Patents by Inventor Thomas LAMPERSBERGER

Thomas LAMPERSBERGER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Radio-frequency device with radio-frequency chip and waveguide structure
    Patent number: 11482771
    Abstract: A radio-frequency device comprises a semiconductor package, which comprises a radio-frequency chip and a radio-frequency antenna. The semiconductor package is designed to be mechanically and electrically connected to a circuit board via at least one connecting element of the semiconductor package, with one surface of the semiconductor package facing the circuit board. The radio-frequency device also comprises a waveguide structure oriented in a direction parallel to the surface of the semiconductor package, the radio-frequency antenna being designed for at least one of the following: to emit radiation into the waveguide structure in the direction parallel to the surface of the semiconductor package, or to receive signals via the waveguide structure in the direction parallel to the surface of the semiconductor package.
    Type: Grant
    Filed: January 12, 2021
    Date of Patent: October 25, 2022
    Assignee: Infineon Technologies AG
    Inventors: Thomas Lampersberger, Reinhard Feger, Markus Josef Lang, Juergen Minichshofer, Ernst Seler, Andreas Stelzer
  • RADIO-FREQUENCY DEVICE WITH RADIO-FREQUENCY CHIP AND WAVEGUIDE STRUCTURE
    Publication number: 20210218127
    Abstract: A radio-frequency device comprises a semiconductor package, which comprises a radio-frequency chip and a radio-frequency antenna. The semiconductor package is designed to be mechanically and electrically connected to a circuit board via at least one connecting element of the semiconductor package, with one surface of the semiconductor package facing the circuit board. The radio-frequency device also comprises a waveguide structure oriented in a direction parallel to the surface of the semiconductor package, the radio-frequency antenna being designed for at least one of the following: to emit radiation into the waveguide structure in the direction parallel to the surface of the semiconductor package, or to receive signals via the waveguide structure in the direction parallel to the surface of the semiconductor package.
    Type: Application
    Filed: January 12, 2021
    Publication date: July 15, 2021
    Inventors: Thomas LAMPERSBERGER, Reinhard FEGER, Markus Josef LANG, Juergen MINICHSHOFER, Ernst SELER, Andreas STELZER