Abstract: An apparatus including a front panel (102) and a bezel (104) coupled to the front panel (102) and having a gasket (110), where the gasket (110) is affixed to the bezel (104) and electrically couples the bezel (104) to the front panel (102). Bezel (104) can be a mezzanine card bezel, a common mezzanine card bezel, and the like. A method of electrically coupling a front panel (102) to a bezel (104) includes providing a front panel (102) having an inner surface (112) defining a cut-out (114). Also, providing a bezel (104) having a perimeter (118), where the inner surface (112) of the cut-out (114) is designed to receive the bezel (104). Affixing a gasket (110) to the perimeter (118) of bezel (104) an the inner surface (112) receiving the bezel (104) where the gasket (110) is designed to be coupled to the inner surface (112), and electrically coupling the bezel (104) to the front panel (102) through the gasket (110).

Abstract: An apparatus for removing heat (118) from a component (102) located on a surface (104) of an electronics module (100). The apparatus includes a heat removal device (108) mounted to electronics module (100) a radial distance (110) away from component (102) and a heat conductor (112) having a first portion (115) coupled to component (102) and a second portion (117) coupled to heat removal device (108).

Abstract: An apparatus including a front panel (102) and a bezel (104) coupled to the front panel (102) and having a gasket (110), where the gasket (110) is affixed to the bezel (104) and electrically couples the bezel (104) to the front panel (102). Bezel (104) can be a mezzanine card bezel, a common mezzanine card bezel, and the like. A method of electrically coupling a front panel (102) to a bezel (104) includes providing a front panel (102) having an inner surface (112) defining a cut-out (114). Also, providing a bezel (104) having a perimeter (118), where the inner surface (112) of the cut-out (114) is designed to receive the bezel (104). Affixing a gasket (110) to the perimeter (118) of bezel (104) an the inner surface (112) receiving the bezel (104) where the gasket (110) is designed to be coupled to the inner surface (112), and electrically coupling the bezel (104) to the front panel (102) through the gasket (110).

Abstract: An apparatus for removing heat (118) from a component (102) located on a surface (104) of an electronics module (100). The apparatus includes a heat removal device (108) mounted to electronics module (100) a radial distance (110) away from component (102) and a heat conductor (112) having a first portion (115) coupled to component (102) and a second portion (117) coupled to heat removal device (108).

Abstract: An acoustic baffle for reflecting sound waves and rejecting background interference noise for use with a hydrophone array. The baffle utilizes a plurality of lenticular resilient elements embedded in a compliant foam elastomer compound. The embedded elements provide control of overall baffle compliance for submarine applications, particularly for high hydrostatic pressure operation. The resilient members are formed from pairs of resilient lenticular shaped elements which are integrally bonded to a highly damped constrained viscoelastic layer to provide uniform noise reduction performance over a broad frequency range. The pairs of elements are joined at their ends by compliant end caps which provide minimum constraint on the motion of the ends, thus limiting bending stresses in the elements.