Abstract: Laminated composite (10) comprising at least one electronic substrate (11) and an arrangement of layers (20, 30) made up of at least a first layer (20) of a first metal and/or a first metal alloy and of a second layer (30) of a second metal and/or a second metal alloy adjacent to this first layer (20), wherein the melting temperatures of the first and second layers are different, and wherein, after a thermal treatment of the arrangement of layers (20, 30), a region with at least one intermetallic phase (40) is formed between the first layer and the second layer, wherein the first layer (20) or the second layer (30) is formed by a reaction solder which consists of a mixture of a basic solder with an AgX, CuX or NiX alloy, wherein the component X of the AgX, CuX or NiX alloy is selected from the group consisting of B, Mg, Al, Si, Ca, Se, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Ge, Y, Zr, Nb, Mo, Ag, In, Sn, Sb, Ba, Hf, Ta, W, Au, Bi, La, Ce, Pr, Nd, Gd, Dy, Sm, Er, Tb, Eu, Ho, Tm, Yb and Lu and wherein the melti

Abstract: An assembly having a substrate and at least one component fastened thereon by sintering using a sintering agent, in particular sintering paste. The sintering agent is situated in a recess of the substrate that accommodates at least some areas of the component. A method for producing an assembly having a substrate and at least one component fastened thereon by sintering using a sintering agent, in particular sintering paste. The sintering agent is brought into a recess of the substrate that accommodates at least some areas of the component.

Abstract: Laminated composite (10) comprising at least one electronic substrate (11) and an arrangement of layers (20, 30) made up of at least a first layer (20) of a first metal and/or a first metal alloy and of a second layer (30) of a second metal and/or a second metal alloy adjacent to this first layer (20), wherein the melting temperatures of the first and second layers are different, and wherein, after a thermal treatment of the arrangement of layers (20, 30), a region with at least one intermetallic phase (40) is formed between the first layer and the second layer, wherein the first layer (20) or the second layer (30) is formed by a reaction solder which consists of a mixture of a basic solder with an AgX, CuX or NiX alloy, wherein the component X of the AgX, CuX or NiX alloy is selected from the group consisting of B, Mg, Al, Si, Ca, Se, Ti, V, Cr, Mn, Fe, Co, Ni, Cu, Zn, Ga, Ge, Y, Zr, Nb, Mo, Ag, In, Sn, Sb, Ba, Hf, Ta, W, Au, Bi, La, Ce, Pr, Nd, Gd, Dy, Sm, Er, Tb, Eu, Ho, Tm, Yb and Lu and wherein the melti

Abstract: The invention relates to a layered composite (10), in particular for connecting electronic components as joining partners, comprising at least one substrate film (11) and a layer assembly (12) applied to the substrate film. The layer assembly comprises at least one sinterable layer (13), which is applied to the substrate film (11) and which contains at least one metal powder, and a solder layer (14) applied to the sinterable layer (13). The invention further relates to a method for forming a layered composite, to a circuit assembly containing a layered composite (10) according to the invention, and to the use of a layered composite (10) in a joining method for electronic components.

Abstract: An assembly having a substrate and at least one component fastened thereon by sintering using a sintering agent, in particular sintering paste. The sintering agent is situated in a recess of the substrate that accommodates at least some areas of the component. A method for producing an assembly having a substrate and at least one component fastened thereon by sintering using a sintering agent, in particular sintering paste. The sintering agent is brought into a recess of the substrate that accommodates at least some areas of the component.

Abstract: An assembly having a substrate and at least one component fastened thereon by sintering using a sintering agent, in particular sintering paste. The sintering agent is situated in a recess of the substrate that accommodates at least some areas of the component. A method for producing an assembly having a substrate and at least one component fastened thereon by sintering using a sintering agent, in particular sintering paste. The sintering agent is brought into a recess of the substrate that accommodates at least some areas of the component.

Abstract: The present invention relates to a starting material for producing a sintered connection. In order to avoid the formation of cracks in the joining partners in the case of fluctuating thermal loading, the starting material comprises second particles 20 in addition to metallic first particles 10, wherein the second particles 20 at least proportionately contain a particle core material which has a coefficient of thermal linear expansion ? at 20° C. which is less than the coefficient of thermal linear expansion ? at 20° C. of the metal or of the metals of the first particles in metallic form, and wherein the D50 value of the second particles 20 is greater than or equal to half the D50 value of the first particles 10 and less than or equal to two times the D50 value of the first particles 10. In addition, the present invention relates to a corresponding sintered connection 100?, to an electronic circuit 70 and also to a process for forming a thermally and/or electrically conductive sintered connection.

Abstract: The present invention relates to a starting material for producing a sintered join. In order to avoid the formation of cracks in the case of fluctuating thermal loading, the starting material comprises second particles 20, in addition to metallic first particles 10, which at least proportionately contain elemental silicon and/or silicon dioxide. In addition, the present invention relates to the use of elemental silicon and/or silicon dioxide for reducing the coefficient of thermal linear expansion ? of a starting material 100 of a sintered join 100? or of a sintered join 100?, in particular in a sintered paste, a sintered powder or a sintered material preform. Furthermore, the present invention relates to sintered joins 100?, to electronic circuits 70 and also to processes for forming a thermally and/or electrically conductive sintered join.

Abstract: An assembly having a substrate and at least one component fastened thereon by sintering using a sintering agent, in particular sintering paste. The sintering agent is situated in a recess of the substrate that accommodates at least some areas of the component. A method for producing an assembly having a substrate and at least one component fastened thereon by sintering using a sintering agent, in particular sintering paste. The sintering agent is brought into a recess of the substrate that accommodates at least some areas of the component.