Abstract: Provided is an evaporator stack. The evaporator stack may be used in power-dense electronic assemblies. The evaporator stack includes a lower floor including at least one mounded portion, and an enclosure surrounding the lower floor, wherein a height of the enclosure is greater than a height of the at least one mounded portion, the at least one mounded portion extending between two walls of the enclosure.

Abstract: Provided is a condenser for use in an electronic assembly. The condenser includes a first vertical wall extending in a vertical direction, the first vertical wall defining a first plurality of vertical condensation channels within the first vertical wall, a second vertical wall extending in the vertical direction, the second vertical wall defining a second plurality of vertical condensation channels within the second vertical wall, and a first plurality of fins extending in the vertical direction, each of the first plurality of fins connected to the first vertical wall, the second vertical wall or both the first vertical wall and the second vertical wall.

Abstract: Provided is an evaporator stack. The evaporator stack may be used in power-dense electronic assemblies. The evaporator stack includes a lower floor including at least one mounded portion, and an enclosure surrounding the lower floor, wherein a height of the enclosure is greater than a height of the at least one mounded portion, the at least one mounded portion extending between two walls of the enclosure.

Abstract: A method for manufacturing an electronic assembly features a semiconductor device with a first side and a second side opposite the first side to facilitate enhanced thermal dissipation. The first side has a first conductive pad. The second side has a primary metallic surface. By heating the assembly once, a first substrate (e.g. lead frame) is bonded to a first conductive pad via first metallic bonding layer; and second substrate (e.g., heat sinking circuit board) is bonded to a primary metallic surface via a second metallic bonding layer. In one configuration the second metallic bonding layer is composed of solder and copper, for example.

Abstract: A method for manufacturing an electronic assembly features a semiconductor device with a first side and a second side opposite the first side to facilitate enhanced thermal dissipation. The first side has a first conductive pad. The second side has a primary metallic surface. By heating the assembly once, a first substrate (e.g. lead frame) is bonded to a first conductive pad via first metallic bonding layer; and second substrate (e.g., heat sinking circuit board) is bonded to a primary metallic surface via a second metallic bonding layer. In one configuration the second metallic bonding layer is composed of solder and copper, for example.

Abstract: The first wall has a first inbound cavity for receiving a coolant from an inlet port. The first wall has a first outbound cavity for directing the coolant from the inbound cavity to the input of the transition passage. The second wall has a second inbound cavity for receiving a coolant from the output of the transition passage. The second wall has a second outbound cavity for directing the coolant from the inbound cavity to the outlet port. The transition passage comprises a transverse hollow volume for interconnecting the first outbound cavity of the first wall to the second inbound cavity of a second wall. At least one heat-generating component (e.g., inductor) in the interior of the housing generates heat that is dissipated.

Abstract: In accordance with one aspect of the disclosure, an electronic assembly comprises a semiconductor device with a first side and a second side opposite the first side. The first side has a first conductive pad. The second side has a primary metallic surface. A first substrate (e.g. lead frame) is bonded to a first conductive pad via first metallic bonding layer. A second substrate (e.g., heat sinking circuit board) is bonded to a primary metallic surface via a second metallic bonding layer. In one configuration the second metallic bonding layer is composed of solder and copper, for example.

Abstract: An electronic assembly comprises a gate drive module comprising multiple circuit board layers sandwiched together, where each layer has a central opening that is aligned with the other layers. A switching circuit chipset is positioned in the central opening. The switching circuit chipset has lead frames for providing electrical connections to the switching circuit chipset. The lead frames are alignable with pockets in two or more of the layers to facilitate alignment of the contact portions of the lead frames with corresponding conductive pads on the circuit board.

Abstract: An electronic assembly comprises a gate drive module comprising multiple circuit board layers sandwiched together, where each layer has a central opening that is aligned with the other layers. A switching circuit chipset is positioned in the central opening The switching circuit chipset has lead frames for providing electrical connections to the switching circuit chipset. The lead frames are alignable with pockets in two or more of the layers to facilitate alignment of the contact portions of the lead frames with corresponding conductive pads on the circuit board.

Abstract: The first wall has a first inbound cavity for receiving a coolant from an inlet port. The first wall has a first outbound cavity for directing the coolant from the inbound cavity to the input of the transition passage. The second wall has a second inbound cavity for receiving a coolant from the output of the transition passage. The second wall has a second outbound cavity for directing the coolant from the inbound cavity to the outlet port. The transition passage comprises a transverse hollow volume for interconnecting the first outbound cavity of the first wall to the second inbound cavity of a second wall. At least one heat-generating component (e.g., inductor) in the interior of the housing generates heat that is dissipated.

Abstract: An electronic assembly comprises a heat-generating semiconductor device that has a first side and a second side opposite the first side. An evaporator stack has a floor and a hollow body. The evaporator stack overlies the first side of the semiconductor device. The heated floor can convert a liquid-phase of a coolant (e.g., refrigerant) into a gas-phase of the coolant. A condensation container is in communication with the evaporator stack and is arranged to receive a gas-phase of the coolant. The condensation container is configured to convert the received gas-phase of the coolant into a liquid phase to replenish the liquid-phase coolant for interaction with the floor of the evaporator stack.

Abstract: An electrical connector assembly includes a first electrically conductive contact member and a second electrically conductive contact member. Both contact members have non-planar interface surfaces. The second interface surface is complimentary to the first interface surface. Magnetic field concentrators are spaced apart to concentrate a magnetic field in a zone. The magnetic field is associated with electric current carried by the electrical connector assembly. A flexible circuit carrier has openings to receive the magnetic field concentrators. The flexible circuit carrier comprises a flexible dielectric layer and a conductive traces. A magnetic field sensor is mounted on the flexible circuit carrier in the zone.

Abstract: An electronic assembly comprises a heat-generating semiconductor device that has a first side and a second side opposite the first side. An evaporator stack has a floor and a hollow body. The evaporator stack overlies the first side of the semiconductor device. The heated floor can convert a liquid-phase of a coolant (e.g., refrigerant) into a gas-phase of the coolant. A condensation container is in communication with the evaporator stack and is arranged to receive a gas-phase of the coolant. The condensation container is configured to convert the received gas-phase of the coolant into a liquid phase to replenish the liquid-phase coolant for interaction with the floor of the evaporator stack.

Abstract: In accordance with one aspect of the disclosure, an electronic assembly comprises a semiconductor device with a first side and a second side opposite the first side. The first side has a first conductive pad. The second side has a primary metallic surface. A first substrate (e.g. lead frame) is bonded to a first conductive pad via first metallic bonding layer. A second substrate (e.g., heat sinking circuit board) is bonded to a primary metallic surface via a second metallic bonding layer. In one configuration the second metallic bonding layer is composed of solder and copper, for example.

Abstract: An electrical assembly comprises a dielectric substrate and a metallic conductive trace overlying the substrate. The metallic conductive trace has a hollow cross-section that forms a duct. An annular member protrudes from the metallic conductive trace. The annular member has an opening in communication with the duct, the opening for receiving pressurized air or gas.

Abstract: An electrical connector assembly includes a first electrically conductive contact member and a second electrically conductive contact member. Both contact members have non-planar interface surfaces. The second interface surface is complimentary to the first interface surface. Magnetic field concentrators are spaced apart to concentrate a magnetic field in a zone. The magnetic field is associated with electric current carried by the electrical connector assembly. A flexible circuit carrier has openings to receive the magnetic field concentrators. The flexible circuit carrier comprises a flexible dielectric layer and a conductive traces. A magnetic field sensor is mounted on the flexible circuit carrier in the zone.

Abstract: A work machine includes a frame supported for movement over the ground, a prime mover for driving movement of the frame, an operator compartment supported on the frame and a cradle coupling the operator compartment to the frame. The cradle is pivotable between an operating position and a service position and includes a biasing mechanism for biasing cradle toward the service position and an isolation mount coupling the operator compartment to the cradle. The isolation mount permits deflection of the operator compartment relative to the cradle along a selected axis. A latch mechanism releasably couples the cradle to the frame and a handle is provided for actuating the latch mechanism. The isolation mount includes a deformable member having a void defining the selected axis. The axis can be aligned with a force exerted on the cradle by the operator compartment to reduce stress on the biasing member.

Abstract: A work machine includes a frame supported for movement over the ground, a prime mover for driving movement of the frame, an operator compartment supported on the frame and a cradle coupling the operator compartment to the frame. The cradle is pivotable between an operating position and a service position and includes a biasing mechanism for biasing cradle toward the service position and an isolation mount coupling the operator compartment to the cradle. The isolation mount permits deflection of the operator compartment relative to the cradle along a selected axis. A latch mechanism releasably couples the cradle to the frame and a handle is provided for actuating the latch mechanism. The isolation mount includes a deformable member having a void defining the selected axis. The axis can be aligned with a force exerted on the cradle by the operator compartment to reduce stress on the biasing member.

Abstract: A track vehicle includes a cab operable to support an operator. Left and right motors each rotate an output shaft at a first speed, and a speed reduction system is operably coupled to each output shaft. Left and right drive shafts are driven by the speed reduction system at a second speed that is slower than the first speed. Left and right drive sprockets are mounted for rotation with the respective first and second drive shafts. Left and right track carriages support the cab and left and right tracks are mounted for rotation about the track carriages in response to rotation of the respective left and right drive shafts, such that the left and right tracks are driven by the left and right drive sprockets to move the track vehicle along a ground surface.

Abstract: A conduit connector assembly for attachments on a loader includes a mounting plate with at least one coupler section mounted on the plate and secured rigidly to a forward end of one of the lift arms of a loader. The coupler section or sections are connected with conduits to power or electrical signal sources on the loader. The coupler section or sections on the lift arm are connectable to mating coupler sections attached to conduits from an attachment that requires power and/or control signals for operation. The coupler sections are supported to one side of the lines of vision that an operator in an operator's cab of the loader needs for watching the attachment.