Patents by Inventor Thomas Kalin

Thomas Kalin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor structure with a plastic housing and separable carrier plate
    Patent number: 7622733
    Abstract: A semiconductor structure includes: a carrier plate; a thermosensitive adhesive coupled to a top surface of the carrier plate, which is removable from the carrier plate at a predetermined, defined temperature at which the thermosensitive adhesive loses its adhesive action; semiconductor chips having active top surfaces and back surfaces, where the active top surfaces include contact surfaces disposed on the thermosensitive adhesive; and a plastic embedding compound on the carrier plate, in which the semiconductor chips are embedded.
    Type: Grant
    Filed: March 12, 2007
    Date of Patent: November 24, 2009
    Assignee: Infineon Technologies AG
    Inventors: Edward Fuergut, Thomas Kalin, Holger Woerner, Carsten Von Koblinski
  • Semiconductor Structure with a Plastic Housing and Separable Carrier Plate
    Publication number: 20070145555
    Abstract: A semiconductor structure includes: a carrier plate; a thermosensitive adhesive coupled to a top surface of the carrier plate, which is removable from the carrier plate at a predetermined, defined temperature at which the thermosensitive adhesive loses its adhesive action; semiconductor chips having active top surfaces and back surfaces, where the active top surfaces include contact surfaces disposed on the thermosensitive adhesive; and a plastic embedding compound on the carrier plate, in which the semiconductor chips are embedded.
    Type: Application
    Filed: March 12, 2007
    Publication date: June 28, 2007
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Edward Fuergut, Thomas Kalin, Holger Woerner, Carsten Von Koblinski
  • Method for producing a semiconductor component with a plastic housing and carrier plate for performing the method
    Patent number: 7202107
    Abstract: A process for producing a semiconductor component having a plastic housing in which at least one semiconductor chip is arranged includes providing a semiconductor wafer having semiconductor chips which are arranged in rows and columns and have active top surfaces and back surfaces, the active top surfaces being provided with contact surfaces. The semiconductor wafer are divided into individual semiconductor chips, which are mounted on a carrier plate that has a thermosensitive adhesive on its top surface, such that the active top surfaces of the individual semiconductor chips are placed onto the top surface of the carrier plate. A common carrier is produced from a plastic embedding compound on the carrier plate, with the semiconductor chips being embedded in the plastic embedding compound. The carrier plate is removed by heating the thermosensitive adhesive to a predetermined, defined temperature at which the thermosensitive adhesive loses its adhesive action.
    Type: Grant
    Filed: January 30, 2006
    Date of Patent: April 10, 2007
    Assignee: Infineon Technologies AG
    Inventors: Edward Fuergut, Thomas Kalin, Holger Woerner, Carsten Von Koblinski
  • Method for producing a semiconductor component with a plastic housing and carrier plate for performing the method
    Publication number: 20060183269
    Abstract: A process for producing a semiconductor component having a plastic housing in which at least one semiconductor chip is arranged includes providing a semiconductor wafer having semiconductor chips which are arranged in rows and columns and have active top surfaces and back surfaces, the active top surfaces being provided with contact surfaces. The semiconductor wafer are divided into individual semiconductor chips, which are mounted on a carrier plate that has a thermosensitive adhesive on its top surface, such that the active top surfaces of the individual semiconductor chips are placed onto the top surface of the carrier plate. A common carrier is produced from a plastic embedding compound on the carrier plate, with the semiconductor chips being embedded in the plastic embedding compound. The carrier plate is removed by heating the thermosensitive adhesive to a predetermined, defined temperature at which the thermosensitive adhesive loses its adhesive action.
    Type: Application
    Filed: January 30, 2006
    Publication date: August 17, 2006
    Inventors: Edward Fuergut, Thomas Kalin, Holger Woerner, Carsten Koblinski