Abstract: An optoelectronics packaging assembly is provided having a ceramic base on which is connected an optoelectronics device. The optoelectronic device is maintained in an enclosure formed by a housing, the base and/or other structures. The packaging assembly includes means for placing the base and the optoelectronics device in electrical communication with an external component, for example, a printed circuit board. The means include solder balls, J-shaped leads, bent leads, and electrical pads.

Abstract: A residue-free fluxing process wherein the active fluxing agent comprises a .beta.-diketone or .beta.-ketoimine ligand. Such ligands react with surface metal oxides on workpieces to be soldered to form volatile metal-ligand complexes as reaction products which are sublimed from the surface leaving essentially no residue on the workpieces. The fluxing agents can be utilized in gas-phase processes wherein the workpieces are contacted with an effective amount of one or more ligands which are dispersed in a carrier gas or solvent or by incorporating the ligands into an alloy-vehicle mixture for use as conventional creams or pastes. The invention eliminates the need for post-reflow cleaning using solvents since no flux residue remains on the workpieces to be soldered following volitilization of the metal-ligand complex.

Abstract: A residue-free fluxing process wherein the active fluxing agent comprises a .beta.-diketone or .beta.-ketoimine ligand. Such ligands react with surface metal oxides on workpieces to be soldered to form volatile metal-ligand complexes as reaction products which are sublimed from the surface leaving essentially no residue on the workpieces. The fluxing agents can be utilized in gas-phase processes wherein the workpieces are contacted with an effective amount of one or more ligands which are dispersed in a carrier gas or solvent or by incorporating the ligands into an alloy-vehicle mixture for use as conventional creams or pastes. The invention eliminates the need for post-reflow cleaning using solvents since no flux residue remains on the workpieces to be soldered following volatilization of the metal-ligand complex.

Abstract: A process for limiting the absorption of nitrogen by ferrous metal containing chromium as an alloying additive (e.g. stainless steel) during high temperature annealing in an atmosphere of nitrogen and hydrogen by controlled additions of an inhibitor selected from the group consisting of water vapor, oxygen, nitrous oxide, carbon dioxide or mixtures thereof to the atmosphere while controlling the dew point of the furnace atmosphere and/or the ratio of the partial pressure of the inhibitor to the partial pressure of the hydrogen.