Abstract: In various embodiments a solar cell may include a solar cell wafer substrate made of silicon having a major share of mono crystalline structure with {111} crystal plane parallel to one wafer edge; a dielectric layer disposed over the backside of solar cell wafer substrate; a plurality of contact openings extending through the dielectric layer to the solar cell wafer substrate; a plurality of metal contacts formed in the plurality of contact openings; and a metal layer disposed over the dielectric layer; wherein the metal layer is electrically coupled to the solar cell wafer substrate by means of the plurality of metal contacts; wherein at least one contact opening of the plurality of contact openings extends non parallel to {111} crystal plane.

Abstract: In various embodiments a solar cell may include a solar cell wafer substrate made of silicon having a major share of mono crystalline structure with {111} crystal plane parallel to one wafer edge; a dielectric layer disposed over the backside of solar cell wafer substrate; a plurality of contact openings extending through the dielectric layer to the solar cell wafer substrate; a plurality of metal contacts formed in the plurality of contact openings; and a metal layer disposed over the dielectric layer; wherein the metal layer is electrically coupled to the solar cell wafer substrate by means of the plurality of metal contacts; wherein at least one contact opening of the plurality of contact openings extends non parallel to {111} crystal plane.