Patents by Inventor Thomas Joseph DeBonis

Thomas Joseph DeBonis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Assembly packaging using induction heating
    Patent number: 7880124
    Abstract: An embodiment of the present invention is a technique to package a device. Heat is localized on a die having bumps on a package substrate using a first induction heater operating at a first frequency. Heat is localized on at least an integrated heat spreader (IHS), a thermal interface material (TIM), an underfill, and a sealant on the die using a second induction heater operating at a second frequency.
    Type: Grant
    Filed: November 13, 2006
    Date of Patent: February 1, 2011
    Assignee: Intel Corporation
    Inventor: Thomas Joseph DeBonis
  • Assembly packaging using induction heating
    Patent number: 7161122
    Abstract: An embodiment of the present invention is a technique to package a device. Heat is localized on a die having bumps on a package substrate using a first induction heater operating at a first frequency. Heat is localized on at least an integrated heat spreader (IHS), a thermal interface material (TIM), an underfill, and a sealant on the die using a second induction heater operating at a second frequency.
    Type: Grant
    Filed: June 24, 2004
    Date of Patent: January 9, 2007
    Assignee: Intel Corporation
    Inventor: Thomas Joseph DeBonis