Patents by Inventor Thomas L. Herrington

Thomas L. Herrington has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5183784
    Abstract: An improved silver-glass paste for bonding a semiconductive element to a substrate comprising a metal resinate. A surfactant containing lyophilic and lyophobic groups may also be included.
    Type: Grant
    Filed: September 17, 1991
    Date of Patent: February 2, 1993
    Assignee: Johnson Matthey Inc.
    Inventors: My N. Nguyen, Chee-Kong Lee, Thomas L. Herrington
  • Patent number: 5164119
    Abstract: An improved silver-glass paste for bonding a silicon die to a ceramic substrate consisting essentially of silver flake, glass, resin, surfactant containing lyophilic and lyophobic groups and solvent. The surfactant provides a steric barrier around the silver and glass to stabilize the paste and reduce voiding and cracking when the paste is used to bond the die to the substrate.
    Type: Grant
    Filed: October 29, 1990
    Date of Patent: November 17, 1992
    Assignee: Johnson Matthey Inc.
    Inventors: My N. Nguyen, Julie H. Wood, Thomas L. Herrington
  • Patent number: 5084421
    Abstract: An improved sliver-glass paste for bonding a semiconductive element to a substrate comprising silver flake, glass frit, a surfactant, a thixotrope and a low boiling paraffinic hydrocarbon solvent.
    Type: Grant
    Filed: July 27, 1990
    Date of Patent: January 28, 1992
    Assignee: Johnson Matthey, Inc.
    Inventor: Thomas L. Herrington
  • Patent number: 4986849
    Abstract: An improved silver-glass paste for bonding a silicon die to a ceramic substrate consisting essentially of silver flake, lead borate glass, resin, surfactant containing lyophilic and lyophobic groups and solvent. The surfactant provides a steric barrier around the silver and glass to stabilize the paste and reduce voiding and cracking when the paste is used to bond the die to the substrate.
    Type: Grant
    Filed: September 23, 1988
    Date of Patent: January 22, 1991
    Assignee: Johnson Matthey Inc.
    Inventors: My N. Nguyen, Julie H. Wood, Thomas L. Herrington