Abstract: A novel multi-layer flexible printed circuit for tape automated bonding (TAB) is assembled from three components during the process of TAB bonding the circuit to a semiconductor device for burn in and testing prior to assembly into a system comprising a plurality of tested TAB circuit bonded devices. The first layer comprises a conductive signal plane layer mounted on top of a flexible dielectric layer. The second layer comprises a dielectric spacer layer mounted on top of the conductive signal plane layer. The third layer comprises a conductive ground plane layer mounted on the bottom of a dielectric layer. The conductive ground plane layer is mounted on top of the dielectric spacer layer. Before testing, the inner leads of the composite multi-layer circuit are bonded to the electrode pads of a semiconductor device to be tested. After testing the outer portions of the TAB circuit are cut away leaving the outer leads exposed.

Abstract: A printed circuit lead frame is provided as a carrier for integrated circuits. The conventional frame comprises a foil pattern that is provided with a plurality of fragile delicate lead fingers which are often bent and displaced laterally or vertically before they can be connected to the terminal pads of a semiconductor chip. The present invention provides a removable stabilizing connecting frame which is made from the same conductive foil as the lead fingers and is provided with tear links which innerconnect the removable frame and each of the lead fingers so that the stabilizing frame may be removed after the lead fingers are bonded to the terminal pads of the semiconductor chip.

Abstract: An apparatus for bonding the flexible leads of a sprocketed lead frame tape to the terminals of an integrated circuit device is provided with a movable index station, movable bonding anvil means and a vertically moving bonding tool. The flexible leads on the lead frame tape are automatically positioned by the indexing station relative to the bonding tool with extreme final accuracy. The device to be bonded to the flexible leads may be manually or automatically positioned relative to said bonding tool to align the bonding tool, the flexible leads and the integrated circuit device terminals in axial bonding alignment.