Patents by Inventor Thomas Klahn

Thomas Klahn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5670063
    Abstract: This interface connection through a hole (2) in a high-temperature-resistant and vacuum-proof insulating part (1), particularly of ceramic, glass, or a single crystal, consists of a metallic lead (4, 17) inserted into the hole (2) and having a coefficient of thermal expansion less than that of the insulating part (1), wherein at least one end of the lead, if it is flush with at least one surface of the insulating part, is covered with active brazing material which high-vacuum-seals it to the insulating part, or, if it projects beyond at least one surface of the insulating part, is high-vacuum-sealed to the insulating part by means of ring-shaped active brazing material (5'), since in the liquid phase, the active brazing material moves into the gap between the wall of the hole (2) and the lead (4, 17) due to capillary action.
    Type: Grant
    Filed: February 12, 1996
    Date of Patent: September 23, 1997
    Assignee: Endress + Hauser GmbH + Co.
    Inventors: Frank Hegner, Thomas Klahn
  • Patent number: 5539611
    Abstract: This interface connection through a hole (2) in a high-temperature-resistant and vacuum-proof insulating part (1), particularly of ceramic, glass, or a single crystal, consists of a metallic lead (4, 17) inserted into the hole (2) and having a coefficient of thermal expansion less than that of the insulating part (1), wherein at least one end of the lead, if it is flush with at least one surface of the insulating part, is covered with active brazing material which high-vacuum-seals it to the insulating part, or, if it projects beyond at least one surface of the insulating part, is high-vacuum-sealed to the insulating part by means of ring-shaped active brazing material (5'), since in the liquid phase, the active brazing material moves into the gap between the wall of the hole (2) and the lead (4, 17) due to capillary action.
    Type: Grant
    Filed: November 25, 1992
    Date of Patent: July 23, 1996
    Assignee: Endress u Hauser GmbH u Co.
    Inventors: Frank Hegner, Thomas Klahn
  • Patent number: 5351938
    Abstract: This active brazing serves to braze ceramic parts or single crystals or metal parts or to braze ceramic parts to single crystals or ceramic parts or single crystals to metal parts. In addition to the zirconium-nickel alloy, which is composed of 70 atom % to 85 atom % zirconium and 15 atom % to 30 atom % nickel, it contains titanium. In an apparatus for fabricating a foil (6) from this ternary active-brazing alloy by melt spinning which has a uniform thickness and two surfaces that are as smooth as possible, the alloy, after being melted by high-frequency heating in a cylindrical crucible (1) made completely of a high-temperature-resistant and highly thermally conductive nonmetallic material, particularly of high-density graphite or of boron nitride, is forced through an opening (3) in the bottom of the crucible onto a metal drum (5) of high thermal conductivity rotating at a high circumferential speed, on which the liquid alloy solidifies at a cooling rate on the order of 10.sup.3 to 10.sup.6 .degree. C./s.
    Type: Grant
    Filed: February 11, 1993
    Date of Patent: October 4, 1994
    Assignee: Endress u. Hauser GmbH u. Co.
    Inventors: Frank Hegner, Elke Schmidt, Thomas Klahn, Peter Reimann, Heinz Breitenstein, Stephan Messmer
  • Patent number: 5334344
    Abstract: This active brazing preferably serves to braze (join) ((aluminum-)oxide-)ceramic parts or single crystals or metal parts or to braze (join) ((aluminum-)oxide-)ceramic parts to single crystals or ((aluminum-)oxide-)ceramic parts or single crystals to metal parts. In addition to the zirconium-nickel alloy, which is composed of 70 atom % to 85 atom % zirconium and 15 atom % to 30 atom % nickel, it contains titanium.
    Type: Grant
    Filed: November 12, 1991
    Date of Patent: August 2, 1994
    Assignee: Endress u. Hauser GmbH u. Co.
    Inventors: Frank Hegner, Elke Schmidt, Thomas Klahn, Peter Reimann, Heinz Breitenstein, Stephan Messmer
  • Patent number: 5194697
    Abstract: A mechanically heavily loadable and high-vacuum-tight feedthrough connection through a hole (2) of a high-temperature-resistant and vacuum-proof insulating part (1), particularly of ceramic, glass, or a single crystal, is disclosed which can be produced in a single high-temperature step and is thus inexpensive. It is designed as a terminal lead (4) covered with active solder and soldered into the hole, the terminal lead having a coefficient of thermal expansion less than that of the insulating part (1). The feedthrough connection is preferably used in a capacitive pressure sensor (10) having a diaphragm (11) and a substrate (12) which have spaced-apart, flat inner surfaces which are provided with at least one conductive layer (14, 15) for forming at least one capacitor and are electrically connected to the respective rear side via the feedthrough connection.
    Type: Grant
    Filed: March 20, 1990
    Date of Patent: March 16, 1993
    Assignee: Endress u. Hauser GmbH u. Co.
    Inventors: Frank Hegner, Thomas Klahn
  • Patent number: 5050034
    Abstract: The substrate (12) and/or the diaphragm (11) of the pressure sensor (10) are made of ceramic, glass, or a single-crystal material. The side of the diaphragm (11) facing the substrate (12) is covered with a layer of silicon carbide, niobium, or tantalum which, in turn, is covered with a protective layer (21) and serves as one capacitor electrode (14). The side of the substrate (12) facing the diaphragm (11) is covered with at least one additional layer of any one of said materials which, in turn, is covered with an additional protective layer (22) and serves as the second capacitor electrode (15). Substrate (12) and diaphragm (11) are soldered together by a formed part of active solder (20) which also serves as a spacer.This pressure sensor can be manufactured in a single soldering step. The maximum load capacity of the diaphragm is determined not by the strength of the joint, but only by the strength of the diaphragm material.
    Type: Grant
    Filed: August 21, 1990
    Date of Patent: September 17, 1991
    Assignee: Endress u. Hauser GmbH u. Co.
    Inventors: Frank Hegner, Manfred Frank, Thomas Klahn
  • Patent number: 5005421
    Abstract: The pressure sensor comprises a base body and diaphragm which are assembled at a defined distance apart parallel to each other to form a chamber, at least one of the two assembled parts consisting of ceramic, glass, metal or a monocrystalline material. In dependence upon the external pressure acting on the pressure sensor the distance between said parts and thus the capacitance between two electrodes carried by said parts changes. The base body and the diaphragm are firmly connected together by a shaped part of metal serving at the same time as spacer. If at least one of the two parts consists of ceramic, glass, metal or a monocrystalline material, the two joined parts can be soldered together by a shaped part of active solder. If the two assembled parts consist of oxide ceramic or sapphire they can be connected together by the direct copper bonding method. In this case the shaped part consists of copper which is connected to the two parts by a eutectic melt forming at the surface.
    Type: Grant
    Filed: July 18, 1989
    Date of Patent: April 9, 1991
    Assignee: Endress u. Hauser GmbH u. Co.
    Inventors: Frank Hegner, Gerhard Dittrich, Thomas Klahn
  • Patent number: 5001595
    Abstract: The capacitive pressure sensor (10) has two disks (11, 12) of alumina which are joined together around the periphery in a defined spaced relationship and parallel to each other, forming a chamber (14). At least one of the two disks (11) is designed as an elastic diaphragm. A pure nickel coating (16, 18) is applied to the surface of each disk by electroless deposition from an aqueous solution, and on the surfaces of the two disks facing each other, capacitor electrodes (17, 20, 21) are formed by patterning the nickel coating. The capacitor electrodes are connected to an electronic circuit disposed outside the chamber (14) by additional nickel coatings which are formed in plated-through holes (30, 31, 32) simultaneously with the deposition of the pure nickel coating.
    Type: Grant
    Filed: March 23, 1990
    Date of Patent: March 19, 1991
    Inventors: Gerhard Dittrich, Frank Hegner, Thomas Klahn