Patents by Inventor Thomas JOACHIM
Thomas JOACHIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 12277402Abstract: In an embodiment, the disclosure provides a programmed computer system implemented via client-server Software as a Service (SaaS) techniques that allows for machine translation of digital content. When translating digital content, linguists must translate more than just the text on the page. Formatting, for example, is a commonly used and important aspect of online content that is typically managed with tags, such as <b> for bold and <i> for italics. When linguists work, they must ensure these tags are placed accurately as part of the translation. Projecting tags accurately depends on successfully accomplishing the challenging task of word alignment. Unfortunately, if word alignment is inaccurate, it makes placing formatting tags very difficult. In an embodiment, the present disclosure provides a method of not only translating text, but also efficiently and accurately projecting tags from input text in one language to output text in another language.Type: GrantFiled: August 22, 2023Date of Patent: April 15, 2025Assignee: Lilt, Inc.Inventors: Thomas Joachim Zenkel, Joern Wuebker, John Sturdy DeNero
-
Publication number: 20240308689Abstract: A structurally bonded arrangement comprising: an interconnecting component; a first component with a first connecting area that is rigidly connected to the interconnecting component; and a second component with a second connecting area that is structurally bonded to the interconnecting component in an associated bonding area; wherein a plurality of separated sub-bondings is formed in the associated bonding area between the second component and the interconnecting component.Type: ApplicationFiled: January 17, 2024Publication date: September 19, 2024Applicant: AIRBUS HELICOPTERS DEUTSCHLAND GMBHInventors: Martin BLACHA, Sebastian BUESING, Thomas JOACHIM
-
Publication number: 20230394251Abstract: In an embodiment, the disclosure provides a programmed computer system implemented via client-server Software as a Service (SaaS) techniques that allows for machine translation of digital content. When translating digital content, linguists must translate more than just the text on the page. Formatting, for example, is a commonly used and important aspect of online content that is typically managed with tags, such as <b> for bold and <i> for italics. When linguists work, they must ensure these tags are placed accurately as part of the translation. Projecting tags accurately depends on successfully accomplishing the challenging task of word alignment. Unfortunately, if word alignment is inaccurate, it makes placing formatting tags very difficult. In an embodiment, the present disclosure provides a method of not only translating text, but also efficiently and accurately projecting tags from input text in one language to output text in another language.Type: ApplicationFiled: August 22, 2023Publication date: December 7, 2023Inventors: Thomas Joachim Zenkel, Joern Wuebker, John Sturdy DeNero
-
Patent number: 11783136Abstract: In an embodiment, the disclosure provides a programmed computer system implemented via client-server Software as a Service (SaaS) techniques that allows for machine translation of digital content. When translating digital content, linguists must translate more than just the text on the page. Formatting, for example, is a commonly used and important aspect of online content that is typically managed with tags, such as <b> for bold and <i> for italics. When linguists work, they must ensure these tags are placed accurately as part of the translation. Projecting tags accurately depends on successfully accomplishing the challenging task of word alignment. Unfortunately, if word alignment is inaccurate, it makes placing formatting tags very difficult. In an embodiment, the present disclosure provides a method of not only translating text, but also efficiently and accurately projecting tags from input text in one language to output text in another language.Type: GrantFiled: April 30, 2021Date of Patent: October 10, 2023Assignee: Lilt, Inc.Inventors: Thomas Joachim Zenkel, Joern Wuebker, John Sturdy DeNero
-
Publication number: 20220366152Abstract: In an embodiment, the disclosure provides a programmed computer system implemented via client-server Software as a Service (SaaS) techniques that allows for machine translation of digital content. When translating digital content, linguists must translate more than just the text on the page. Formatting, for example, is a commonly used and important aspect of online content that is typically managed with tags, such as <b> for bold and <i> for italics. When linguists work, they must ensure these tags are placed accurately as part of the translation. Projecting tags accurately depends on successfully accomplishing the challenging task of word alignment. Unfortunately, if word alignment is inaccurate, it makes placing formatting tags very difficult. In an embodiment, the present disclosure provides a method of not only translating text, but also efficiently and accurately projecting tags from input text in one language to output text in another language.Type: ApplicationFiled: April 30, 2021Publication date: November 17, 2022Inventors: Thomas Joachim Zenkel, Joern Wuebker, John Sturdy DeNero
-
Patent number: 11420719Abstract: A shear connection for interchangeably connecting two airframe parts of an aircraft. The shear connection may include first and second interface parts. The second interface part may overlap in the longitudinal direction at an overlap section with at least one of the first interface part and the first airframe part. The shear connection may further comprise means that rigidly and non-interchangeably attach the first interface part to the first airframe part and the second interface part to the second airframe part and a shear bolt that rigidly and interchangeably connects the second interface part with the at least one of the first interface part and the first airframe part at the overlap section, thereby interchangeably connecting the first and second airframe parts.Type: GrantFiled: January 31, 2019Date of Patent: August 23, 2022Assignee: AIRBUS HELICOPTERS DEUTSCHLAND GMBHInventors: Andreas Rack, Thomas Joachim, Rupert Pfaller
-
Patent number: 10695995Abstract: A method of correcting, in a composite component, an inappropriate countersink with an inappropriate maximum diameter and/or depth, the inappropriate countersink being provided in the composite component at a fixation opening having a first opening diameter, the method comprising at least the steps of: Preparing a repair patch; Arranging the repair patch on the composite component in an area surrounding the inappropriate countersink; Pressing the repair patch at least partly into the inappropriate countersink by means of an associated pressure tool; and Fixing the repair patch in the inappropriate countersink.Type: GrantFiled: May 26, 2017Date of Patent: June 30, 2020Assignee: AIRBUS HELICOPTERS DEUTSCHLAND GMBHInventors: Thomas Joachim, Andreas Rack, Josef Lindenmeier, Tim Schoenicke
-
Publication number: 20190241245Abstract: A shear connection for interchangeably connecting two airframe parts of an aircraft. The shear connection may include first and second interface parts. The second interface part may overlap in the longitudinal direction at an overlap section with at least one of the first interface part and the first airframe part. The shear connection may further comprise means that rigidly and non-interchangeably attach the first interface part to the first airframe part and the second interface part to the second airframe part and a shear bolt that rigidly and interchangeably connects the second interface part with the at least one of the first interface part and the first airframe part at the overlap section, thereby interchangeably connecting the first and second airframe parts.Type: ApplicationFiled: January 31, 2019Publication date: August 8, 2019Applicant: AIRBUS HELICOPTERS DEUTSCHLAND GMBHInventors: Andreas RACK, Thomas JOACHIM, Rupert PFALLER
-
Patent number: 10323025Abstract: The present invention relates to an improved crystallization procedure to obtain canagliflozin hemihydrate crystals having a narrow particle size distribution by removing a small part of the crystalline suspension in the crystallization vessel from said vessel and subjecting said part to particle size reduction of the formed crystals followed by heating and reintroducting said part of the crystalline suspension again in the crystallization vessel which is kept within a specific temperature range.Type: GrantFiled: December 20, 2016Date of Patent: June 18, 2019Assignee: Janssen Pharmaceutica NVInventors: Ruben De Keyser, Stijn Laps, Thomas Joachim Landewald Rammeloo, Koen Johan Herman Weerts
-
Publication number: 20190002449Abstract: The present invention relates to an improved crystallization procedure to obtain canagliflozin hemihydrate crystals having a narrow particle size distribution by removing a small part of the crystalline suspension in the crystallization vessel from said vessel and subjecting said part to particle size reduction of the formed crystals followed by heating and reintroducting said part of the crystalline suspension again in the crystallization vessel which is kept within a specific temperature range.Type: ApplicationFiled: December 20, 2016Publication date: January 3, 2019Applicant: Janssen Pharmaceutica NVInventors: Ruben De Keyser, Stijn Laps, Thomas Joachim Landewald Rammeloo, Koen Johan Herman Weerts
-
Patent number: 9912153Abstract: A method for controlling the ratio between injected and extracted electric energy in an electric energy supply grid with a number of grid participants, which are selected from a group including producers, consumers, and storage devices, with at least two of the group being included. A grid state variable is used as a control variable, the value of said variable depending on the ratio between inserted and extracted electric energy and being ascertainable from the grid by the grid participants. The invention is characterized in that a number of grid participants ascertain the grid state variable from the grid and use said variable at least indirectly to control the grid in a decentralized manner based on a respective specific grid participant behavior.Type: GrantFiled: July 19, 2012Date of Patent: March 6, 2018Assignee: EASY SMART GRID GmbHInventor: Thomas Joachim Walter
-
Publication number: 20170341322Abstract: A method of correcting, in a composite component, an inappropriate countersink with an inappropriate maximum diameter and/or depth, the inappropriate countersink being provided in the composite component at a fixation opening having a first opening diameter, the method comprising at least the steps of: Preparing a repair patch; Arranging the repair patch on the composite component in an area surrounding the inappropriate countersink; Pressing the repair patch at least partly into the inappropriate countersink by means of an associated pressure tool; and Fixing the repair patch in the inappropriate countersink.Type: ApplicationFiled: May 26, 2017Publication date: November 30, 2017Applicant: AIRBUS HELICOPTERS DEUTSCHLAND GMBHInventors: Thomas JOACHIM, Andreas RACK, Josef LINDENMEIER, Tim SCHOENICKE
-
Publication number: 20150280434Abstract: A method for controlling the ratio between injected and extracted electric energy in an electric energy supply grid with a number of grid participants, which are selected from a group including producers, consumers, and storage devices, with at least two of the group being included. A grid state variable is used as a control variable, the value of said variable depending on the ratio between inserted and extracted electric energy and being ascertainable from the grid by the grid participants. The invention is characterized in that a number of grid participants ascertain the grid state variable from the grid and use said variable at least indirectly to control the grid in a decentralized manner based on a respective specific grid participant behavior.Type: ApplicationFiled: July 19, 2012Publication date: October 1, 2015Applicant: EASY SMART GRID GMBHInventor: Thomas Joachim Walter
-
Patent number: 8772512Abstract: The present invention relates to a crystallization procedure to obtain 1-(?-D-glucopyranosyl)-4-methyl-3-[5-(4-fluorophenyl)-2-thienylmethyl] benzene hemihydrate crystals having a narrow particle size distribution and improved flowability, bulk and tap density properties.Type: GrantFiled: July 8, 2010Date of Patent: July 8, 2014Assignee: Janssen Pharmaceutica NVInventors: Thomas Joachim Landewald Rammeloo, Ruben De Keyser, Gustaaf Jozef Petrus Schildermans
-
Publication number: 20140133155Abstract: The present invention provides a Scalable Heat Dissipating Microelectronic Integration Platform (SHDMIP) LED package having excellent heat dissipation and protection to the LED, thus extending the lifespan of the LED. Each of the SHDMIP LED package comprises a dual lead frame assembly comprising bottom and top lead frame, protection and driver circuit electrically connected to the top or bottom lead frame and a LED electrically connected to the top lead frame. The bottom lead frame comprises heat sink pad for heat dissipation purpose. Plurality of SHDMIP LED packages of the present invention can be configured in a matrix or row, forming a SHDMIP LED array for various lighting solutions.Type: ApplicationFiled: January 16, 2014Publication date: May 15, 2014Applicant: PSI Technologies, Inc.Inventors: Thomas Joachim Werner MOERSHEIM, Fernando Villon Capinig, Dandy Navarro Jaducana, Anthony Augusto Malon Galay
-
Patent number: 8669580Abstract: The present invention provides a Scalable Heat Dissipating Microelectronic Integration Platform (SHDMIP) LED Package having excellent heat dissipation and protection to LED, thus extending the lifespan of the LED. The SHDMIP LED package comprises a dual lead frame assembly comprising bottom and top lead frame, protection and driver circuits conductively attached to the bottom lead frame and a LED conductively attached to the top lead frame. The bottom lead frame comprises heat sink pad for heat dissipation purpose. Plurality of SHDMIP LED packages of the present invention can be configured in a matrix or row, forming a SHDMIP LED array for various lighting solutions. A method to manufacture the SHDMIP LED array of the present invention is provided herein.Type: GrantFiled: November 4, 2011Date of Patent: March 11, 2014Assignee: PSI Technologies, Inc.Inventors: Thomas Joachim Werner Morsheim, Fernando Villon Capinig, Dandy Navarro Jaducana, Anthony Augusto Malon Galay
-
Publication number: 20140010684Abstract: An electric coolant pump for a motor vehicle includes a wet section in which is arranged an impeller and a permanently magnetized motor rotor of an electronically commutated electromotor, a dry section in which is arranged an electric circuit board comprising a plurality of power semiconductors which each comprise a cooling lug, and a partition wall lying in a traverse plane. The partition wall is arranged to separate the wet section and the dry section. The plurality of power semiconductors are each arranged on a proximal side of the electric circuit board facing the partition wall. Each cooling lug is arranged on a cooling lug conductor strip. On a side of the partition wall facing the electric circuit board, the partition wall comprises a heat conductor which is configured to be electrically non-conductive. The heat conductor is arranged to rest directly on a respective cooling lug conductor strip.Type: ApplicationFiled: July 27, 2011Publication date: January 9, 2014Applicant: PIERBURG PUMP TECHNOLOGY GMBHInventors: Witold Joschko, Thomas Joachim Gibat
-
Publication number: 20130242559Abstract: The present invention provides a light-emitting diode (LED) lamp (100, 100a, 100b, 100c). The LED lamp (100, 100a, etc.) comprises a plug (110, 110a, 110b) having two contacts for electrical connections to two respective electric power supply conductors, a fixture (120, 120a, 120b, 120c, 120d) connected to the plug and a plurality of LEDs (11) mounted onto the fixture (120, 120a, etc.), so that heat is conducted directly away from the LEDs (11) through the fixture and plug. When the LED lamp is connected to a lamp holder (20) and electric power is supplied from the power supply conductors, heat generated from operation of the LEDs (11) is conducted away through the fixture, plug and power supply conductors to the ambience.Type: ApplicationFiled: March 14, 2013Publication date: September 19, 2013Inventors: Thomas Joachim Werner MOERSHEIM, Fernando Villon Capinig, Anthony Augusto Malon Galay
-
Publication number: 20130001758Abstract: The present invention provides a power semiconductor package. The power semiconductor package comprises a dual lead frame assembly comprising a bottom lead frame having a first heat sink pad at its bottom surface and a top lead frame having a second heat sink pad at its bottom surface. The top lead frame is coupled to the bottom lead frame by an isolation layer, wherein the isolation layer is a thermal conductive, but electrical isolative, material. The power semiconductor package further comprises a power semiconductor device coupled to the top lead frame of the dual lead frame assembly and an encapsulation member encapsulating the dual lead frame assembly and the power semiconductor device, while exposing the first heat sink pad at the bottom surface of the bottom lead frame.Type: ApplicationFiled: September 10, 2012Publication date: January 3, 2013Applicant: PSI Technologies, Inc.Inventors: Thomas Joachim Werner MOERSHEIM, Fernando Villon CAPINIG, Dandy Navarro JADUCANA, Anthony Augusto Malon GALAY
-
Publication number: 20120161632Abstract: The present invention provides a Scalable Heat Dissipating Microelectronic Integration Platform (SHDMIP) LED Package having excellent heat dissipation and protection to LED, thus extending the lifespan of the LED. The SHDMIP LED package comprises a dual lead frame assembly comprising bottom and top lead frame, protection and driver circuits conductively attached to the bottom lead frame and a LED conductively attached to the top lead frame. The bottom lead frame comprises heat sink pad for heat dissipation purpose. Plurality of SHDMIP LED packages of the present invention can be configured in a matrix or row, forming a SHDMIP LED array for various lighting solutions. A method to manufacture the SHDMIP LED array of the present invention is provided herein.Type: ApplicationFiled: November 4, 2011Publication date: June 28, 2012Applicant: PSI Technologies, Inc.Inventors: Thomas Joachim Werner MORSHEIM, Fernando Villon Capinig, Dandy Navarro Jaducana, Anthony Augusto Malon Galay