Abstract: A printed-circuit board and a method for the precise assembly of electronic components on a surface of the printed-circuit board, the electronic components being electrically and conductively attached to printed-circuit board by a reflow soldering technique. For this purpose, a printed-circuit board is used that has sections for receiving electronic components on its surface. The sections being at least partially adapted to the outside contour of respective electronic components. The sections are configured as slotted contours or grooves and shaped to secure that the electronic components mounted after the application of solder paste are held in their desired positions prior to the actual soldering process. In addition, the assembled printed-circuit board can be connected to a housing composed of dome-type extensions of an at least partly deformable material. The extensions engage in cutouts provided in the printed-circuit board and pass through the latter.