Patents by Inventor Thomas Hunger

Thomas Hunger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Medical flushing pump comprising two suction lines
    Patent number: 11925744
    Abstract: The present invention relates to a device for flushing a body cavity with a fluid, the fluid being pumped by means of two lines from the body cavity. The respective pumping capacity is regulated via controllable pinch valves, the two pinch valves being coupled in an antiparallel manner.
    Type: Grant
    Filed: December 4, 2019
    Date of Patent: March 12, 2024
    Assignee: W.O.M. WORLD OF MEDICINE GMBH
    Inventors: Christian Hunger, Lucile Tartivel, Jan Hendrik Carstens, Mike Plessner, Nils Gelbert, Stan Schnuettgen, Oliver Rath, Thomas Christmann
  • Circuit carrier, method for producing a circuit carrier, method for producing a circuit arrangement, method for operating a circuit arrangement and method for producing a semiconductor module
    Patent number: 9651979
    Abstract: A circuit carrier includes a dielectric isolation carrier, an upper metallization layer applied to the dielectric isolation carrier, and a dielectric coating. The upper metallization layer has a metallization section which has an underside facing the isolation carrier, a top side facing away from the isolation carrier, and a side surface closed in a ring-shaped fashion. The side surface laterally delimits the metallization section and extends continuously between the top side and the underside. The dielectric coating is on the side surface and the top side, and extends continuously from the side surface onto the top side.
    Type: Grant
    Filed: October 28, 2015
    Date of Patent: May 16, 2017
    Assignee: Infineon Technologies AG
    Inventors: Thomas Hunger, Carsten Ehlers
  • Circuit Carrier, Method for Producing a Circuit Carrier, Method for Producing a Circuit Arrangement, Method for Operating a Circuit Arrangement and Method for Producing a Semiconductor Module
    Publication number: 20160132069
    Abstract: A circuit carrier includes a dielectric isolation carrier, an upper metallization layer applied to the dielectric isolation carrier, and a dielectric coating. The upper metallization layer has a metallization section which has an underside facing the isolation carrier, a top side facing away from the isolation carrier, and a side surface closed in a ring-shaped fashion. The side surface laterally delimits the metallization section and extends continuously between the top side and the underside. The dielectric coating is on the side surface and the top side, and extends continuously from the side surface onto the top side.
    Type: Application
    Filed: October 28, 2015
    Publication date: May 12, 2016
    Inventors: Thomas Hunger, Carsten Ehlers
  • Power semiconductor module including a multilayer substrate
    Patent number: 8018047
    Abstract: A semiconductor module includes a multilayer substrate. The multilayer substrate includes a first metal layer and a first ceramic layer over the first metal layer. An edge of the first ceramic layer extends beyond an edge of the first metal layer. The multilayer substrate includes a second metal layer over the first ceramic layer and a second ceramic layer over the second metal layer. An edge of the second ceramic layer extends beyond an edge of the second metal layer. The multilayer substrate includes a third metal layer over the second ceramic layer.
    Type: Grant
    Filed: November 24, 2009
    Date of Patent: September 13, 2011
    Assignee: Infineon Technologies AG
    Inventors: Reinhold Bayerer, Thomas Hunger
  • POWER SEMICONDUCTOR MODULE
    Publication number: 20100065962
    Abstract: A semiconductor module includes a multilayer substrate. The multilayer substrate includes a first metal layer and a first ceramic layer over the first metal layer. An edge of the first ceramic layer extends beyond an edge of the first metal layer. The multilayer substrate includes a second metal layer over the first ceramic layer and a second ceramic layer over the second metal layer. An edge of the second ceramic layer extends beyond an edge of the second metal layer. The multilayer substrate includes a third metal layer over the second ceramic layer.
    Type: Application
    Filed: November 24, 2009
    Publication date: March 18, 2010
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Reinhold Bayerer, Thomas Hunger