Patents by Inventor Thomas J. Brunschwiler
Thomas J. Brunschwiler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10091909Abstract: The invention relates to a cooling arrangement comprising a heat spreader (2) comprising a first surface (5), a second surface (8), at least one heat absorption chamber (9) and at least one heat dissipation chamber (10), the at least one heat absorption chamber (9) being in thermal contact with the first surface (5) and the at least one heat dissipation chamber (10) being in thermal contact with the second surface (8) and hydraulically coupled to the at least one heat absorption chamber (9). A cooling fluid (13) can be driven from the heat absorption chamber (9) to the heat dissipation chamber (10) using a plurality of flow patterns for cooling the first surface (5).Type: GrantFiled: February 26, 2015Date of Patent: October 2, 2018Assignee: GLOBALFOUNDRIES INC.Inventors: Thomas J. Brunschwiler, Urs Kloter, Ryan Joseph Linderman, Bruno Michel, Hugo E. Rothuizen, Reio Waelchli
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Patent number: 10068839Abstract: A circuitized substrate for mounting at least one electronic component having a plurality of terminals. The circuitized substrate includes a first portion of electrical insulating material embedding a first electric circuit for coupling a first subset of the terminals. The first electric circuit including one or more patterned conductive layers of electrically conductive material extending parallel to a plane of the circuitized substrate. The circuitized substrate further includes a second portion of electrically conductive material. One or more insulating elements of electrical insulating material cross the second portion transversally to the plane to insulate a plurality of conductive elements thereof for coupling a second subset of the terminals. One or more auxiliary components of the electronic component are mounted on the second portion. Each auxiliary component having a first terminal and a second terminal coupled with a first one and a second one, respectively, of a pair of the conductive elements.Type: GrantFiled: November 3, 2016Date of Patent: September 4, 2018Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Thomas J. Brunschwiler, Sebastian Gerke, Stefano Sergio Oggioni
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Patent number: 10041709Abstract: Adsorption heat exchanger devices (11, 25) are provided for use in solid sorption refrigeration systems (1) together with methods for making such devices and adsorbent structures therefor. The methods include applying a curable binder, in solution in a solvent, to granular adsorbent material, and then evaporating the solvent and curing the binder. The curable binder solution is sufficiently dilute that, during evaporation of the solvent, the binder becomes concentrated around contact points between granules (18) of the adsorbent material whereby localized bonds (19) are formed around the contact points on curing of the binder.Type: GrantFiled: January 23, 2017Date of Patent: August 7, 2018Assignee: International Business Machines CorporationInventors: Thomas J. Brunschwiler, Javier V. Goicochea, Bruno Michel, Patrick Ruch
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Publication number: 20180182686Abstract: A structure for cooling an integrated circuit. The structure may include; an interposer cold plate having at least two expanding channels, each expanding channel having a flow direction from a channel inlet to a channel outlet, the flow direction having different directions for at least two of the at least two expanding channels, the channel inlet having an inlet width and the channel outlet having an outlet width, wherein the inlet width is less than the outlet width.Type: ApplicationFiled: February 13, 2018Publication date: June 28, 2018Inventors: Thomas J. Brunschwiler, Timothy J. Chainer, Evan G. Colgan, Arvind Raj Mahankali Sridhar, Chin Lee Ong, Pritish R. Parida, Gerd Schlottig, Mark D. Schultz, Joel A. Silberman
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Patent number: 10006571Abstract: Conduit connectors for liquid manifolds and methods of fabrication are provided. In one embodiment, a conduit connector is integrated, at least in part, within a liquid manifold, and includes a conduit-receiving opening or socket and at least one releasable retention component. The conduit-receiving opening is disposed within the liquid manifold and in fluid communication with at least one liquid-carrying channel of the liquid manifold. The releasable retention component(s) is selectively operative to threadlessly secure in a fluid-tight manner a conduit within the conduit-receiving opening in fluid communication with the at least one liquid-carrying channel of the liquid manifold to facilitate flow of liquid through the liquid-carrying channel(s), or to release the conduit from the conduit-receiving opening of the conduit connector. The releasable retention component(s) resides at least partially within the liquid manifold when operatively holding the conduit within the conduit-receiving opening.Type: GrantFiled: August 27, 2014Date of Patent: June 26, 2018Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Thomas J. Brunschwiler, Evan G. Colgan, Michael J. Ellsworth, Jr., Gerd Schlottig
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Patent number: 10008474Abstract: Embodiments of the invention are directed to an integrated circuit (IC) package assembly, including: one or more printed circuit boards (PCBs); and a set of chip packages, each including: an overmold; and an IC chip, overmolded in the overmold, and wherein: the chip packages are stacked transversely to an average plane of each of the chip packages, thereby forming a stack wherein a main surface of one of the chip packages faces a main surface of another one of the chip packages; and each of the chip packages is laterally soldered to one or more of said one or more PCBs and arranged transversally to each of said one or more PCBs, whereby an average plane of each of said one or more PCBs extends transversely to the average plane of each of the chip packages of the stack. Further embodiments are directed to related devices and fabrication methods.Type: GrantFiled: July 11, 2016Date of Patent: June 26, 2018Assignee: International Business Machines CorporationInventors: Thomas J. Brunschwiler, Andreas Christian Doering, Ronald Peter Luijten, Stefano Sergio Oggioni, Patricia Maria Sagmeister, Martin Leo Schmatz
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Publication number: 20180159431Abstract: An integrated circuit module including at least one semiconductor chip. The at least one semiconductor chip includes a plurality of voltage converters and switching circuitry for connecting an input terminal of one of the plurality of voltage converters to an input power supply rail and an output terminal of at least one of the plurality of voltage converters to an output supply rail. The switching circuitry is, dependent on at least one input signal, operable for selectively establishing for at least two of the plurality of voltage converters one out of the group including a parallel connection of the at least two voltage converters, a serially cascaded connection of the at least two voltage converters, and a stacked serial connection of the at least two voltage converters.Type: ApplicationFiled: December 2, 2016Publication date: June 7, 2018Inventors: Thomas J. Brunschwiler, Arvind Raj Sridhar, Jochen Supper, Klaus Thumm, Volker Trost
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Publication number: 20180149294Abstract: Conduit connectors for liquid manifolds and methods of fabrication are provided. In one embodiment, a conduit connector is recessed, at least in part, within a liquid manifold, and includes a conduit-receiving opening or socket and at least one releasable retention component. The conduit-receiving opening is disposed within the liquid manifold and in fluid communication with at least one liquid-carrying channel of the liquid manifold. The releasable retention component(s) is selectively operative to threadlessly secure in a fluid-tight manner a conduit within the conduit-receiving opening in fluid communication with the at least one liquid-carrying channel of the liquid manifold to facilitate flow of liquid through the liquid-carrying channel(s), or to release the conduit from the conduit-receiving opening of the conduit connector. The releasable retention component(s) resides at least partially within the liquid manifold when operatively holding the conduit within the conduit-receiving opening.Type: ApplicationFiled: January 25, 2018Publication date: May 31, 2018Inventors: Thomas J. BRUNSCHWILER, Evan G. COLGAN, Michael J. ELLSWORTH, JR., Gerd SCHLOTTIG
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Patent number: 9941250Abstract: A package structure to implement two-phase cooling includes a chip stack disposed on a substrate, and a package lid that encloses the chip stack. The chip stack includes a plurality of conjoined chips, a central inlet manifold formed through a central region of the chip stack, and a peripheral outlet manifold. The central input manifold includes inlet nozzles to feed liquid coolant into flow cavities formed between adjacent conjoined chips. The peripheral outlet manifold outputs heated liquid and vapor from the flow cavities. The package lid includes a central coolant supply inlet aligned to the central inlet manifold, and a peripheral liquid-vapor outlet to output heated liquid and vapor that exits from the peripheral outlet manifold. Guiding walls may be included in the flow cavities to guide a flow of liquid and vapor, and the guiding walls can be arranged to form radial flow channels that are feed by different inlet nozzles of the central inlet manifold.Type: GrantFiled: January 11, 2017Date of Patent: April 10, 2018Assignee: International Business Machines CorporationInventors: Thomas J. Brunschwiler, Evan G. Colgan, John U. Knickerbocker, Bruno Michael, Chin Lee Ong, Cornelia K. Tsang
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Patent number: 9941189Abstract: A structure for cooling an integrated circuit. The structure may include; an interposer cold plate having at least two expanding channels, each expanding channel having a flow direction from a channel inlet to a channel outlet, the flow direction having different directions for at least two of the at least two expanding channels, the channel inlet having an inlet width and the channel outlet having an outlet width, wherein the inlet width is less than the outlet width.Type: GrantFiled: December 21, 2015Date of Patent: April 10, 2018Assignee: International Business Machines CorporationInventors: Thomas J. Brunschwiler, Timothy J. Chainer, Evan G. Colgan, Arvind Raj Mahankali Sridhar, Chin Lee Ong, Pritish R. Parida, Gerd Schlottig, Mark D. Schultz, Joel A. Silberman
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Publication number: 20180076113Abstract: Devices that have integrated cooling structures for two-phase cooling and methods of assembly thereof are provided. In one example, a chip manifold can be affixed to a chip. An interface can be located at a first position between the chip manifold and the manifold cap. Furthermore, the interface can create a seal.Type: ApplicationFiled: September 15, 2016Publication date: March 15, 2018Inventors: Thomas J. Brunschwiler, Timothy Joseph Chainer, Evan George Colgan, Michael Anthony Gaynes, Jeffrey Donald Gelorme, Gerard McVicker, Ozgur Ozsun, Pritish Ranjan Parida, Mark Delorman Schultz, Bucknell C. Webb
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Publication number: 20180012864Abstract: Embodiments of the invention are directed to an integrated circuit (IC) package assembly, including: one or more printed circuit boards (PCBs); and a set of chip packages, each including: an overmold; and an IC chip, overmolded in the overmold, and wherein: the chip packages are stacked transversely to an average plane of each of the chip packages, thereby forming a stack wherein a main surface of one of the chip packages faces a main surface of another one of the chip packages; and each of the chip packages is laterally soldered to one or more of said one or more PCBs and arranged transversally to each of said one or more PCBs, whereby an average plane of each of said one or more PCBs extends transversely to the average plane of each of the chip packages of the stack. Further embodiments are directed to related devices and fabrication methods.Type: ApplicationFiled: July 11, 2016Publication date: January 11, 2018Inventors: Thomas J. BRUNSCHWILER, Andreas Christian DOERING, Ronald Peter LUIJTEN, Stefano Sergio OGGIONI, Patricia Maria SAGMEISTER, Martin Leo SCHMATZ
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Publication number: 20180005934Abstract: A circuitized substrate for mounting at least one electronic component having a plurality of terminals. The circuitized substrate includes a first portion of electrical insulating material embedding a first electric circuit for coupling a first subset of the terminals. The first electric circuit including one or more patterned conductive layers of electrically conductive material extending parallel to a plane of the circuitized substrate. The circuitized substrate further includes a second portion of electrically conductive material. One or more insulating elements of electrical insulating material cross the second portion transversally to the plane to insulate a plurality of conductive elements thereof for coupling a second subset of the terminals. One or more auxiliary components of the electronic component are mounted on the second portion. Each auxiliary component having a first terminal and a second terminal coupled with a first one and a second one, respectively, of a pair of the conductive elements.Type: ApplicationFiled: November 3, 2016Publication date: January 4, 2018Inventors: Thomas J. Brunschwiler, Sebastian Gerke, Stefano Sergio Oggioni
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Patent number: 9821418Abstract: Adsorption heat exchanger devices (11, 25) are provided for use in solid sorption refrigeration systems (1) together with methods for making such devices and adsorbent structures therefor. The methods include applying a curable binder, in solution in a solvent, to granular adsorbent material, and then evaporating the solvent and curing the binder. The curable binder solution is sufficiently dilute that, during evaporation of the solvent, the binder becomes concentrated around contact points between granules (18) of the adsorbent material whereby localized bonds (19) are formed around the contact points on curing of the binder.Type: GrantFiled: June 8, 2012Date of Patent: November 21, 2017Assignee: International Business Machines CorporationInventors: Thomas J. Brunschwiler, Javier V. Goicochea, Bruno Michel, Patrick Ruch
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Patent number: 9698089Abstract: An electronic circuit includes a substrate device which includes a first substrate section including a first plurality of layers attached to each other having a first orientation (x2) and a second substrate section including a second plurality of layers attached to each other. The second plurality of layers have a second orientation (x3). The first orientation (x2) and the second orientation (x3) are perpendicular with respect to one another.Type: GrantFiled: June 24, 2016Date of Patent: July 4, 2017Assignee: International Business Machines CorporationInventors: Thomas J. Brunschwiler, Dominic Gschwend, Keiji Matsumoto, Stefano S. Oggioni, Gerd Schlottig, Timo J. Tick, Jonas Zuercher
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Publication number: 20170179001Abstract: A structure for cooling an integrated circuit. The structure may include; an interposer cold plate having at least two expanding channels, each expanding channel having a flow direction from a channel inlet to a channel outlet, the flow direction having different directions for at least two of the at least two expanding channels, the channel inlet having an inlet width and the channel outlet having an outlet width, wherein the inlet width is less than the outlet width.Type: ApplicationFiled: December 21, 2015Publication date: June 22, 2017Inventors: Thomas J. Brunschwiler, Timothy J. Chainer, Evan G. Colgan, Arvind Raj Mahankali Sridhar, Chin Lee Ong, Pritish R. Parida, Gerd Schlottig, Mark D. Schultz, Joel A. Silberman
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Publication number: 20170131007Abstract: Adsorption heat exchanger devices (11, 25) are provided for use in solid sorption refrigeration systems (1) together with methods for making such devices and adsorbent structures therefor. The methods include applying a curable binder, in solution in a solvent, to granular adsorbent material, and then evaporating the solvent and curing the binder. The curable binder solution is sufficiently dilute that, during evaporation of the solvent, the binder becomes concentrated around contact points between granules (18) of the adsorbent material whereby localized bonds (19) are formed around the contact points on curing of the binder.Type: ApplicationFiled: January 23, 2017Publication date: May 11, 2017Applicant: International Business Machines CorporationInventors: Thomas J. Brunschwiler, Javier V. Goicochea, Bruno Michel, Patrick Ruch
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Patent number: 9648782Abstract: A package structure to implement two-phase cooling includes a chip stack disposed on a substrate, and a package lid that encloses the chip stack. The chip stack includes a plurality of conjoined chips, a central inlet manifold formed through a central region of the chip stack, and a peripheral outlet manifold. The central input manifold includes inlet nozzles to feed liquid coolant into flow cavities formed between adjacent conjoined chips. The peripheral outlet manifold outputs heated liquid and vapor from the flow cavities. The package lid includes a central coolant supply inlet aligned to the central inlet manifold, and a peripheral liquid-vapor outlet to output heated liquid and vapor that exits from the peripheral outlet manifold. Guiding walls may be included in the flow cavities to guide a flow of liquid and vapor, and the guiding walls can be arranged to form radial flow channels that are feed by different inlet nozzles of the central inlet manifold.Type: GrantFiled: February 11, 2016Date of Patent: May 9, 2017Assignee: International Business Machines CorporationInventors: Thomas J. Brunschwiler, Evan G. Colgan, John U. Knickerbocker, Bruno Michael, Chin Lee Ong, Cornelia K. Tsang
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Publication number: 20170125388Abstract: A package structure to implement two-phase cooling includes a chip stack disposed on a substrate, and a package lid that encloses the chip stack. The chip stack includes a plurality of conjoined chips, a central inlet manifold formed through a central region of the chip stack, and a peripheral outlet manifold. The central input manifold includes inlet nozzles to feed liquid coolant into flow cavities formed between adjacent conjoined chips. The peripheral outlet manifold outputs heated liquid and vapor from the flow cavities. The package lid includes a central coolant supply inlet aligned to the central inlet manifold, and a peripheral liquid-vapor outlet to output heated liquid and vapor that exits from the peripheral outlet manifold. Guiding walls may be included in the flow cavities to guide a flow of liquid and vapor, and the guiding walls can be arranged to form radial flow channels that are feed by different inlet nozzles of the central inlet manifold.Type: ApplicationFiled: January 11, 2017Publication date: May 4, 2017Inventors: Thomas J. Brunschwiler, Evan G. Colgan, John U. Knickerbocker, Bruno Michael, Chin Lee Ong, Cornelia K. Tsang
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Patent number: 9576922Abstract: A method of forming a stacked surface arrangement for semiconductor devices includes joining a first surface to a second surface with a solder bump, the solder bump including a substantially pure first metal; depositing nanoparticles of a second metal onto a surface of the solder bump; performing an annealing operation to form a film of the second metal on the surface of the solder bump; and performing a reflow or a second annealing operation to transform the solder bump from the substantially pure first metal to an alloy of the first metal and the second metal.Type: GrantFiled: May 4, 2015Date of Patent: February 21, 2017Assignee: GLOBALFOUNDRIES INC.Inventors: Thomas J. Brunschwiler, Eric D. Perfecto, Jonas Zuercher