Abstract: According to various aspects, exemplary embodiments are disclosed of direct fired heaters including premix burner technology and/or feed forward control loop modulation via inlet air temperature.

Abstract: A vertical take-off and landing aircraft includes a fixed wing airframe having opposed left and right wings extending from left and right sides, respectively, of a fuselage having opposed leading and trailing extremities and an empennage located behind the trailing extremity. Four fixed, open and horizontal, vertical take-off and landing (VTOL) thrust rotors are mounted to the airframe in a quadrotor pattern for providing vertical lift to the aircraft, and a vertical, forward thrust rotor is mounted to the trailing extremity of the fuselage between the trailing extremity of the fuselage and the empennage for providing forward thrust to the aircraft. The four VTOL thrust rotors are coplanar being and operating in a common plane that is parallel relative to, and being level with, top surfaces of the left and right wings in and around a region of each of the four VTOL thrust rotors.

Abstract: According to various aspects, exemplary embodiments are disclosed of direct fired heaters including premix burner technology and/or feed forward control loop modulation via inlet air temperature.

Abstract: A software application is certified prior to deployment. A reviewer is assigned and a review time scheduled. A readiness assessment is performed prior to the review time. The reviewer then conducts a review including an overview, process flows identifying control points, deliverables, a demonstration, and a test plan. Results of the review are reported and a determination made of whether to certify the application. The software application may also be certified including performing additional testing after deployment.

Abstract: A structure and method are provided to exclude polymer film deposition from the backside and edge of a wafer during CVD processing. An electrostatic chuck (ESC), with radial and circular channels and grooves on its surface, secures a wafer to be processed. An inert gas, preferably argon, flows outward from these channels and grooves along the backside of the wafer. A uniform flow of the gas from underneath the wafer into the process chamber prevents monomer molecules from depositing on the wafer backside. For edge exclusion, a showerhead is placed slightly above the outer diameter of the wafer to keep most of the monomer molecules within the process chamber and redirect the remaining monomer molecules across the surface of the wafer below the outer edge of the showerhead.

Abstract: A structure and method exclude polymer film deposition from the backside and edge of a wafer during CVD processing. An electrostatic chuck (ESC), with radial and circular channels and grooves on its surface, secures a wafer to be processed. An inert gas, preferably argon, flows outward from these channels and grooves along the backside of the wafer. A uniform flow of the gas from underneath the wafer into the process chamber prevents monomer molecules from depositing on the wafer backside. For edge exclusion, a showerhead is placed slightly above the outer diameter of the wafer to keep most of the monomer molecules within the process chamber and redirect the remaining monomer molecules across the surface of the wafer below the outer edge of the showerhead.