-mountable device (100) is specified, comprising a mounting side (101), a top side (102) lying opposite the mounting side (101), an electrically insulating carrier plate (1), an electrical component (2) and a housing (3). The carrier plate (1) terminates the device (100) toward the mounting side (101). Furthermore, the carrier plate (1) has a fixing side (103) lying opposite the mounting side (101). For the purpose of making electrical contact with the component (2), the carrier plate (1) has conductor tracks (4) arranged on the fixing side (103), contact areas (5) arranged on the mounting side (101), and openings (6), wherein in each case a contact area (5) is electrically conductively connected to a conductor track (4) by means of an opening (6). The component (2) is enclosed by the housing (3), wherein at least one opening (6) is arranged below the component (2). The housing (3) and the carrier plate (1) are arranged flush with one another in a plan view of the carrier plate (1).

Abstract: The invention is directed to a tilt sensor comprising at least one body movable along a predefined path and an optoelectronic unit for determining the position of said body, said tilt sensor being surface-mountable. The invention is further directed to a tilt sensor assembly.

Abstract: An electronic device according to the invention includes a housing, a recess containing an optoelectronic component, and a film including a polyimide, which is over the recess covering the optoelectronic component.

Abstract: The invention is directed to a tilt sensor comprising at least one body movable along a predefined path and an optoelectronic unit for determining the position of said body, said tilt sensor being surface-mountable. The invention is further directed to a tilt sensor assembly.

Abstract: An electronic device according to the invention includes a housing, a recess containing an optoelectronic component, and a film including a polyimide, which is over the recess covering the optoelectronic component.