Abstract: A device for holding disk-shaped objects, particularly semiconductor wafers, having at least three contact elements for depositing and/or fixing the disk-shaped object at its outer edge area. The contact elements are designed such that they have an incline facing the object and a supporting surface.

Abstract: A device for recording a number of images of disk-shaped objects (6), which is provided with at least two lighting device (8), which are designed so that the light exiting the lighting devices (8) is spectrally variable. A single recording device (12) is arranged in relation to the disk-shaped object so that the recording device (12) simultaneously records a number of spectrally variable images of the disk-shaped object (6).

Abstract: An apparatus for holding disk-like objects, in particular semiconductor wafers (12), with at least three contacting elements (18) for supporting and/or fixing the disk-like object at its outer edge region (22). It is provided that at least one of the contacting elements (18) is moveable.

Abstract: A method of determining geometric parameters of a wafer (16) is disclosed. For this purpose, the wafer (16) is inserted in a wafer holder (30). The wafer holder (30) is equipped with at least three mechanical contacting elements (22). The wafer is in mechanical contact with the contacting elements (22). The contacting elements (22) are distributed on the wafer holder (30) in such a way that they define a geometric figure which is configured such that the center point (40) of the wafer (16) comes to lie within the geometric figure. The position of each contacting element (22) is determined. Each desired geometric parameter of the wafer (16) is then calculated from the position of the contacting elements (22).

Abstract: An optical measurement system having a spectrophotometer and a ellipsometer is calibrated, the spectrophotometer and the ellipsometer first being calibrated independently of one another. A spectrophotometer layer thickness (dphoto) of a specimen is then determined at an initial angle of incidence (?init) using the spectrophotometer. An ellipsometer layer thickness (delli) of the specimen is then determined using the layer thickness determined with the ellipsometer. The spectrophotometer and the ellipsometer are matched to one another by varying the initial angle of incidence (?init) until the absolute value of the difference between the spectrophotometer layer thickness (dphoto) and the ellipsometer layer thickness (delli) is less than a predefined absolute value.

Abstract: An optical measurement system having a spectrophotometer and a ellipsometer is calibrated, the spectrophotometer and the ellipsometer first being calibrated independently of one another. A spectrophotometer layer thickness (dphoto) of a specimen is then determined at an initial angle of incidence (?init) using the spectrophotometer. An ellipsometer layer thickness (delli) of the specimen is then determined using the layer thickness determined with the ellipsometer. The spectrophotometer and the ellipsometer are matched to one another by varying the initial angle of incidence (?init) until the absolute value of the difference between the spectrophotometer layer thickness (dphoto) and the ellipsometer layer thickness (delli) is less than a predefined absolute value.

Abstract: A system (100, 200, 300) for inspecting a disc-shaped object is disclosed. The system (100, 200, 300) comprises a loading unit for disc-shaped objects 4 and a device 1 for simultaneously imaging the front side and back side of the disc-shaped object 4.

Abstract: An apparatus for inspecting the front side and the back side 2, 3 of a disc-shaped object 4 is disclosed. A detection unit 5 has a first detector element 6 facing the front side 2 and a second detector element 7 facing the back side of the disc-shaped object 4. Furthermore, a means 8 is provided for generating a relative movement between the detection unit 5 and the disc-shaped object 4 so that an image is made of the front side and the back side 2, 3 of the disc-shaped object 4.

Abstract: A sample P is illuminated by a measurement light beam with an incidence angle differing from 0°; light reflected therefrom is detected; intensity values are recorded and evaluated; and the opening of a field stop is imaged onto a receiving surface, thereby generating an image. In such a method, a value of “light” or “dark” is allocated to each intensity value as a function of a brightness threshold; the smallest rectangle that encloses all “light” positions on the receiving surface is determined; the geometric center point of that rectangle is determined; the position of that point is compared with the position on the receiving surface that corresponds to the geometric center point of the image generated by the field stop in the focused state; and a change in the distance between the sample and the imaging optical system corresponding to the distance between the two points is effected.

Abstract: An apparatus (2) and a method for acquiring a complete image of a surface (4) of a semiconductor substrate (6) are disclosed. The apparatus encompasses a digital camera (11) having an objective (5) and a CCD chip (12). The objective (5) defines an optical axis (7) that is perpendicular to the CCD chip (12). Also provided is an illumination device (14) that is arranged above the surface (4) of the semiconductor substrate (6). The optical axis (7) forms with the surface (4) of the semiconductor substrate (6) an angle ([alpha]) that is less than 90°.

Abstract: The invention concerns a method for automatic focusing onto the surface of a sample P, in which sample P is illuminated by a measurement light beam 13 that strikes the sample surface at an incidence angle differing from 0°; light reflected therefrom is detected by means of a position-sensitive receiving surface (23); intensity values as allocated to positions on the receiving surface (23) are recorded and evaluated, and the opening of a field stop (7) is imaged onto the receiving surface (23), thereby generating an image that is smaller than the receiving surface (23).