Abstract: A method of securing a terminal to a ceramic heater is provided by the present disclosure. The ceramic heater includes a ceramic substrate and a resistive heating element, and the method includes exposing a portion of the resistive heating element, forming an intermediate layer on at least one of the portion of the resistive heating element and the ceramic substrate proximate the portion of the resistive heating element, the intermediate layer being selected from a group consisting of Mo/AlN and W/AlN, and bonding the terminal to the intermediate layer.

Abstract: A ceramic heater is provided that includes a power terminal for connecting a resistive heating element to a power source. An intermediate layer is disposed on an AlN ceramic substrate proximate the resistive heating element. The power terminal is bonded to the intermediate layer by an active brazing material. The intermediate layer is formed of Mo/AlN or W/AlN and has a coefficient of thermal expansion between that of the active brazing material and that of the AlN ceramic substrate so that thermal stress generated in the ceramic substrate can be reduced.

Abstract: An improved heating system for heating a semiconductor wafer during fabrication in a corrosive manufacturing environment is disclosed. The system includes a novel ceramic heater made of a layered ceramic substrate that has a plurality of heating elements and temperature sensor arrangement completely and directly embedded within the ceramic substrate of the ceramic heater. The heating elements and the temperature sensor arrangement are constructed of a molybdenum and aluminum nitride composite that provides a low temperature coefficient of resistance which improves the operating efficiency of the ceramic heater. In operation, the temperature sensor arrangement transmits temperature readings to a microprocessor capable of controlling the heating elements in such a manner as to provide a constant and uniform temperature distribution along the entire surface of the semiconductor wafer.

Abstract: Thick film resistive element heater with an aluminum substrate having a ceramic oxide dielectric insulator there between.