Patents by Inventor Thomas Joel Massingill

Thomas Joel Massingill has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Die down semiconductor package
    Patent number: 7489517
    Abstract: A semiconductor package is disclosed for an integrated circuit die (52). The integrated circuit die is electrically connected to the package substrate by either die solder balls (53a), or wirebonds (53b). The package substrate (50), a single sided printed wiring board, has a thick metal core (100), consisting of a base metal, a core capacitor, and one or more thin build up layers.
    Type: Grant
    Filed: April 1, 2005
    Date of Patent: February 10, 2009
    Inventor: Thomas Joel Massingill
  • Semiconductor package with recess for die
    Patent number: 7239024
    Abstract: A semiconductor package is disclosed with a recess (51) for an integrated circuit die (52). The recess is made by bending or deforming all layers of a package substrate, and therefore the recess contains circuitry to connect to the integrated circuit die. The integrated circuit die is electrically connected to the package substrate by either wirebonds (53a), TAB or die solder balls (53b). The package substrate (50), a single sided printed wiring board, has a thick metal core (100) and one or more thin build up layers.
    Type: Grant
    Filed: November 19, 2003
    Date of Patent: July 3, 2007
    Inventor: Thomas Joel Massingill
  • Semiconductor package with recess for die
    Publication number: 20040195699
    Abstract: A semiconductor package is disclosed with a recess (51 ) for an integrated circuit die (52). The recess is made by bending or deforming all layers of a package substrate, and therefore the recess contains circuitry to connect to the integrated circuit die. The integrated circuit die is electrically connected to the package substrate by either wirebonds (53a), TAB or die solder balls (53b). The package substrate (50), a single sided printed wiring board, has a thick metal core (100) and one or more thin build up layers.
    Type: Application
    Filed: November 19, 2003
    Publication date: October 7, 2004
    Inventor: Thomas Joel Massingill