Abstract: A component carrier and a method for manufacturing a component carrier are described. The component carrier has a carrier body with a plurality of electrically conductive layer structures and/or electrically insulating layer structures. At least a part of the component carrier is formed as a three-dimensionally printed structure.

Abstract: A component carrier for carrying an electronic component on and/or in the component carrier, wherein the component carrier includes an interconnected stack composed of a plurality of electrically conductive layer structures and a plurality of electrically insulating layer structures, wherein at least part of at least one of the electrically conductive layer structures is configured as at least part of an integrated strain gauge configured for detecting strain exerted on at least part of the component carrier.

Abstract: An auxiliary structure for embedding a component in a component carrier is disclosed. The auxiliary structure has a solid state transition piece for at least partially, in particular substantially fully circumferentially, enclosing the component, wherein the solid-state transition piece consists of a material being or becoming adhesive in a liquid state and being liquefiable by heat and/or pressure so as to fill a gap between the component and surrounding component carrier material by applying heat and/or pressure.

Abstract: A method for contacting and rewiring an electronic component embedded in a PCB in the following manner is disclosed. A first permanent resist layer is applied to one contact side of the PCB. The first permanent resist layer is structured to produce exposures in the area of contacts of the electronic component. A second permanent resist layer is applied onto the structured first permanent resist layer. The second permanent resist layer is structured to expose the exposures in the area of the contacts and to produce exposures in line with the desired conductor tracks. The exposures are chemically coated with copper the copper is electric-plated to the exposures. Excess copper in the areas between the exposures is removed.

Abstract: A system and method for manufacturing a substrate having a bed of hooks located therein, in particular a system or manufacturing a hook plate having hooks with enlarged shaped heads. The system can include the use of a heated generally flat coining plate, a resilient layer placed under the hook plate, and a forming sheet placed between the coining plate and the tops of stems to be coined.

Abstract: A method and an injection mold for the production of profiled and at least partially elongated components out of liquid or viscous solidifying molding compounds, by said injection mold, the molding compound being injected into the mold cavity and transported away under steady extension of the mold cavity and under steady elongation of the component to be formed after the initial filling of the mold cavity. The molding compound transported away is transported out of the mold while molding compound is continuously being injected until the forming component reaches its final length. The mold has at least one mold insert whose surface is part of the peripheral surface of the mold cavity and which is supported in the mold in a movable way in longitudinal direction of the component to be formed so that the mold cavity forming the component can be expanded to the desired size and shape of the component inside and outside of the mold by a movement of the mold insert.

Abstract: The invention relates to an injection molding installation with a fixed and a moveable machine clamping plate, and at least one injection unit as well as an injection molding device which is located between the machine clamping plates for producing profiled parts, elongated at least in sections, by means of closure-side components which are assigned to the one machine clamping plate, and nozzle-side components which are assigned to the other machine clamping plate, as well as a slide module which is located between these components and which has a slide which is arranged in a moveable manner on a closure-side or nozzle-side component, wherein said slide contributes to form an original mould cavity, and a drive module for controlling the movement of the moveable part(s) of the slide module, wherein the part is produced in the intended dimension and shape inside and outside the mold via the movement of the slide.

Abstract: A method for the production of elongated profiles or ledges (21) out of solidifying compounds in a mold with at least one lower part and at least one upper part, the molding compound (20) being continuously injected into the mold cavity (4), with the injected molding compound (20) being transported away from the gating point(s) and out of the mold under steady extension of the mold cavity (4) and under steady elongation of the forming profile or ledge (21) by relative movement of mold components and wherein molding compound (20) is injected until the profile or ledge (21) reaches its designated length.

Abstract: The invention relates to an injection molding installation with a fixed and a moveable machine clamping plate, and at least one injection unit as well as an injection-molding device which is located between the machine clamping plates for producing profiled parts, elongated at least in sections, by means of closure-side components which are assigned to the one machine clamping plate, and nozzle-side components which are assigned to the other machine clamping plate, as well as a slide module which is located between these components and which has a slide which is arranged in a moveable manner on a closure-side or nozzle-side component, wherein said slide contributes to form an original mould cavity, and a drive module for controlling the movement of the moveable part(s) of the slide module, wherein the part is produced in the intended dimension and shape inside and outside the mold via the movement of the slide.

Abstract: A method and an injection mold for the production of profiled and at least partially elongated components out of liquid or viscous solidifying molding compounds, by said injection mold, the molding compound being injected into the mold cavity and transported away under steady extension of the mold cavity and under steady elongation of the component to be formed after the initial filling of the mold cavity. The molding compound transported away is transported out of the mold while molding compound is continuously being injected until the forming component reaches its final length. The mold has at least one mold insert whose surface is part of the peripheral surface of the mold cavity and which is supported in the mold in a movable way in longitudinal direction of the component to be formed so that the mold cavity forming the component can be expanded to the desired size and shape of the component inside and outside of the mold by a movement of the mold insert.

Abstract: A system and method for manufacturing a substrate having a bed of hooks located therein, in particular a system or manufacturing a hook plate having hooks with enlarged shaped heads. The system can include the use of a heated generally flat coining plate, a resilient layer placed under the hook plate, and a forming sheet placed between the coining plate and the tops of stems to be coined.