Patents by Inventor Thomas James HEATON

Thomas James HEATON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Circuit assembly
    Patent number: 11122689
    Abstract: A circuit assembly (200) is disclosed comprising a substrate (210) and conducting layers (250) on opposing sides of the substrate (210), there being at least one via (220) through the substrate (210), which via (220) forms a conductive path between the conducting layers, wherein the substrate (210) is a foam substrate, and wherein the via (220) is provided with a solid dielectric lining (270) plated with a conducting material (250).
    Type: Grant
    Filed: October 17, 2018
    Date of Patent: September 14, 2021
    Assignee: MBDA UK LIMITED
    Inventors: Adam Armitage, Thomas James Heaton
  • CIRCUIT ASSEMBLY
    Publication number: 20200315020
    Abstract: A circuit assembly (200) is disclosed comprising a substrate (210) and conducting layers (250) on opposing sides of the substrate (210), there being at least one via (220) through the substrate (210), which via (220) forms a conductive path between the conducting layers, wherein the substrate (210) is a foam substrate, and wherein the via (220) is provided with a solid dielectric lining (270) plated with a conducting material (250).
    Type: Application
    Filed: October 17, 2018
    Publication date: October 1, 2020
    Applicant: MBDA UK LIMITED
    Inventors: Adam ARMITAGE, Thomas James HEATON