Patents by Inventor Thomas Krah

Thomas Krah has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bonded wafer metrology
    Patent number: 10540759
    Abstract: Wafer edge profile images are analyzed at locations around a bonded wafer, which may have a top wafer and a carrier wafer. An offset curve is generated based on the wafer edge profile images. Displacement of the top wafer to the carrier wafer is determined based on the offset curve. The wafer edge profile images may be generated at multiple locations around the wafer. The wafer edge profile images may be shadowgram images. A system to determine displacement of the top wafer to the carrier wafer can include an imaging system connected with a controller.
    Type: Grant
    Filed: June 20, 2017
    Date of Patent: January 21, 2020
    Assignee: KLA-Tencor Corporation
    Inventors: Kaushik Sah, Thomas Krah, Shifang Li, Heiko Eisenbach, Moritz Stoerring
  • Bonded Wafer Metrology
    Publication number: 20180150952
    Abstract: Wafer edge profile images are analyzed at locations around a bonded wafer, which may have a top wafer and a carrier wafer. An offset curve is generated based on the wafer edge profile images. Displacement of the top wafer to the carrier wafer is determined based on the offset curve. The wafer edge profile images may be generated at multiple locations around the wafer. The wafer edge profile images may be shadowgram images. A system to determine displacement of the top wafer to the carrier wafer can include an imaging system connected with a controller.
    Type: Application
    Filed: June 20, 2017
    Publication date: May 31, 2018
    Inventors: Kaushik Sah, Thomas Krah, Shifang Li, Heiko Eisenbach, Moritz Stoerring