Patents by Inventor Thomas Knieling

Thomas Knieling has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MICRO-ELECTROMECHANICAL SYSTEMS (MEMS) DEVICE AND NOISE CANCELLATION METHOD
    Publication number: 20230365401
    Abstract: There is provided a micro-electromechanical system (MEMS) device (102, 200, 300, 404) for cancelling noise generated by oscillation of a movable micro-electromechanical system (MEMS) element (104, 204, 304, 406). The micro-electromechanical system (MEMS) device (102, 200, 300, 404) includes the movable micro-electromechanical system (MEMS) element (104, 204, 304, 406), an actuator (106, 208, 306, 408), a controller (108, 410) and a movable noise cancelling element (110, 202, 312, 412). The controller (108, 410) provides electrical signals to drive the actuator (106, 208, 306, 408) and the movable noise cancelling element (110, 202, 312, 412) in a way to cancel the noise generated in the micro-electromechanical system (MEMS) device (102, 200, 300, 404) by oscillation of the movable MEMS element (104, 204, 304, 406).
    Type: Application
    Filed: May 12, 2023
    Publication date: November 16, 2023
    Inventors: Ulrich HOFMANN, Thomas Von WANTOCH, Christian JANICKE, Leon POHL, Stephan MARAUSKA, Thomas KNIELING, Frank SENGER, Joerg ALBERS
  • MICROMECHANICAL RESONATOR WAFER ASSEMBLY AND METHOD OF FABRICATION THEREOF
    Publication number: 20230359019
    Abstract: A micromechanical resonator wafer assembly includes an actuator wafer supporting an outer actuator layer. The outer actuator layer includes an oscillating part configured to be driven by an electrical drive signal. The micromechanical resonator wafer assembly further includes a device wafer mounted on top of the actuator wafer. The device wafer includes a plurality of inner actuators. Each of the inner actuators include an oscillation body configured to oscillate about one or more axes. The device wafer is physically connected to the actuator wafer such that each of the inner actuators forms with the outer actuator layer a coupled oscillation system for excitation of the oscillation body of the respective inner actuator. The micromechanical resonator wafer assembly provides external actuation of the oscillation body of each of the inner actuators by use of the outer actuator layer and hence, provides improved scan angles with fast start-up time.
    Type: Application
    Filed: May 12, 2023
    Publication date: November 9, 2023
    Inventors: Thomas Knieling, Ulrich Hofmann, Stephan Marauska, Berkan Zorlubas, Fabian Schwarz, Frank Senger, Yong Cao
  • Micromechanical device with temperature stabilization and method for adjusting a defined temperature or a defined temperature course on a micromechanical device
    Patent number: 8842356
    Abstract: A micromechanical device includes a micromechanical functional structure and an electromagnetic radiation heating associated with the micromechanical functional structure, which is formed to cause a spatially and temporally defined temperature or a spatially and temporally defined temperature course in the micromechanical functional structure.
    Type: Grant
    Filed: February 29, 2012
    Date of Patent: September 23, 2014
    Assignee: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
    Inventors: Thilo Sandner, Harald Schenk, Joerg Heber, Thomas Klose, Andreas Bergmann, Christian Gerwig, Thomas Knieling
  • MICROMECHANICAL DEVICE WITH TEMPERATURE STABILIZATION AND METHOD FOR ADJUSTING A DEFINED TEMPERATURE OR A DEFINED TEMPERATURE COURSE ON A MICROMECHANICAL DEVICE
    Publication number: 20120188625
    Abstract: A micromechanical device includes a micromechanical functional structure and an electromagnetic radiation heating associated with the micromechanical functional structure, which is formed to cause a spatially and temporally defined temperature or a spatially and temporally defined temperature course in the micromechanical functional structure.
    Type: Application
    Filed: February 29, 2012
    Publication date: July 26, 2012
    Applicant: Fraunhofer-Gesellschaft zur Foerderung der angewandten Forschung e.V.
    Inventors: Thilo Sandner, Harald Schenk, Joerg Heber, Thomas Klose, Andreas Bergmann, Christian Gerwig, Thomas Knieling
  • Micromechanical device with temperature stabilization and method for adjusting a defined temperature or a defined temperature course on a micromechanical device
    Patent number: 8147136
    Abstract: A micromechanical device includes a micromechanical functional structure and an electromagnetic radiation heating associated with the micromechanical functional structure, which is formed to cause a spatially and temporally defined temperature or a spatially and temporally defined temperature course in the micromechanical functional structure.
    Type: Grant
    Filed: March 31, 2008
    Date of Patent: April 3, 2012
    Assignee: Fraunhofer-Gesellschaft zur Foerderung der Angewandten Forschung e.V.
    Inventors: Jörg Heber, Thomas Klose, Thilo Sandner, Andreas Bergmann, Christian Gerwig, Thomas Knieling
  • MICROMECHANICAL DEVICE WITH TEMPERATURE STABILIZATION AND METHOD FOR ADJUSTING A DEFINED TEMPERATURE OR A DEFINED TEMPERATURE COURSE ON A MICROMECHANICAL DEVICE
    Publication number: 20080240202
    Abstract: A micromechanical device includes a micromechanical functional structure and an electromagnetic radiation heating associated with the micromechanical functional structure, which is formed to cause a spatially and temporally defined temperature or a spatially and temporally defined temperature course in the micromechanical functional structure.
    Type: Application
    Filed: March 31, 2008
    Publication date: October 2, 2008
    Applicant: Fraunhofer-Gesellschaft Zur Forderung der angewandten Forschung e.V.
    Inventors: Jorg HEBER, Thomas KLOSE, Thilo SANDNER, Andreas BERGMANN, Christian GERWIG, Thomas KNIELING