Patents by Inventor Thomas Kristl

Thomas Kristl has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Dielectric layer for component carrier with varying material properties
    Patent number: 11882648
    Abstract: A dielectric layer for manufacturing a component carrier is described. The dielectric layer includes a first section including a first material having a first material property; and a second section including a second material having a second material property. The second material property is different from the first material property. A method for manufacturing such a component carrier and a component carrier including such a dielectric layer is further described.
    Type: Grant
    Filed: March 26, 2021
    Date of Patent: January 23, 2024
    Assignee: AT&SAustria Technologie & Systemtechnik AG
    Inventors: Thomas Kristl, Dominik Wilding
  • Direct Resin Embedding
    Publication number: 20230300992
    Abstract: A method of manufacturing a component carrier includes providing a core structure with at least one electrically insulating layer structure with a through hole, closing the through hole by a resin layer, and attaching a component in the through hole to the resin layer. The component is fixed to the core structure by curing the resin layer.
    Type: Application
    Filed: March 14, 2023
    Publication date: September 21, 2023
    Inventors: Ewald Moitzi, Friedrich Beller, Thomas Kristl
  • Component carrier and method of manufacturing the same
    Patent number: 11412622
    Abstract: A component carrier includes a stack having an electrically conductive layer structure, with at least one recess, on an electrically insulating layer structure; a dielectric filling medium filling at least part of the at least one recess; and a further electrically insulating layer structure on the electrically conductive layer structure and on the dielectric filling medium. A method of manufacturing a component carrier includes forming a stack having an electrically conductive layer structure, with at least one recess, on an electrically insulating layer structure; at least partially filling the at least one recess by a dielectric filling medium; and thereafter forming a further electrically insulating layer structure on the electrically conductive layer structure and on the dielectric filling medium.
    Type: Grant
    Filed: March 3, 2020
    Date of Patent: August 9, 2022
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Thomas Kristl, Ewald Moitzi
  • Component carrier with integrated antenna structure
    Patent number: 11264708
    Abstract: An electronic assembly and a method for fabricating the same are disclosed. The assembly includes a component carrier, a wireless communication component and an antenna structure. The component carrier has at least one dielectric layer and a metallic layer. The wireless communication component is attached to the component carrier. The antenna structure is formed from a metallic material and is electrically connected with the wireless communication component. An opening formed in the component carrier extends from an upper surface into the interior of the component carrier. The antenna structure is formed at least partially at a wall of the opening.
    Type: Grant
    Filed: January 26, 2016
    Date of Patent: March 1, 2022
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventors: Thomas Kristl, Martin Reiter, Johannes Stahr, Markus Leitgeb, Gernot Grober, Erich Schlaffer
  • Dielectric Layer for Component Carrier With Varying Material Properties
    Publication number: 20210315093
    Abstract: A dielectric layer for manufacturing a component carrier is described. The dielectric layer includes a first section including a first material having a first material property; and a second section including a second material having a second material property. The second material property is different from the first material property. A method for manufacturing such a component carrier and a component carrier including such a dielectric layer is further described.
    Type: Application
    Filed: March 26, 2021
    Publication date: October 7, 2021
    Inventors: Thomas Kristl, Dominik Wilding
  • Component Carrier and Method of Manufacturing the Same
    Publication number: 20200296842
    Abstract: A component carrier includes a stack having an electrically conductive layer structure, with at least one recess, on an electrically insulating layer structure; a dielectric filling medium filling at least part of the at least one recess; and a further electrically insulating layer structure on the electrically conductive layer structure and on the dielectric filling medium. A method of manufacturing a component carrier includes forming a stack having an electrically conductive layer structure, with at least one recess, on an electrically insulating layer structure; at least partially filling the at least one recess by a dielectric filling medium; and thereafter forming a further electrically insulating layer structure on the electrically conductive layer structure and on the dielectric filling medium.
    Type: Application
    Filed: March 3, 2020
    Publication date: September 17, 2020
    Inventors: Thomas Kristl, Ewald Moitzi
  • Component Carrier With Integrated Antenna Structure
    Publication number: 20180277943
    Abstract: An electronic assembly and a method for fabricating the same are disclosed. The assembly includes a component carrier, a wireless communication component and an antenna structure. The component carrier has at least one dielectric layer and a metallic layer. The wireless communication component is attached to the component carrier. The antenna structure is formed from a metallic material and is electrically connected with the wireless communication component. An opening formed in the component carrier extends from an upper surface into the interior of the component carrier. The antenna structure is formed at least partially at a wall of the opening.
    Type: Application
    Filed: January 26, 2016
    Publication date: September 27, 2018
    Inventors: Thomas Kristl, Martin Reiter, Johannes Stahr, Markus Leitgeb, Gernot Glober, Erich Schlaffer