Abstract: Embodiments of a modular tubular bioreactor system for culturing an aqueous culture of microorganisms are described herein. The tubular bioreactor may comprise culture tubes configured in a vertically spaced and horizontally staggered arrangement to optimize the application of light to the culture in phototrophic and mixotrophic cultivation.

Abstract: Embodiments of a modular tubular bioreactor system for culturing an aqueous culture of microorganisms are described herein. The tubular bioreactor may comprise culture tubes configured in a vertically spaced and horizontally staggered arrangement to optimize the application of light to the culture in phototrophic and mixotrophic cultivation.

Abstract: Embodiments of a modular tubular bioreactor system for culturing an aqueous culture of microorganisms are described herein. The tubular bioreactor may comprise culture tubes configured in a vertically spaced and horizontally staggered arrangement to optimize the application of light to the culture in phototrophic and mixotrophic cultivation.

Abstract: Embodiments of a modular tubular bioreactor system for culturing an aqueous culture of microorganisms are described herein. The tubular bioreactor may comprise culture tubes configured in a vertically spaced and horizontally staggered arrangement to optimize the application of light to the culture in phototrophic and mixotrophic cultivation.

Abstract: A submersible high illumination light source assembly is disclosed, comprising at least one module. A module comprises a heat sink having a front surface and a rear surface. A printed circuit board comprising one or more electrical connections sized and shaped to couple with a plurality of high-illumination light emitting diode (LED) lamps is in thermal communication with the front surface of the heat sink. The plurality of high-illumination LED lamps are coupled in electronic communication with the printed circuit board via the one or more electrical connections. At least one reflector is sized and shaped to accept the insertion of one or more of the plurality of high-illumination LED lamps. A window is in watertight communication with the reflector plate. The submersible high illumination light source assembly operates both when submerged underwater and exposed to air.

Abstract: A submersible high illumination light source assembly is disclosed, comprising at least one module. A module comprises a heat sink having a front surface and a rear surface. A printed circuit board comprising one or more electrical connections sized and shaped to couple with a plurality of high-illumination light emitting diode (LED) lamps is in thermal communication with the front surface of the heat sink. The plurality of high-illumination LED lamps are coupled in electronic communication with the printed circuit board via the one or more electrical connections. At least one reflector is sized and shaped to accept the insertion of one or more of the plurality of high-illumination LED lamps. A window is in watertight communication with the reflector plate. The submersible high illumination light source assembly operates both when submerged underwater and exposed to air.

Abstract: An LED light engine comprising a high thermal conductivity substrate (e.g., a metal-clad PCB), a plurality of light-emitting-diode (LED) semiconductor devices mechanically connected to the substrate, an outer dike fixed to the substrate and surrounding at least a portion of the LED devices, and a substantially transparent polymeric encapsulant (e.g., optical-grade silicone) disposed on the plurality of LED devices and restrained by said outer dike. In one embodiment, the light engine includes a reflector (e.g., a generally conic reflector) fixed to the substrate to form the outer dike. In another embodiment, an optical component (e.g., a lens, filter, or the like) is optically coupled to the polymeric encapsulant disposed on the LED devices.

Abstract: An LED light engine comprising a high thermal conductivity substrate (e.g., a metal-clad PCB), a plurality of light-emitting-diode (LED) semiconductor devices mechanically connected to the substrate, an outer dike fixed to the substrate and surrounding at least a portion of the LED devices, and a substantially transparent polymeric encapsulant (e.g., optical-grade silicone) disposed on the plurality of LED devices and restrained by said outer dike. In one embodiment, the light engine includes a reflector (e.g., a generally conic reflector) fixed to the substrate to form the outer dike. In another embodiment, an optical component (e.g., a lens, filter, or the like) is optically coupled to the polymeric encapsulant disposed on the LED devices.

Abstract: An LED lighting device for use in place of a commercial-standard light bulb. For example, a commercial-standard light bulb typically has an outer surface profile, generally defining its shape and the LED lighting device has its own surface profile which substantially mimics the surface profile of the commercial-standard light bulb. Additionally, LED lighting device may further comprise a heat sink for dissipating energy generated by the LED lighting device. In accordance with various embodiments, the heat sink creates the LED lighting device's outer surface profile and is configured to substantially mimic the outer surface profile of the commercial-standard light bulb.

Abstract: An LED light engine having a high thermal conductivity substrate (e.g., a metal-clad PCB), a plurality of light-emitting-diode (LED) semiconductor devices mechanically connected to the substrate, an outer dike fixed to the substrate and surrounding at least a portion of the LED devices, and a substantially transparent polymeric encapsulant (e.g., optical-grade silicone) disposed on the plurality of LED devices and restrained by said outer dike. In one embodiment, the light engine includes a reflector (e.g., a generally conic reflector) fixed to the substrate to form the outer dike. In another embodiment, an optical component (e.g., a lens, filter, or the like) is optically coupled to the polymeric encapsulant disposed on the LED devices.

Abstract: An LED light engine comprising a high thermal conductivity substrate (e.g., a metal-clad PCB), a plurality of light-emitting-diode (LED) semiconductor devices mechanically connected to the substrate, an outer dike fixed to the substrate and surrounding at least a portion of the LED devices, and a substantially transparent polymeric encapsulant (e.g., optical-grade silicone) disposed on the plurality of LED devices and restrained by said outer dike. In one embodiment, the light engine includes a reflector (e.g., a generally conic reflector) fixed to the substrate to form the outer dike. In another embodiment, an optical component (e.g., a lens, filter, or the like) is optically coupled to the polymeric encapsulant disposed on the LED devices.

Abstract: An LED lighting device for use in place of a commercial-standard light bulb. For example, a commercial-standard light bulb typically has an outer surface profile, generally defining its shape and the LED lighting device has its own surface profile which substantially mimics the surface profile of the commercial-standard light bulb. Additionally, LED lighting device may further comprise a heat sink for dissipating energy generated by the LED lighting device. In accordance with various embodiments, the heat sink creates the LED lighting device's outer surface profile and is configured to substantially mimic the outer surface profile of the commercial-standard light bulb.