Abstract: A structure with controlled capillary coverage is provided and includes a substrate including one or more first contacts, a component and adhesive. The component includes one or more second contacts and a rib disposed at a distance from each of the one or more second contacts. The component is disposed such that the one or more second contacts are communicative with the one or more first contacts and corresponding surfaces of the substrate and the rib face each other at a controlled gap height to define a fill-space. The adhesive is dispensed at a discrete point whereby the adhesive is drawn to fill the fill-space by capillary action.

Abstract: A structure with controlled capillary coverage is provided and includes a substrate including one or more first contacts, a component and adhesive. The component includes one or more second contacts and a rib disposed at a distance from each of the one or more second contacts. The component is disposed such that the one or more second contacts are communicative with the one or more first contacts and corresponding surfaces of the substrate and the rib face each other at a controlled gap height to define a fill-space. The adhesive is dispensed at a discrete point whereby the adhesive is drawn to fill the fill-space by capillary action.

Abstract: A system and method comprises depositing a dielectric layer on a substrate and depositing a metal layer on the dielectric layer. The system and method further includes depositing a high temperature diffusion barrier metal cap on the metal layer. The system and method further includes depositing a second dielectric layer on the high temperature diffusion barrier metal cap and the first dielectric layer, and etching a via into the second dielectric layer, such that the high temperature diffusion barrier metal cap is exposed. The system and method further includes depositing an under bump metallurgy in the via, and forming a C4 ball on the under bump metallurgy layer.

Abstract: Methods to reduce or eliminate the bleed out of underfill material. Surface treatments to selective areas on a chip carrier substrate surface create a non-wettable surface or a reduced wettability surface in the areas where the underfill should not flow. The substrate surface is subjected to surface treatments such as media blasting or chemical exposure which will roughen the exposed surface.

Abstract: In general, the present invention provides a low cost mechanism for reducing the settling time and/or improving the phase noise performance of a frequency synthesizer in a mobile station. In one embodiment, the present invention eliminates the need for using two transmit offset synthesizers in a mobile station which must be able to operate on two different frequency bands characterized by different transmit-receive (TX-RX) channel separation. According to the present invention, one or both of the transmit offset synthesizers may be eliminated by deriving an appropriate transmit offset signal from an auxiliary synthesizer in the mobile station through a relatively simple and inexpensive frequency scaling circuit (e.g., frequency divider or multiplier), and by using a fast settling main channel synthesizer to hop between two different frequencies when the mobile station is switching between transmitting and receiving, respectively.

Abstract: A dual band transceiver for operating in a first lower frequency band such as the band allocated to cellular systems, and in a second higher frequency band such as the band allocated to personal communication services (PCS) systems. In a representative embodiment, the dual band transceiver comprises a main voltage controlled oscillator (VCO) for generating a local oscillator (LO) signal; an offset VCO for generating an offset frequency (OF) signal; a first mixer for combining the LO signal with the OF signal to produce a first transmit signal; a modulator for modulating the first transmit signal with the data signal to produce a first data modulated transmit signal; and a second mixer for combining the first data modulated transmit signal with the LO signal to produce a second data modulated signal. The main VCO and the offset VCO can be programmed such that the first data modulated transmit signal is in the first band and the second data modulated transmit signal is in the second band.