Abstract: A pressure sensor system including at least one pressure sensor unit, the pressure sensor unit being configured with at least one sensor element which is situated in a cavity of a support structure, signal processing elements being integrated into support structure, the at least one sensor element being embeddable into the support structure to form the pressure sensor unit, and the support structure being formed by a land grid array/mold premold structure (LGA/MPM). The pressure sensor unit is introduced into a sensor housing to be provided with a diaphragm and is supported therein, a residual volume of the sensor housing, which is provided with at least one diaphragm and to the wiring of which the pressure sensor unit is electrically connected, being filled with an incompressible fluid. Also described is a method for manufacturing such a pressure sensor system and a measuring device.

Abstract: A pressure sensor system including at least one pressure sensor unit configured as a system-in-package, the pressure sensor unit encompassing a supporting structure including a cavity and a sensor element situated in the cavity; the supporting structure being formed by a land grid array/mold premold structure (LGA/MPM) and signal-processing elements being integrated into and/or on the supporting structure; the pressure sensor unit being introduced into a pressure sensor housing provided with a diaphragm and being supported therein, and a residual volume of the pressure sensor housing provided with at least one diaphragm being filled with an incompressible fluid; and the pressure sensor housing including a groove extending around the pressure sensor unit, in which a sealing ring is situatable.

Abstract: A pressure sensor system including at least one pressure sensor unit, the pressure sensor unit being configured with at least one sensor element which is situated in a cavity of a support structure, signal processing elements being integrated into support structure, the at least one sensor element being embeddable into the support structure to form the pressure sensor unit, and the support structure being formed by a land grid array/mold premold structure (LGA/MPM). The pressure sensor unit is introduced into a sensor housing to be provided with a diaphragm and is supported therein, a residual volume of the sensor housing, which is provided with at least one diaphragm and to the wiring of which the pressure sensor unit is electrically connected, being filled with an incompressible fluid. Also described is a method for manufacturing such a pressure sensor system and a measuring device.

Abstract: A pressure sensor system including at least one pressure sensor unit configured as a system-in-package, the pressure sensor unit encompassing a supporting structure including a cavity and a sensor element situated in the cavity; the supporting structure being formed by a land grid array/mold premold structure (LGA/MPM) and signal-processing elements being integrated into and/or on the supporting structure; the pressure sensor unit being introduced into a pressure sensor housing provided with a diaphragm and being supported therein, and a residual volume of the pressure sensor housing provided with at least one diaphragm being filled with an incompressible fluid; and the pressure sensor housing including a groove extending around the pressure sensor unit, in which a sealing ring is situatable.

Abstract: A sensor device includes a housing base part, a bearer part, a chip structure situated on the bearer part, and a spring/damper combination via which the housing base part and the bearer part are elastically connected to one another. In the sensor device, the housing base part, the spring/damper combination and the bearer part are situated one over the other.

Abstract: The present invention relates to a packaging material, preferably for foodstuffs, for example ice cream in wafers and the like, at least comprising a packaging sheet with an inner side which in a packaged condition, in accordance with requirements, faces towards the packaged goods and with an outer side facing away from the packaged goods, wherein on the outer side of the packaging sheet a composition comprising a colourant and a binder is provided, wherein at least one agent of colourant and binder is a foodstuff or is an agent permitted to come into contact with foodstuffs.

Abstract: A housing for an electrical circuit, in particular for a sensor, pins projecting from the housing for the electrical contacting of the circuit, additional pins being provided which are not connected electrically to the circuit but instead are used as mechanical arrangement for fastening the housing to a printed circuit board in particular. The present invention further relates to a housing having an electrical circuit, in particular a sensor, pins projecting from the housing for the electrical contacting of the circuit, at least two pins being connected to one another mechanically via a connecting piece.

Abstract: A device includes a first semiconductor chip and a second semiconductor chip which are connected to each other in an electrically conductive manner via a bonding wire, the bonding wire having a contact to the first semiconductor chip at a first contact point and having a contact to the second semiconductor chip at a second contact point, and the device including a further bonding wire which has a further first contact point and a further second contact point, a maximum distance between the bonding wire and a direct connecting line between the first and second contact points perpendicular to the connecting line being greater than a further maximum distance between the further bonding wire and a further connecting line between the further first contact point and the further second contact point perpendicular to the further connecting line.

Abstract: Multi-layer packaging material, especially laminate, preferably for food, hygiene products and electronic products, having at least one metal barrier—especially aluminum—layer and at least one paper layer, and also roll material. The paper layer is laser-marked with predetermined intensity at least portion-wise through its entire cross-section, and optionally the metal layer on its surface side.

Abstract: The invention relates to a packaging, in particular a foodstuffs packaging, preferably for foodstuffs such as ice cream in cones and the like. The packaging (10) comprises a lid portion (14) and a packaging body (12), wherein the packaging body (12) is conical, in particular pointed conical, and wherein the lid portion (14) is held on the packaging body (12) when the packaging is closed.

Abstract: A sensor device includes a housing base part, a bearer part, a chip structure situated on the bearer part, and a spring/damper combination via which the housing base part and the bearer part are elastically connected to one another. In the sensor device, the housing base part, the spring/damper combination and the bearer part are situated one over the other.