Abstract: A structure and method for achieving burn-in and full functional testing of a semiconductor wire bond die are provided. The structure comprises an electrical conductor which connects a wire bond pad to a solderable test contact laterally displaced from the wire bond pad. The solderable test contact is configured to facilitate electrical connection of an external testing device thereto for electrical testing and/or burn-in of integrated circuitry associated with the die, without direct physical contact to the wire bond pads. The structure does not need to be removed following the burn-in or test.