Patents by Inventor Thomas Lacave
Thomas Lacave has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230307486Abstract: A method for manufacturing an optoelectronic device includes providing a support supporting a plurality of three-dimensional semiconductor structures, forming a sacrificial portion under a first set of 3D structures of the plurality of three-dimensional semiconductor structures, forming a barrier portion around the sacrificial portion, said barrier portion having a basal wall extending under the sacrificial portion, and a lateral wall extending at the edge of the sacrificial portion, forming an access trench up to the sacrificial portion, the access trench extending continuously along the lateral wall of the barrier portion, etching the sacrificial portion from the access trench, and removing the first set of 3D structures.Type: ApplicationFiled: August 10, 2021Publication date: September 28, 2023Inventors: Xavier HUGON, Eric POURQUIER, Frédéric MAYER, Thomas LACAVE, Philippe GIBERT, Mickae?l REBAUD, Emmanuel PETITPREZ
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Patent number: 11605759Abstract: An optoelectronic device including a substrate having opposite first and second surfaces; insulation trenches extending through the substrate, surrounding portions of the substrate and electrically insulating the portions from each other, each insulation trench being filled with at least one electrically insulating block and a gaseous volume or being filled with an electrically conductive element electrically isolated from the substrate; at least one light-emitting diode resting on the first surface for each portion of the substrate, the light-emitting diodes comprising wired, conical, or frustoconical semiconductor elements; an electrode layer covering at least one of the light-emitting diodes and a conductive layer overlying the electrode layer around the light-emitting diodes; and a layer encapsulating the light-emitting diodes and covering the entire first surface.Type: GrantFiled: June 18, 2019Date of Patent: March 14, 2023Assignees: Aledia, Commissariat à l'Énergie Atomique et aux Énergies AlternativesInventors: Vincent Beix, Thomas Lacave, Marion Volpert, Olivier Girard, Denis Renaud, Brigitte Soulier
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Patent number: 11398579Abstract: A method for producing optoelectronic devices, including the following successive steps: providing a substrate having a first face; on the first face, forming sets of light-emitting diodes including wire-like, conical or frustoconical semiconductor elements; covering all of the first face with a layer encapsulating the light-emitting diodes; forming a conductive element that is insulated from the substrate and extends through the substrate from the second face to at least the first face; reducing the thickness of the substrate; and cutting the resulting structure in order to separate each set of light-emitting diodes.Type: GrantFiled: June 19, 2018Date of Patent: July 26, 2022Assignees: Commissariat à l'Énergie Atomique et aux Énergies Alternatives, AlediaInventors: Christophe Bouvier, Emilie Pougeoise, Xavier Hugon, Carlo Cagli, Tiphaine Dupont, Philippe Gibert, Nacer Aitmani, Vincent Beix, Thomas Lacave, Marion Volpert, Olivier Girard, Denis Renaud, Brigitte Soulier
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Publication number: 20210257514Abstract: An optoelectronic device including a substrate having opposite first and second surfaces; insulation trenches extending through the substrate, surrounding portions of the substrate and electrically insulating the portions from each other, each insulation trench being filled with at least one electrically insulating block and a gaseous volume or being filled with an electrically conductive element electrically isolated from the substrate; at least one light-emitting diode resting on the first surface for each portion of the substrate, the light-emitting diodes comprising wired, conical, or frustoconical semiconductor elements; an electrode layer covering at least one of the light-emitting diodes and a conductive layer overlying the electrode layer around the light-emitting diodes; and a layer encapsulating the light-emitting diodes and covering the entire first surface.Type: ApplicationFiled: June 18, 2019Publication date: August 19, 2021Applicants: Aledia, Commissariat à I'Énergie Atomique et aux Énergies AlternativesInventors: Vincent Beix, Thomas Lacave, Marion Volpert, Olivier Girard, Denis Renaud, Brigitte Soulier
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Patent number: 11088300Abstract: An optoelectronic device including: a support; blocks of a semiconductor material, resting on the support and each including a first surface on the side opposite to the support and lateral walls; a nucleation layer on each first surface; a first insulating layer covering each nucleation layer and including an opening exposing a portion of the nucleation layer; a semiconductor element resting on each first insulating layer and in contact with the nucleation layer covered with the first insulating layer in the opening; a shell covering each semiconductor element and including an active layer capable of emitting or absorbing an electromagnetic radiation; and a first conductive layer, reflecting the radiation, extending between the semiconductor elements and extending over at least a portion of the lateral walls of the blocks.Type: GrantFiled: June 19, 2018Date of Patent: August 10, 2021Assignee: AlediaInventors: Philippe Gibert, Philippe Gilet, Ewen Henaff, Thomas Lacave
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Patent number: 10886427Abstract: An optoelectronic device including a support having a rear surface and a front surface opposite each other, a plurality of nucleation conductive strips forming first polarization electrodes, an intermediate insulating layer covering the nucleation conductive strips, a plurality of diodes, each of which having a first, three-dimensional doped region and a second doped region, and a plurality of top conductive strips forming second polarization electrodes and resting on the intermediate insulating layer, each top conductive strip being disposed in such a way as to be in contact with the second doped regions of a set of diodes of which the first doped regions are in contact with different nucleation conductive strips.Type: GrantFiled: June 26, 2017Date of Patent: January 5, 2021Assignees: ALEDIA, COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVESInventors: Florian Dupont, Benoit Amstatt, Vincent Beix, Thomas Lacave, Philippe Gilet, Ewen Henaff, Berangere Hyot, Hubert Bono
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Publication number: 20200119231Abstract: An optoelectronic device including: a support; blocks of a semiconductor material, resting on the support and each including a first surface on the side opposite to the support and lateral walls; a nucleation layer on each first surface; a first insulating layer covering each nucleation layer and including an opening exposing a portion of the nucleation layer; a semiconductor element resting on each first insulating layer and in contact with the nucleation layer covered with the first insulating layer in the opening; a shell covering each semiconductor element and including an active layer capable of emitting or absorbing an electromagnetic radiation; and a first conductive layer, reflecting the radiation, extending between the semiconductor elements and extending over at least a portion of the lateral walls of the blocks.Type: ApplicationFiled: June 19, 2018Publication date: April 16, 2020Applicant: AlediaInventors: Philippe Gibert, Philippe Gilet, Ewen Henaff, Thomas Lacave
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Patent number: 10593588Abstract: An electronic circuit including a semiconducting or conducting substrate having first and second opposite surfaces and at least first and second non-parallel electrically insulating trenches that extend from the first surface in the substrate, define at least one portion of the substrate and join at a junction, the portion of the substrate including a protrusion that extends to the junction.Type: GrantFiled: December 21, 2016Date of Patent: March 17, 2020Assignees: Aledia, Commissariat à l'Énergie Atomique et aux Énergies AlternativesInventors: Fabienne Goutaudier, Thomas Lacave, Vincent Beix, Stephan Borel, Bertrand Chambion, Brigitte Soulier
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Publication number: 20190333802Abstract: An electronic device including a semiconductor substrate having first and second opposite surfaces and including an electrical insulation trench extending in the substrate from the first surface to the second surface, the electrical insulation trench including lateral walls, an electrically-insulating layer covering the lateral walls, and a core made of a filling material separated from the substrate by the insulating layer and including an electrically-insulating portion extending in the substrate from the first surface and covering the core.Type: ApplicationFiled: December 6, 2017Publication date: October 31, 2019Applicant: AlediaInventors: Thomas Lacave, Philippe Gilet
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Publication number: 20190172970Abstract: An optoelectronic device including a support having a rear surface and a front surface opposite each other, a plurality of nucleation conductive strips forming first polarization electrodes, an intermediate insulating layer covering the nucleation conductive strips, a plurality of diodes, each of which having a first, three-dimensional doped region and a second doped region, and a plurality of top conductive strips forming second polarization electrodes and resting on the intermediate insulating layer, each top conductive strip being disposed in such a way as to be in contact with the second doped regions of a set of diodes of which the first doped regions are in contact with different nucleation conductive strips.Type: ApplicationFiled: June 26, 2017Publication date: June 6, 2019Applicants: ALEDIA, COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVESInventors: Florian DUPONT, Benoit AMSTATT, Vincent BEIX, Thomas LACAVE, Philippe GILET, Ewen HENAFF, Berangere HYOT, Hubert BONO
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Publication number: 20180366365Abstract: An electronic circuit including a semiconducting or conducting substrate having first and second opposite surfaces and at least first and second non-parallel electrically insulating trenches that extend from the first surface in the substrate, define at least one portion of the substrate and join at a junction, the portion of the substrate including a protrusion that extends to the junction.Type: ApplicationFiled: December 21, 2016Publication date: December 20, 2018Applicants: Aledia, Commissariat à l'Énergie Atomique et aux Énergies AlternativesInventors: Fabienne Goutaudier, Thomas Lacave, Vincent Beix, Stephan Borel, Bertrand Chambion, Brigitte Soulier
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Publication number: 20180301594Abstract: A method for producing optoelectronic devices, including the following successive steps: providing a substrate having a first face; on the first face, forming sets of light-emitting diodes including wire-like, conical or frustoconical semiconductor elements; covering all of the first face with a layer encapsulating the light-emitting diodes; forming a conductive element that is insulated from the substrate and extends through the substrate from the second face to at least the first face; reducing the thickness of the substrate; and cutting the resulting structure in order to separate each set of light-emitting diodes.Type: ApplicationFiled: June 19, 2018Publication date: October 18, 2018Applicants: Commissariat à l'Énergie Atomique et aux Énergies Alternatives, AlediaInventors: Christophe Bouvier, Emilie Pougeoise, Xavier Hugon, Carolo Cagli, Tiphaine Dupont, Philippe Gibert, Nacer Aitmani, Vincent Beix, Thomas Lacave, Marion Volpert, Olivier Girard, Denis Renaud, Brigitte Soulier
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Patent number: 10026870Abstract: An optoelectronic device including a substrate having a surface, openings which extend in the substrate from the surface, and semiconductor elements, each semiconductor element partially extending into one of the openings and partially outside said opening, the height of each opening being at least 25 nm and at most 5 ?m and the ratio of the height to the smallest diameter of each opening being at least 0.5 and at most 15.Type: GrantFiled: June 22, 2015Date of Patent: July 17, 2018Assignee: AlediaInventors: Nathalie Dechoux, Thomas Lacave, Benoît Amstatt, Philippe Gibert
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Publication number: 20170148950Abstract: An optoelectronic device including a substrate having a surface, openings which extend in the substrate from the surface, and semiconductor elements, each semiconductor element partially extending into one of the openings and partially outside said opening, the height of each opening being at least 25 nm and at most 5 ?m and the ratio of the height to the smallest diameter of each opening being at least 0.5 and at most 15.Type: ApplicationFiled: June 22, 2015Publication date: May 25, 2017Applicant: AlediaInventors: Nathalie Dechoux, Thomas Lacave, Benoît Amstatt, Philippe Gibert