Patents by Inventor Thomas HOREDT

Thomas HOREDT has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10366946
    Abstract: A connection member for connecting an electronic chip, wherein the connection member comprises a bulk body, and a coating at least partially coating the bulk body and comprising a material having higher electric and higher thermal conductivity than the bulk body, wherein a ratio between a thickness of the coating and a thickness of the bulk body is at least 0.0016 at at least a part of the connection member.
    Type: Grant
    Filed: October 30, 2017
    Date of Patent: July 30, 2019
    Assignee: Infineon Technologies AG
    Inventors: Wu Hu Li, Edmund Riedl, Thomas Horedt, Ali Mazloum-Nejadari
  • Publication number: 20190131218
    Abstract: A connection member for connecting an electronic chip, wherein the connection member comprises a bulk body, and a coating at least partially coating the bulk body and comprising a material having higher electric and higher thermal conductivity than the bulk body, wherein a ratio between a thickness of the coating and a thickness of the bulk body is at least 0.0016 at at least a part of the connection member.
    Type: Application
    Filed: October 30, 2017
    Publication date: May 2, 2019
    Inventors: Wu Hu LI, Edmund RIEDL, Thomas HOREDT, Ali MAZLOUM-NEJADARI