Patents by Inventor Thomas J. Colosimo, JR.

Thomas J. Colosimo, JR. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10468373
    Abstract: A method of operating a bonding machine is provided. The method includes the steps of: (a) carrying a semiconductor element with a transfer tool; and (b) transferring the semiconductor element from the transfer tool to a bonding tool of the bonding machine without the transfer tool and the bonding tool contacting the semiconductor element at the same time.
    Type: Grant
    Filed: February 19, 2018
    Date of Patent: November 5, 2019
    Assignee: Kulicke and Sofia Industries, Inc.
    Inventors: Thomas J. Colosimo, Jr., Daniel P. Buergi, Horst Claubeg, Matthew B. Wasserman
  • Patent number: 10352877
    Abstract: A method of determining a physical characteristic of an adhesive material on a semiconductor device element using structured light is provided. The method includes the steps of: (1) applying a structured light pattern to an adhesive material on a semiconductor device element; (2) creating an image of the structured light pattern using a camera; and (3) analyzing the image of the structured light pattern to determine a physical characteristic of the adhesive material. Additional methods and systems for determining physical characteristics of semiconductor devices and elements using structured light are also provided.
    Type: Grant
    Filed: October 18, 2017
    Date of Patent: July 16, 2019
    Assignee: KULICKE AND SOFFA INDUSTRIES, INC
    Inventors: Deepak Sood, Zhijie Wang, Thomas J. Colosimo, Jr., David A. Rauth, Shu-Guo Tang
  • Patent number: 10245668
    Abstract: A fluxing system for a bonding machine is provided. The fluxing system includes a flux holder defining a cavity for holding flux, and a fluid source for providing a cooling fluid to cool the flux holder.
    Type: Grant
    Filed: October 27, 2017
    Date of Patent: April 2, 2019
    Assignee: KULICKE AND SOFFA INDUSTRIES, INC
    Inventors: Daniel P. Buergi, Thomas J. Colosimo, Jr., Edward T. Laurent, Michael P. Schmidt-Lange
  • Patent number: 10153247
    Abstract: A method of forming a wire interconnect structure includes the steps of: (a) forming a wire bond at a bonding location on a substrate using a wire bonding tool; (b) extending a length of wire, continuous with the wire bond, to another location; (c) pressing a portion of the length of wire against the other location using the wire bonding tool; (d) moving the wire bonding tool, and the pressed portion of the length of wire, to a position above the wire bond; and (e) separating the length of wire from a wire supply at the pressed portion, thereby providing a wire interconnect structure bonded to the bonding location.
    Type: Grant
    Filed: August 16, 2017
    Date of Patent: December 11, 2018
    Assignee: KULICKE AND SOFFA INDUSTRIES, INC.
    Inventors: Thomas J. Colosimo, Jr., Jon W. Brunner
  • Publication number: 20180174997
    Abstract: A method of operating a bonding machine is provided. The method includes the steps of: (a) carrying a semiconductor element with a transfer tool; and (b) transferring the semiconductor element from the transfer tool to a bonding tool of the bonding machine without the transfer tool and the bonding tool contacting the semiconductor element at the same time.
    Type: Application
    Filed: February 19, 2018
    Publication date: June 21, 2018
    Inventors: Thomas J. Colosimo, JR., Daniel P. Buergi, Horst Claubeg, Matthew B. Wasserman
  • Publication number: 20180117695
    Abstract: A fluxing system for a bonding machine is provided. The fluxing system includes a flux holder defining a cavity for holding flux, and a fluid source for providing a cooling fluid to cool the flux holder.
    Type: Application
    Filed: October 27, 2017
    Publication date: May 3, 2018
    Inventors: Daniel P. Buergi, Thomas J. Colosimo, JR., Edward T. Laurent, Michael P. Schmidt-Lange
  • Patent number: 9929121
    Abstract: A method of operating a bonding machine is provided. The method includes the steps of: (a) carrying a semiconductor element with a transfer tool; and (b) transferring the semiconductor element from the transfer tool to a bonding tool of the bonding machine without the transfer tool and the bonding tool contacting the semiconductor element at the same time.
    Type: Grant
    Filed: August 4, 2016
    Date of Patent: March 27, 2018
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Thomas J. Colosimo, Jr., Daniel P. Buergi, Horst Clauberg, Matthew B. Wasserman
  • Publication number: 20180038806
    Abstract: A method of determining a physical characteristic of an adhesive material on a semiconductor device element using structured light is provided. The method includes the steps of: (1) applying a structured light pattern to an adhesive material on a semiconductor device element; (2) creating an image of the structured light pattern using a camera; and (3) analyzing the image of the structured light pattern to determine a physical characteristic of the adhesive material. Additional methods and systems for determining physical characteristics of semiconductor devices and elements using structured light are also provided.
    Type: Application
    Filed: October 18, 2017
    Publication date: February 8, 2018
    Inventors: Deepak Sood, Zhijie Wang, Thomas J. Colosimo, JR., David A. Rauth, Shu-Guo Tang
  • Patent number: 9865560
    Abstract: A method of forming a wire interconnect structure includes the steps of: (a) forming a wire bond at a bonding location on a substrate using a wire bonding tool; (b) extending a length of wire, continuous with the wire bond, to another location; (c) pressing a portion of the length of wire against the other location using the wire bonding tool; (d) moving the wire bonding tool, and the pressed portion of the length of wire, to a position above the wire bond; and (e) separating the length of wire from a wire supply at the pressed portion, thereby providing a wire interconnect structure bonded to the bonding location.
    Type: Grant
    Filed: October 20, 2016
    Date of Patent: January 9, 2018
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Thomas J. Colosimo, Jr., Jon W. Brunner
  • Patent number: 9847313
    Abstract: A method of operating a thermocompression bonding system is provided. The method includes the steps of: bringing first conductive structures of a semiconductor element into contact with second conductive structures of a substrate in connection with a thermocompression bonding operation; and moving the semiconductor element relative to the substrate along at least one substantially horizontal direction using a motion system of at least one of the semiconductor element and the substrate.
    Type: Grant
    Filed: April 18, 2016
    Date of Patent: December 19, 2017
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Horst Clauberg, Thomas J. Colosimo, Jr.
  • Publication number: 20170345787
    Abstract: A method of forming a wire interconnect structure includes the steps of: (a) forming a wire bond at a bonding location on a substrate using a wire bonding tool; (b) extending a length of wire, continuous with the wire bond, to another location; (c) pressing a portion of the length of wire against the other location using the wire bonding tool; (d) moving the wire bonding tool, and the pressed portion of the length of wire, to a position above the wire bond; and (e) separating the length of wire from a wire supply at the pressed portion, thereby providing a wire interconnect structure bonded to the bonding location.
    Type: Application
    Filed: August 16, 2017
    Publication date: November 30, 2017
    Inventors: Thomas J. Colosimo, JR., Jon W. Brunner
  • Patent number: 9810641
    Abstract: A method of determining a physical characteristic of an adhesive material on a semiconductor device element using structured light is provided. The method includes the steps of: (1) applying a structured light pattern to an adhesive material on a semiconductor device element; (2) creating an image of the structured light pattern using a camera; and (3) analyzing the image of the structured light pattern to determine a physical characteristic of the adhesive material. Additional methods and systems for determining physical characteristics of semiconductor devices and elements using structured light are also provided.
    Type: Grant
    Filed: August 27, 2014
    Date of Patent: November 7, 2017
    Assignee: Kulicke & Soffa Industries, Inc.
    Inventors: Deepak Sood, Zhijie Wang, Thomas J. Colosimo, Jr., David A. Rauth, Shu-Guo Tang
  • Patent number: 9731378
    Abstract: A method of operating a thermocompression bonding system is provided. The method includes the steps of: (a) applying a first level of bond force to a semiconductor element while first conductive structures of the semiconductor element are in contact with second conductive structures of a substrate in connection with a thermocompression bonding operation; (b) measuring a lateral force related to contact between (i) ones of the first conductive structures and (ii) corresponding ones of the second conductive structures; (c) determining a corrective motion to be applied based on the lateral force measured in step (b); and (d) applying the corrective motion determined in step (c).
    Type: Grant
    Filed: May 17, 2016
    Date of Patent: August 15, 2017
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Thomas J. Colosimo, Jr., Michael P. Schmidt-Lange, Horst Clauberg, Matthew B. Wasserman
  • Publication number: 20170062378
    Abstract: A method of operating a bonding machine is provided. The method includes the steps of: (a) carrying a semiconductor element with a transfer tool; and (b) transferring the semiconductor element from the transfer tool to a bonding tool of the bonding machine without the transfer tool and the bonding tool contacting the semiconductor element at the same time.
    Type: Application
    Filed: August 4, 2016
    Publication date: March 2, 2017
    Inventors: Thomas J. Colosimo, JR., Daniel P. Buergi, Horst Clauberg, Matthew B. Wasserman
  • Publication number: 20170040280
    Abstract: A method of forming a wire interconnect structure includes the steps of: (a) forming a wire bond at a bonding location on a substrate using a wire bonding tool; (b) extending a length of wire, continuous with the wire bond, to another location; (c) pressing a portion of the length of wire against the other location using the wire bonding tool; (d) moving the wire bonding tool, and the pressed portion of the length of wire, to a position above the wire bond; and (e) separating the length of wire from a wire supply at the pressed portion, thereby providing a wire interconnect structure bonded to the bonding location.
    Type: Application
    Filed: October 20, 2016
    Publication date: February 9, 2017
    Inventors: Thomas J. Colosimo, JR., Jon W. Brunner
  • Publication number: 20160343626
    Abstract: A method of operating a thermocompression bonding system is provided. The method includes the steps of: (a) applying a first level of bond force to a semiconductor element while first conductive structures of the semiconductor element are in contact with second conductive structures of a substrate in connection with a thermocompression bonding operation; (b) measuring a lateral force related to contact between (i) ones of the first conductive structures and (ii) corresponding ones of the second conductive structures; (c) determining a corrective motion to be applied based on the lateral force measured in step (b); and (d) applying the corrective motion determined in step (c).
    Type: Application
    Filed: May 17, 2016
    Publication date: November 24, 2016
    Inventors: Thomas J. Colosimo, JR., Michael P. Schmidt-Lange, Horst Clauberg, Matthew B. Wasserman
  • Patent number: 9502371
    Abstract: A method of forming a wire interconnect structure includes the steps of: (a) forming a wire bond at a bonding location on a substrate using a wire bonding tool; (b) extending a length of wire, continuous with the wire bond, to another location; (c) pressing a portion of the length of wire against the other location using the wire bonding tool; (d) moving the wire bonding tool, and the pressed portion of the length of wire, to a position above the wire bond; and (e) separating the length of wire from a wire supply at the pressed portion, thereby providing a wire interconnect structure bonded to the bonding location.
    Type: Grant
    Filed: July 1, 2013
    Date of Patent: November 22, 2016
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Thomas J. Colosimo, Jr., Jon W. Brunner
  • Publication number: 20160315064
    Abstract: A method of operating a thermocompression bonding system is provided. The method includes the steps of: bringing first conductive structures of a semiconductor element into contact with second conductive structures of a substrate in connection with a thermocompression bonding operation; and moving the semiconductor element relative to the substrate along at least one substantially horizontal direction using a motion system of at least one of the semiconductor element and the substrate.
    Type: Application
    Filed: April 18, 2016
    Publication date: October 27, 2016
    Inventors: Horst Clauberg, Thomas J. Colosimo, JR.
  • Patent number: 9478516
    Abstract: A method of operating a bonding machine for bonding semiconductor elements is provided. The method includes the steps of: (a) measuring a time based z-axis height measurement characteristic of a bond head assembly during a model bonding process; (b) determining a z-axis adjustment profile for a subsequent bonding process based on the measured time based z-axis height measurement characteristic; and (c) adjusting a z-axis position of the bond head assembly with a z-axis motion system during the subsequent bonding process using the z-axis adjustment profile.
    Type: Grant
    Filed: September 16, 2015
    Date of Patent: October 25, 2016
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Matthew B. Wasserman, Michael P. Schmidt-Lange, Thomas J. Colosimo, Jr.
  • Patent number: 9426898
    Abstract: A thermocompression bonder is provided. The thermocompression bonder includes: a bond head including a heated bonding tool for bonding a semiconductor element to a substrate; and a flux application tool for applying a flux material to conductive contacts of the substrate prior to bonding of the semiconductor element to the substrate.
    Type: Grant
    Filed: June 25, 2015
    Date of Patent: August 23, 2016
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Guy Frick, Thomas J. Colosimo, Jr., Horst Clauberg