Abstract: Embodiments of a microelectronic assembly comprise: a plurality of microelectronic sub-assemblies arranged in an array; and a plurality of photonic integrated circuit (PIC) dies, each PIC die having waveguides. Adjacent microelectronic sub-assemblies are coupled to one of the PIC dies by interconnects such that any one PIC die is coupled to more than two adjacent microelectronic sub-assemblies, and the microelectronic sub-assemblies coupled to each PIC die in the plurality of PIC dies are communicatively coupled by the waveguides in the PIC die. Each microelectronic sub-assembly comprises: an interposer integrated circuit (IC) die comprising one or more electrical controller circuit proximate to at least one edge of the interposer IC die; a first plurality of IC dies coupled to a first surface of the interposer IC die; and a second plurality of IC dies coupled to an opposing second surface of the interposer IC die.

Abstract: A system enables optical communication with direct conversion of the electrical signal into an optical signal with an array of optical sources. The use of the array of optical sources can eliminate the need for a large serializer/deserializer (SERDES). With an array of optical sources, the optical communication can occur at lower power and lower frequency per optical source, with multiple parallel optical sources combining to provide a signal.

Abstract: Embodiments may relate to a microelectronic package that includes a package substrate with an active bridge positioned therein. An active die may be coupled with the package substrate, and communicatively coupled with the active bridge. A photonic integrated circuit (PIC) may also be coupled with the package substrate and communicatively coupled with the active bridge. Other embodiments may be described or claimed.

Abstract: Embodiments disclosed herein include electronic packages for optical to electrical switching. In an embodiment, an electronic package comprises a first package substrate and a second package substrate attached to the first package substrate. In an embodiment, a die is attached to the second package substrate. In an embodiment, a plurality of photonic engines are attached to a first surface and a second surface of the first package substrate. In an embodiment, the plurality of photonic engines are communicatively coupled to the die through the first package substrate and the second package substrate.

Abstract: The disclosure relates to a tunable 50 GHz and 100 GHz channel spacing DWDM transceiver, and methods of making and using the same. The transceiver comprises an electro-absorption modulation laser (EML), a system board configured to compare a preset wavelength with an actual emission wavelength of the EML, a microcontroller and one or more associated registers configured to communicate with the system board, a temperature controlling circuit configured to stabilize the actual emission wavelength of the EML; and a wavelength meter connected to the output of the EML and having an output connected to the system board. The system board may be configured to provide a feedback loop from the EML to the microcontroller. The transceiver, suitable for 50 GHz channel spacing standards, can be made from existing standard transceivers and can switch between 50 GHz and 100 GHz channel spacing modes.

Abstract: The present disclosure relates to an optical transceiver for use in optical fiber communications and/or telecommunications systems and, more specifically, a low power consumption, long range pluggable transceiver. The transceiver generally comprises a photodiode with a transimpedance amplifier (PIN-TIA); an electro-absorption modulated laser (EML); an optical detector; and a directly modulated laser (DML) driving module connected between the PIN-TIA and EML laser configured to drive the EML laser. A low power-consumption DML driving module is utilized to drive the EML laser, so as to further reduce power consumption. An impedance matching circuit can be applied to modulate an electro-absorption (EA) modulator of the EML laser with maximum efficiency.

Abstract: The present disclosure relates to an optical transceiver for use in optical fiber communications and/or telecommunications systems and, more specifically, a low power consumption, long range pluggable transceiver. The transceiver generally comprises a photodiode with a transimpedance amplifier (PIN-TIA); an electro-absorption modulated laser (EML); an optical detector; and a directly modulated laser (DML) driving module connected between the PIN-TIA and EML laser configured to drive the EML laser. A low power-consumption DML driving module is utilized to drive the EML laser, so as to further reduce power consumption. An impedance matching circuit can be applied to modulate an electro-absorption (EA) modulator of the EML laser with maximum efficiency.

Abstract: The disclosure relates to a tunable 50 GHz and 100 GHz channel spacing DWDM transceiver, and methods of making and using the same. The transceiver comprises an electro-absorption modulation laser (EML), a system board configured to compare a preset wavelength with an actual emission wavelength of the EML, a microcontroller and one or more associated registers configured to communicate with the system board, a temperature controlling circuit configured to stabilize the actual emission wavelength of the EML; and a wavelength meter connected to the output of the EML and having an output connected to the system board. The system board may be configured to provide a feedback loop from the EML to the microcontroller. The transceiver, suitable for 50 GHz channel spacing standards, can be made from existing standard transceivers and can switch between 50 GHz and 100 GHz channel spacing modes.